Patents by Inventor Andreas A. Meyer

Andreas A. Meyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9419479
    Abstract: An electric machine has a stator that comprises a plurality of laminations with teeth and cooling apertures about a central opening. When the laminations are stacked to form the stator core, the teeth of adjacent laminations cooperate to form slots disposed circumferentially about the central opening that are configured to receive a plurality of stator windings, and the cooling apertures angularly spaced about the central opening cooperate to form cooling manifolds that extend along a length of the stator core. A portion of the laminations has their cooling apertures offset from other laminations in the stack in a manner to create a plurality of flow paths transverse to the manifolds. The transverse flow paths extend angularly between laminations and adjacent manifolds. A header assembly directs flow into and out of the stator core.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: August 16, 2016
    Assignee: Baldor Electric Company
    Inventors: Boris A. Shoykhet, Andreas A. Meyer, Richard F. Schiferl, Qimin Dong, Michael Brinkmann
  • Publication number: 20140265666
    Abstract: An electric machine has a stator that comprises a plurality of laminations with teeth and cooling apertures about a central opening. When the laminations are stacked to form the stator core, the teeth of adjacent laminations cooperate to form slots disposed circumferentially about the central opening that are configured to receive a plurality of stator windings, and the cooling apertures angularly spaced about the central opening cooperate to form cooling manifolds that extend along a length of the stator core. A portion of the laminations has their cooling apertures offset from other laminations in the stack in a manner to create a plurality of flow paths transverse to the manifolds. The transverse flow paths extend angularly between laminations and adjacent manifolds. A header assembly directs flow into and out of the stator core.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Applicant: Baldor Electric Company
    Inventors: Boris A. Shoykhet, Andreas A. Meyer, Richard F. Schiferl, Qimin Dong, Michael Brinkmann
  • Patent number: 7880088
    Abstract: A bus system is disclosed for use with switching devices, such as power electronic devices. The system includes generally parallel bus elements that define electrical reference planes, such as for a dc bus. The bus elements are separated from one another by insulative layers, with additional insulative layers being available for separating the system from other circuit components. Portions of the bus elements are extended or exposed to permit connection to the circuit elements, including packaged switching circuits and energy storage or filtering circuits. The bus system may be conformed to a variety of geometric configurations, and substantially reduces parasitic inductance and total loop inductance in the resulting circuitry.
    Type: Grant
    Filed: March 3, 2008
    Date of Patent: February 1, 2011
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Lawrence D. Radosevich, Steven C. Kaishian, Daniel G. Kannenberg, Timothy A. Roebke, Andreas A. Meyer, Dennis L. Kehl, Lee A. Gettelfinger
  • Publication number: 20080202899
    Abstract: A bus system is disclosed for use with switching devices, such as power electronic devices. The system includes generally parallel bus elements that define electrical reference planes, such as for a dc bus. The bus elements are separated from one another by insulative layers, with additional insulative layers being available for separating the system from other circuit components. Portions of the bus elements are extended or exposed to permit connection to the circuit elements, including packaged switching circuits and energy storage or filtering circuits. The bus system may be conformed to a variety of geometric configurations, and substantially reduces parasitic inductance and total loop inductance in the resulting circuitry.
    Type: Application
    Filed: March 3, 2008
    Publication date: August 28, 2008
    Applicant: Rockwell Automation Technologies, Inc.
    Inventors: Lawrence D. Radosevich, Steven C. Kaishian, Daniel G. Kannenberg, Timothy A. Roebke, Andreas A. Meyer, Dennis L. Kehl, Lee A. Gettelfinger
  • Patent number: 7358442
    Abstract: A bus system is disclosed for use with switching devices, such as power electronic devices. The system includes generally parallel bus elements that define electrical reference planes, such as for a dc bus. The bus elements are separated from one another by insulative layers, with additional insulative layers being available for separating the system from other circuit components. Portions of the bus elements are extended or exposed to permit connection to the circuit elements, including packaged switching circuits and energy storage or filtering circuits. The bus system may be conformed to a variety of geometric configurations, and substantially reduces parasitic inductance and total loop inductance in the resulting circuitry.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: April 15, 2008
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Lawrence D. Radosevich, Steven C. Kaishian, Daniel G. Kannenberg, Timothy A. Roebke, Andreas A. Meyer, Dennis L. Kehl, Lee A. Gettelfinger
  • Patent number: 7212407
    Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: December 6, 2005
    Date of Patent: May 1, 2007
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
  • Patent number: 7187548
    Abstract: A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: March 6, 2007
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Andreas A. Meyer, Lawrence D. Radosevich, Bruce C. Beihoff, Dennis L. Kehl, Daniel G. Kannenberg
  • Patent number: 7177153
    Abstract: An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: December 9, 2002
    Date of Patent: February 13, 2007
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Lawrence D. Radosevich, Andreas A. Meyer, Daniel G. Kannenberg, Steven C. Kaishian, Bruce C. Beihoff
  • Patent number: 7016192
    Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: September 16, 2003
    Date of Patent: March 21, 2006
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
  • Patent number: 6982873
    Abstract: An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: December 16, 2002
    Date of Patent: January 3, 2006
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Andreas A. Meyer, Lawrence D. Radosevich, Bruce C. Beihoff, Dennis L. Kehl, Daniel G. Kannenberg
  • Patent number: 6972957
    Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: December 18, 2002
    Date of Patent: December 6, 2005
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
  • Patent number: 6965514
    Abstract: An electric vehicle drive includes a support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EM/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: November 15, 2005
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
  • Patent number: 6940715
    Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: September 16, 2003
    Date of Patent: September 6, 2005
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
  • Patent number: 6865080
    Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: March 8, 2005
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Lawrence D. Radosevich, Andreas A. Meyer, Bruce C. Beihoff, Daniel G. Kannenberg
  • Publication number: 20040061989
    Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Application
    Filed: September 16, 2003
    Publication date: April 1, 2004
    Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
  • Publication number: 20030151893
    Abstract: A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Application
    Filed: December 23, 2002
    Publication date: August 14, 2003
    Inventors: Andreas A. Meyer, Lawrence D. Radosevich, Bruce C. Beihoff, Dennis L. Kehl, Daniel G. Kannenberg
  • Publication number: 20030133259
    Abstract: An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Application
    Filed: December 16, 2002
    Publication date: July 17, 2003
    Inventors: Andreas A. Meyer, Lawrence D. Radosevich, Bruce C. Beihoff, Dennis L. Kehl, Daniel G. Kannenberg
  • Publication number: 20030132040
    Abstract: An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Application
    Filed: December 9, 2002
    Publication date: July 17, 2003
    Inventors: Lawrence D. Radosevich, Andreas A. Meyer, Daniel G. Kannenberg, Steven C. Kaishian, Bruce C. Beihoff
  • Publication number: 20030133257
    Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Application
    Filed: December 18, 2002
    Publication date: July 17, 2003
    Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
  • Patent number: D624015
    Type: Grant
    Filed: December 17, 2008
    Date of Patent: September 21, 2010
    Assignee: Baldor Electric Company
    Inventors: Adam Walker, William E. Martin, Andreas A. Meyers