Patents by Inventor Andrea Henricus Van Eck

Andrea Henricus Van Eck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device and method of manufacturing same
    Publication number: 20060099742
    Abstract: The electronic device (100) is a chip-on-chip construction on a lead frame (10) comprising a heat sink (13) in an encapsulation (80). The first chip (20) and the second chip (30) are mutually connected by first conductive interconnections (24) and the first chip (20) is connected to the lead frame (10) by second conductive interconnections (27) which preferably have a lower reflow temperature than the first conductive interconnections (24). By heating the device (100) the adhesive layer (25) will first shrink, causing a stress, which will be relaxated by reflowing the second conductive interconnections (27).
    Type: Application
    Filed: December 10, 2003
    Publication date: May 11, 2006
    Applicant: Koninklijke Philips Electronics N.V.
    Inventors: Hendrik Hochstenbach, Andrea Henricus Van Eck, Rintje Van Der Meulen