Patents by Inventor Andrea Nicola Colecchia
Andrea Nicola Colecchia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230112999Abstract: A microfluidic device for continuous ejection of fluids includes: a semiconductor body that laterally delimits chambers; an intermediate structure which forms membranes each delimiting a top of a corresponding chamber; and a nozzle body which overlies the intermediate structure. The device includes, for each chamber: a corresponding piezoelectric actuator; a supply channel which traverses the intermediate structure and communicates with the chamber; and a nozzle which traverses the nozzle body and communicates with the supply channel. Each actuator is configured to operate i) in a resting condition such that the pressure of a fluid within the corresponding chamber causes the fluid to pass through the supply channel and become ejected from the nozzle as a continuous stream, and ii) in an active condition, where it causes a deformation of the corresponding membrane and a consequent variation of the pressure of the fluid, causing a temporary interruption of the continuous stream.Type: ApplicationFiled: December 12, 2022Publication date: April 13, 2023Applicant: STMICROELECTRONICS S.r.l.Inventors: Domenico GIUSTI, Andrea Nicola COLECCHIA, Gaetano SANTORUVO
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Patent number: 11541653Abstract: A microfluidic device for continuous ejection of fluids includes: a semiconductor body that laterally delimits chambers; an intermediate structure which forms membranes each delimiting a top of a corresponding chamber; and a nozzle body which overlies the intermediate structure. The device includes, for each chamber: a corresponding piezoelectric actuator; a supply channel which traverses the intermediate structure and communicates with the chamber; and a nozzle which traverses the nozzle body and communicates with the supply channel. Each actuator is configured to operate i) in a resting condition such that the pressure of a fluid within the corresponding chamber causes the fluid to pass through the supply channel and become ejected from the nozzle as a continuous stream, and ii) in an active condition, where it causes a deformation of the corresponding membrane and a consequent variation of the pressure of the fluid, causing a temporary interruption of the continuous stream.Type: GrantFiled: May 22, 2020Date of Patent: January 3, 2023Assignee: STMICROELECTRONICS S.r.l.Inventors: Domenico Giusti, Andrea Nicola Colecchia, Gaetano Santoruvo
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Publication number: 20210346906Abstract: A microfluidic device provided in a body accommodating a fluid containment chamber. A fluidic access channel and a drop emission channel are formed in the body and are in fluidic connection with the fluid containment chamber to form a fluidic path towards the body outside through a nozzle having an outlet section. An actuator is operatively coupled to the fluid containment chamber and is configured to cause ejection of fluid drops through the drop emission channel in an operating condition of the microfluidic device. The drop emission channel comprises a portion of reduced section having a smaller area than the outlet section of the nozzle.Type: ApplicationFiled: July 20, 2021Publication date: November 11, 2021Applicant: STMICROELECTRONICS S.R.L.Inventors: Domenico GIUSTI, Andrea Nicola COLECCHIA, Claudio CRIPPA
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Patent number: 11117156Abstract: A microfluidic device provided in a body accommodating a fluid containment chamber. A fluidic access channel and a drop emission channel are formed in the body and are in fluidic connection with the fluid containment chamber to form a fluidic path towards the body outside through a nozzle having an outlet section. An actuator is operatively coupled to the fluid containment chamber and is configured to cause ejection of fluid drops through the drop emission channel in an operating condition of the microfluidic device. The drop emission channel comprises a portion of reduced section having a smaller area than the outlet section of the nozzle.Type: GrantFiled: May 22, 2017Date of Patent: September 14, 2021Assignee: STMICROELECTRONICS S.R.L.Inventors: Domenico Giusti, Andrea Nicola Colecchia, Claudio Crippa
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Publication number: 20200369023Abstract: A microfluidic device for continuous ejection of fluids includes: a semiconductor body that laterally delimits chambers; an intermediate structure which forms membranes each delimiting a top of a corresponding chamber; and a nozzle body which overlies the intermediate structure. The device includes, for each chamber: a corresponding piezoelectric actuator; a supply channel which traverses the intermediate structure and communicates with the chamber; and a nozzle which traverses the nozzle body and communicates with the supply channel. Each actuator is configured to operate i) in a resting condition such that the pressure of a fluid within the corresponding chamber causes the fluid to pass through the supply channel and become ejected from the nozzle as a continuous stream, and ii) in an active condition, where it causes a deformation of the corresponding membrane and a consequent variation of the pressure of the fluid, causing a temporary interruption of the continuous stream.Type: ApplicationFiled: May 22, 2020Publication date: November 26, 2020Inventors: Domenico GIUSTI, Andrea Nicola COLECCHIA, Gaetano SANTORUVO
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Patent number: 10501313Abstract: The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.Type: GrantFiled: March 8, 2018Date of Patent: December 10, 2019Assignees: STMicroelectronics Asia Pacific Pte Ltd, STMicroelectronics S.r.l., STMicroelectronics, Inc.Inventors: Teck Khim Neo, Mauro Pasetti, Franco Consiglieri, Luca Molinari, Andrea Nicola Colecchia, Simon Dodd
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Publication number: 20180194614Abstract: The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.Type: ApplicationFiled: March 8, 2018Publication date: July 12, 2018Inventors: Teck Khim Neo, Mauro Pasetti, Franco Consiglieri, Luca Molinari, Andrea Nicola Colecchia, Simon Dodd
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Publication number: 20180141074Abstract: A microfluidic device provided in a body accommodating a fluid containment chamber. A fluidic access channel and a drop emission channel are formed in the body and are in fluidic connection with the fluid containment chamber to form a fluidic path towards the body outside through a nozzle having an outlet section. An actuator is operatively coupled to the fluid containment chamber and is configured to cause ejection of fluid drops through the drop emission channel in an operating condition of the microfluidic device. The drop emission channel comprises a portion of reduced section having a smaller area than the outlet section of the nozzle.Type: ApplicationFiled: May 22, 2017Publication date: May 24, 2018Inventors: Domenico GIUSTI, Andrea Nicola COLECCHIA, Claudio CRIPPA
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Patent number: 9938136Abstract: The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.Type: GrantFiled: August 18, 2016Date of Patent: April 10, 2018Assignees: STMICROELECTRONICS ASIA PACIFIC PTE LTD, STMICROELECTRONICS S.R.L., STMICROELECTRONICS, INC.Inventors: Teck Khim Neo, Mauro Pasetti, Franco Consiglieri, Luca Molinari, Andrea Nicola Colecchia, Simon Dodd
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Publication number: 20180050901Abstract: The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.Type: ApplicationFiled: August 18, 2016Publication date: February 22, 2018Inventors: Teck Khim Neo, Mauro Pasetti, Franco Consiglieri, Luca Molinari, Andrea Nicola Colecchia, Simon Dodd
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Patent number: 9873250Abstract: Embodiments of the present disclosure are directed to a microfluidic delivery system that includes a microfluidic semiconductor die coupled to a flexible interconnect substrate to form an assembly. At least one embodiment is directed to a semiconductor die having an active surface that includes a layout that has electrically active bond pads along one side of the active surface of the die. A second side of the active surface of the die includes one or more mechanical pads.Type: GrantFiled: September 8, 2016Date of Patent: January 23, 2018Assignees: STMICROELECTRONICS, INC., STMICROELECTRONICS S.R.L.Inventors: Simon Dodd, Andrea Nicola Colecchia
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Publication number: 20170259568Abstract: Embodiments of the present disclosure are directed to a microfluidic delivery system that includes a microfluidic semiconductor die coupled to a flexible interconnect substrate to form an assembly. At least one embodiment is directed to a semiconductor die having an active surface that includes a layout that has electrically active bond pads along one side of the active surface of the die. A second side of the active surface of the die includes one or more mechanical pads.Type: ApplicationFiled: September 8, 2016Publication date: September 14, 2017Inventors: Simon Dodd, Andrea Nicola Colecchia