Abstract: According to an exemplary embodiment, a bondwireless power module includes a common output pad coupling an emitter/anode node of a high side device to a collector/cathode node of a low side device. The bondwireless power module also includes a high side conductive clip connecting a collector of the high side device to a cathode of the high side device, and causing current to traverse through the high side conductive clip to another high side conductive clip in another power module. The bondwireless power module further includes a low side conductive clip connecting an emitter of the low side device to an anode of the low side device, and causing current to traverse through the low side conductive clip to another low side conductive clip in the another power module. The bondwireless power module can be a motor drive inverter module.

Abstract: According to an exemplary embodiment, a bondwireless power module includes a common output pad coupling an emitter/anode node of a high side device to a collector/cathode node of a low side device. The bondwireless power module also includes a high side conductive clip connecting a collector of the high side device to a cathode of the high side device, and causing current to traverse through the high side conductive clip to another high side conductive clip in another power module. The bondwireless power module further includes a low side conductive clip connecting an emitter of the low side device to an anode of the low side device, and causing current to traverse through the low side conductive clip to another low side conductive clip in the another power module. The bondwireless power module can be a motor drive inverter module.

Abstract: According to an exemplary embodiment, a bondwireless power module includes a common output pad coupling an emitter/anode node of a high side device to a collector/cathode node of a low side device. The bondwireless power module also includes a high side conductive clip connecting a collector of the high side device to a cathode of the high side device, and causing current to traverse through the high side conductive clip to another high side conductive clip in another power module. The bondwireless power module further includes a low side conductive clip connecting an emitter of the low side device to an anode of the low side device, and causing current to traverse through the low side conductive clip to another low side conductive clip in the another power module. The bondwireless power module can be a motor drive inverter module.

Abstract: A method for averting damage that may be caused by a transient energy surge during a load dump event, the method including detecting the load dump event and in response causing the consumption of transient excess energy due to the load dump event.

Abstract: A method for averting damage that may be caused by a transient energy surge during a load dump event, the method including detecting the load dump event and in response causing the consumption of transient excess energy due to the load dump event.

Abstract: In an articulated machine, comprising a front assembly with front drive wheels independent of each other, and a rear assembly with rear drive wheels independent of each other, coupled to the front assembly with an articulation about an essentially vertical axis, the aforesaid front and rear wheels are driven by four corresponding electric motors which are independent of each other. It is therefore possible to drive the wheels in such a way that they transmit to the ground forces differing in modulus and/or orientation and/or direction of rotation, in order to obtain a desired steering angle between the front assembly and the rear assembly. Thus the hydraulic cylinders conventionally used to produce the steering of the articulated machine are eliminated, together with the hydraulic circuit associated with them.