Patents by Inventor Andreas A. Hase

Andreas A. Hase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE FOR A LIGHT EMITTING ELEMENT
    Publication number: 20110316015
    Abstract: A high-brightness LED module includes a substrate with a recess in which a light emitting element is mounted. The recess is defined by a sidewalls and a relatively thin membrane. At least two micro-vias are provided in the membrane and include conductive material that passes through the membrane. A p-contact of the light emitting element is coupled to a first micro-via and an n-contact of the light emitting element is coupled to a second micro-via.
    Type: Application
    Filed: September 8, 2011
    Publication date: December 29, 2011
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Thomas Murphy, Andreas A. Hase, Matthias Heschel
  • Package for a light emitting element
    Patent number: 8044412
    Abstract: A high-brightness LED module includes a substrate with a recess in which a light emitting element is mounted. The recess is defined by a sidewalls and a relatively thin membrane. At least two micro-vias are provided in the membrane and include conductive material that passes through the membrane. A p-contact of the light emitting element is coupled to a first micro-via and an n-contact of the light emitting element is coupled to a second micro-via.
    Type: Grant
    Filed: October 23, 2008
    Date of Patent: October 25, 2011
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd
    Inventors: Thomas Murphy, Andreas A. Hase, Matthias Heschel
  • Fabrication of Compact Semiconductor Packages
    Publication number: 20090181500
    Abstract: A wafer-level method of fabricating a chip-to-wafer or wafer-to-wafer semiconductor packages includes etching a cavity into a first semiconductor wafer and etching vias in a bottom of the cavity. The cavity and sidewalls of the vias are selectively metallized. The cavity can be used to house either an electrical circuit component or to contain a device die. A second semiconductor wafer is placed over the cavity-side of the first semiconductor and is sealed to the first semiconductor wafer. A backside of the first semiconductor wafer is thinned to expose metallization in the vias and metal is deposited on the backside to form circuit routing paths.
    Type: Application
    Filed: January 15, 2008
    Publication date: July 16, 2009
    Inventors: Jochen Kuhmann, Andreas A. Hase
  • PACKAGE FOR A LIGHT EMITTING ELEMENT
    Publication number: 20090101897
    Abstract: A high-brightness LED module includes a substrate with a recess in which a light emitting element is mounted. The recess is defined by a sidewalls and a relatively thin membrane. At least two micro-vias are provided in the membrane and include conductive material that passes through the membrane. A p-contact of the light emitting element is coupled to a first micro-via and an n-contact of the light emitting element is coupled to a second micro-via.
    Type: Application
    Filed: October 23, 2008
    Publication date: April 23, 2009
    Applicant: HYMITE A/S
    Inventors: Thomas Murphy, Andreas A. Hase, Matthias Heschel