Patents by Inventor Andrea Suriani

Andrea Suriani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microwave antenna module for space applications including a hybrid transmit/receive module of package on package type
    Patent number: 10665952
    Abstract: The invention concerns a microwave antenna module for use in an antenna system installed on board a space platform. The disclosed microwave antenna module includes a transmit/receive module, which comprises: a first package and a second package, that are hermetically sealed to one another and that are multilayer ceramic substrate packages; and an interposer connector, that is interposed between the first and second packages and comprises a body and connection means provided in the body. First and second electronic circuitries are connected to the connection means of the interposer connector for routing microwave, control and power signals through the connection means. The first electronic circuitry includes a directional coupler in stripline-coplanar configuration.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: May 26, 2020
    Assignee: Thales Alenia Space Italia S.p.A. Con Unico Socio
    Inventors: Antonio Fina, Alessandro Di Carlofelice, Francesco De Paulis, Ulisse Di Marcantonio, Andrea Suriani, Piero Tognolatti, Antonio Orlandi
  • Microwave Antenna Module for Space Applications Including A Hybrid Transmit/Receive Module of Package on Package Type
    Publication number: 20190067824
    Abstract: The invention concerns a microwave antenna module for use in an antenna system installed on board a space platform. The disclosed microwave antenna module includes a transmit/receive module, which comprises: a first package and a second package, that are hermetically sealed to one another and that are multilayer ceramic substrate packages; and an interposer connector, that is interposed between the first and second packages and comprises a body and connection means provided in the body. First and second electronic circuitries are connected to the connection means of the interposer connector for routing microwave, control and power signals through the connection means. The first electronic circuitry includes a directional coupler in stripline-coplanar configuration.
    Type: Application
    Filed: July 27, 2018
    Publication date: February 28, 2019
    Applicant: Thales Alenia Space Italia S.p.A. Con Unico Socio
    Inventors: Antonio Fina, Alessandro Di Carlofelice, Francesco De Paulis, Ulisse Di Marcantonio, Andrea Suriani, Piero Tognolatti, Antonio Orlandi