Patents by Inventor Andrea Peratello

Andrea Peratello has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for automated quality control in wafer slicing
    Patent number: 5632666
    Abstract: An internal diameter saw, and in particular a method for operation which facilitates the maintenance of quality control of semiconductor wafers sliced from an ingot of source material. The internal diameter saw has a controller which monitors the deflection of the cutting edge of the blade at a location within the ingot as a wafer is sliced. Depending upon the deflection of the blade which is detected within the crystal, a blade dressing device is automatically activated to sharpen the blade following the cut.
    Type: Grant
    Filed: October 28, 1994
    Date of Patent: May 27, 1997
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Andrea Peratello, Fabrizio Leoni