Patents by Inventor Andreas A. Meyer
Andreas A. Meyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9419479Abstract: An electric machine has a stator that comprises a plurality of laminations with teeth and cooling apertures about a central opening. When the laminations are stacked to form the stator core, the teeth of adjacent laminations cooperate to form slots disposed circumferentially about the central opening that are configured to receive a plurality of stator windings, and the cooling apertures angularly spaced about the central opening cooperate to form cooling manifolds that extend along a length of the stator core. A portion of the laminations has their cooling apertures offset from other laminations in the stack in a manner to create a plurality of flow paths transverse to the manifolds. The transverse flow paths extend angularly between laminations and adjacent manifolds. A header assembly directs flow into and out of the stator core.Type: GrantFiled: March 13, 2014Date of Patent: August 16, 2016Assignee: Baldor Electric CompanyInventors: Boris A. Shoykhet, Andreas A. Meyer, Richard F. Schiferl, Qimin Dong, Michael Brinkmann
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Publication number: 20140265666Abstract: An electric machine has a stator that comprises a plurality of laminations with teeth and cooling apertures about a central opening. When the laminations are stacked to form the stator core, the teeth of adjacent laminations cooperate to form slots disposed circumferentially about the central opening that are configured to receive a plurality of stator windings, and the cooling apertures angularly spaced about the central opening cooperate to form cooling manifolds that extend along a length of the stator core. A portion of the laminations has their cooling apertures offset from other laminations in the stack in a manner to create a plurality of flow paths transverse to the manifolds. The transverse flow paths extend angularly between laminations and adjacent manifolds. A header assembly directs flow into and out of the stator core.Type: ApplicationFiled: March 13, 2014Publication date: September 18, 2014Applicant: Baldor Electric CompanyInventors: Boris A. Shoykhet, Andreas A. Meyer, Richard F. Schiferl, Qimin Dong, Michael Brinkmann
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Patent number: 7880088Abstract: A bus system is disclosed for use with switching devices, such as power electronic devices. The system includes generally parallel bus elements that define electrical reference planes, such as for a dc bus. The bus elements are separated from one another by insulative layers, with additional insulative layers being available for separating the system from other circuit components. Portions of the bus elements are extended or exposed to permit connection to the circuit elements, including packaged switching circuits and energy storage or filtering circuits. The bus system may be conformed to a variety of geometric configurations, and substantially reduces parasitic inductance and total loop inductance in the resulting circuitry.Type: GrantFiled: March 3, 2008Date of Patent: February 1, 2011Assignee: Rockwell Automation Technologies, Inc.Inventors: Lawrence D. Radosevich, Steven C. Kaishian, Daniel G. Kannenberg, Timothy A. Roebke, Andreas A. Meyer, Dennis L. Kehl, Lee A. Gettelfinger
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Publication number: 20080202899Abstract: A bus system is disclosed for use with switching devices, such as power electronic devices. The system includes generally parallel bus elements that define electrical reference planes, such as for a dc bus. The bus elements are separated from one another by insulative layers, with additional insulative layers being available for separating the system from other circuit components. Portions of the bus elements are extended or exposed to permit connection to the circuit elements, including packaged switching circuits and energy storage or filtering circuits. The bus system may be conformed to a variety of geometric configurations, and substantially reduces parasitic inductance and total loop inductance in the resulting circuitry.Type: ApplicationFiled: March 3, 2008Publication date: August 28, 2008Applicant: Rockwell Automation Technologies, Inc.Inventors: Lawrence D. Radosevich, Steven C. Kaishian, Daniel G. Kannenberg, Timothy A. Roebke, Andreas A. Meyer, Dennis L. Kehl, Lee A. Gettelfinger
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Patent number: 7358442Abstract: A bus system is disclosed for use with switching devices, such as power electronic devices. The system includes generally parallel bus elements that define electrical reference planes, such as for a dc bus. The bus elements are separated from one another by insulative layers, with additional insulative layers being available for separating the system from other circuit components. Portions of the bus elements are extended or exposed to permit connection to the circuit elements, including packaged switching circuits and energy storage or filtering circuits. The bus system may be conformed to a variety of geometric configurations, and substantially reduces parasitic inductance and total loop inductance in the resulting circuitry.Type: GrantFiled: September 30, 2003Date of Patent: April 15, 2008Assignee: Rockwell Automation Technologies, Inc.Inventors: Lawrence D. Radosevich, Steven C. Kaishian, Daniel G. Kannenberg, Timothy A. Roebke, Andreas A. Meyer, Dennis L. Kehl, Lee A. Gettelfinger
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Patent number: 7212407Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 6, 2005Date of Patent: May 1, 2007Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
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Patent number: 7187548Abstract: A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 23, 2002Date of Patent: March 6, 2007Assignee: Rockwell Automation Technologies, Inc.Inventors: Andreas A. Meyer, Lawrence D. Radosevich, Bruce C. Beihoff, Dennis L. Kehl, Daniel G. Kannenberg
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Patent number: 7177153Abstract: An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 9, 2002Date of Patent: February 13, 2007Assignee: Rockwell Automation Technologies, Inc.Inventors: Lawrence D. Radosevich, Andreas A. Meyer, Daniel G. Kannenberg, Steven C. Kaishian, Bruce C. Beihoff
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Patent number: 7016192Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: September 16, 2003Date of Patent: March 21, 2006Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
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Patent number: 6982873Abstract: An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 16, 2002Date of Patent: January 3, 2006Assignee: Rockwell Automation Technologies, Inc.Inventors: Andreas A. Meyer, Lawrence D. Radosevich, Bruce C. Beihoff, Dennis L. Kehl, Daniel G. Kannenberg
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Patent number: 6972957Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 18, 2002Date of Patent: December 6, 2005Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
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Patent number: 6965514Abstract: An electric vehicle drive includes a support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EM/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 23, 2002Date of Patent: November 15, 2005Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
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Patent number: 6940715Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: September 16, 2003Date of Patent: September 6, 2005Assignee: Rockwell Automation Technologies, Inc.Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
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Patent number: 6865080Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: GrantFiled: December 23, 2002Date of Patent: March 8, 2005Assignee: Rockwell Automation Technologies, Inc.Inventors: Lawrence D. Radosevich, Andreas A. Meyer, Bruce C. Beihoff, Daniel G. Kannenberg
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Publication number: 20040061989Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: September 16, 2003Publication date: April 1, 2004Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
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Publication number: 20030151893Abstract: A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: December 23, 2002Publication date: August 14, 2003Inventors: Andreas A. Meyer, Lawrence D. Radosevich, Bruce C. Beihoff, Dennis L. Kehl, Daniel G. Kannenberg
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Publication number: 20030133259Abstract: An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: December 16, 2002Publication date: July 17, 2003Inventors: Andreas A. Meyer, Lawrence D. Radosevich, Bruce C. Beihoff, Dennis L. Kehl, Daniel G. Kannenberg
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Publication number: 20030132040Abstract: An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: December 9, 2002Publication date: July 17, 2003Inventors: Lawrence D. Radosevich, Andreas A. Meyer, Daniel G. Kannenberg, Steven C. Kaishian, Bruce C. Beihoff
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Publication number: 20030133257Abstract: A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.Type: ApplicationFiled: December 18, 2002Publication date: July 17, 2003Inventors: Bruce C. Beihoff, Lawrence D. Radosevich, Andreas A. Meyer, Neil Gollhardt, Daniel G. Kannenberg
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Patent number: D624015Type: GrantFiled: December 17, 2008Date of Patent: September 21, 2010Assignee: Baldor Electric CompanyInventors: Adam Walker, William E. Martin, Andreas A. Meyers