Abstract: The disclosure describes a method of providing cyber security enhancement, comprising: receiving an input signal via a first hardware sub-circuit of a hardware circuit and processing the received input signal into at least one of a first processed signal according to a first type of processing and a second processed signal according to a second type of processing being different to the first type of processing; deriving from only from one of the first processed signal and/or second processed signal a first output signal; transmitting the first output signal to a second hardware sub-circuit of the hardware circuit; and detecting from which of the first processed signal and/or second processed signal the transmitted first output signal is derived from and processing the transmitted first output signal into a second output signal in dependency from result of the detection.

Abstract: An embodiment of a method for operating a modular test bench is disclosed, wherein the modular test bench comprises at least one test module to test a test object. The method comprises receiving first information on a hardware revision and on a software revision of the test module and receiving second information on a hardware revision and on a software revision of the test object. The method further comprises determining, if the combination of the first information and the second information fulfills a predetermined criterion and outputting a check signal, enabling the use of the test bench if the combination of the first information and the second information fulfills the predetermined criterion.

Abstract: The invention relates to automobile electronic system comprising one or more domain computer centers for embedding electronic units forming parts of the automobile electronic system; and two or more module housings, each of which accommodating at least one of said electronic units; wherein each of the domain computer centers comprises two or more plug-in pockets and each of the module housings is plugged within respective one plug-in pocket, and wherein each plug-in pocket is embedded within a respective domain computer center by at least one apparatus for decoupling a respective plugged module housing from environmental factors. The domain computer centers further has a liquid-cooling apparatus integrated for cooling module housings plugged-in. The invention relates furthermore to corresponding domain computer centers and module housings and to a method for the integration of electronic units into such an automobile electronic system.

Abstract: The invention relates to an electronic component comprising a first integrated sub-circuit having a defined interface and a defined fixed-hardware functionality, a second, reconfigurable integrated sub-circuit being signal-connected via the interface to the first sub-circuit to exchange signals therewith, and optionally supply energy thereto, and one or more terminals for electrically connecting the electronic component to its periphery. The second sub-circuit is configured as an interface circuit between the one or more terminals and the first sub-circuit. The second sub-circuit is further configured as a reconfigurable integrated testing unit to test said hardware functionality of the first sub-circuit by applying one or more input signals to the first circuit and evaluating one or more output signals received via the interface from the first sub-circuit in response to the one or more input signals for conformance with one or more predetermined test criteria.

Abstract: Technologies and techniques for monitoring the reliability of an electronic system having one or more electronic components. A transmission quality of signals transmitted to or from the electronic system over a wired electrical signal transmission path are measured at different measurement times and according to a predetermined transmission quality measure. For each of the measurement times, the associated measured transmission quality is compared with a respective associated transmission quality reference value previously determined according to the transmission quality measure. A value of a reliability indicator associated with the respective measurement time is determined in dependence on the result of the associated comparison.

Abstract: A central compute unit, configured for a vehicle, a vehicle central compute unit, to a pocket module, to an electronic module, and to a printed circuit board, to a cooling blade, and to a main frame. The main frame for mounting and connecting vehicular components in a vehicle includes a plurality of slots configured to support a plurality of pocket modules. A main frame interface is configured to connect the plurality of pocket modules with a communication network, and to couple the plurality of pocket modules with a cooling circuit.

Abstract: A central compute unit, configured as a vehicle central compute unit, to a pocket module, to an electronic module, and to a printed circuit board, to a cooling blade, and to a main frame. The printed circuit board for an electronic vehicular component includes a thermal distribution layer in the printed circuit board and one or more thermal coupling areas on the surface of the printed circuit board. The one or more thermal coupling areas are configured for heat dissipation away from the printed circuit board, and the one or more thermal coupling areas are thermally coupled to the thermal distribution layer in the printed circuit board.

Abstract: A central compute unit, configured as a vehicle central compute unit, to a pocket module, to an electronic module, and to a printed circuit board, to a cooling blade, and to a main frame. The cooling blade for cooling an electronic module of a vehicle includes at least one connector for connecting to a liquid cooling system of the vehicle. A cooling line is provided for guiding a liquid coolant through the cooling blade for heat transfer, and a heat transfer area is provided for thermal coupling of the electronic module.

Abstract: Embodiments of the disclosure relate to a vehicle, an apparatus, a method, and a computer program for a vehicle, an apparatus, a method, and a computer program for a network entity, for updating one or more software components of a vehicle. A method for a vehicle and for updating one or more software components of the vehicle comprises receiving a software update comprising a plurality of software update packets from a network entity, and selecting from the plurality of software update packets a subset of one or more software update packets based on a status of the vehicle. The method further comprises installing the subset of software update packets at the vehicle to update the one or more software components and transmitting information on an updated status of the vehicle to the network entity.

Abstract: An embodiment of a method for operating a modular test bench is disclosed, wherein the modular test bench comprises at least one test module to test a test object. The method comprises receiving first information on a hardware revision and on a software revision of the test module and receiving second information on a hardware revision and on a software revision of the test object. The method further comprises determining, if the combination of the first information and the second information fulfills a predetermined criterion and outputting a check signal, enabling the use of the test bench if the combination of the first information and the second information fulfills the predetermined criterion.

Abstract: Embodiments relate to a vehicle, an apparatus, a method, and a computer program for a vehicle, and an apparatus, a method, and a computer program for a network component. The method for a vehicle and for determining a status of the vehicle comprises registering hardware components of the vehicle to obtain a register of hardware components present in the vehicle, and determining the status of the vehicle based on the register of hardware components.

Abstract: The invention relates to automobile electronic system comprising one or more domain computer centers for embedding electronic units forming parts of the automobile electronic system; and two or more module housings, each of which accommodating at least one of said electronic units; wherein each of the domain computer centers comprises two or more plug-in pockets and each of the module housings is plugged within respective one plug-in pocket, and wherein each plug-in pocket is embedded within a respective domain computer center by at least one apparatus for decoupling a respective plugged module housing from environmental factors. The domain computer centers further has a liquid-cooling apparatus integrated for cooling module housings plugged-in. The invention relates furthermore to corresponding domain computer centers and module housings and to a method for the integration of electronic units into such an automobile electronic system.

Abstract: A system-on-chip comprises: a first sub-circuit having a defined interface and a defined fixed-hardware functionality; a second reconfigurable sub-circuit being signal-connected via the interface to the first sub-circuit; and one or more terminals. The second sub-circuit is configured as an interface circuit between the terminals and the first sub-circuit. The first sub-circuit and the second sub-circuit are split into a plurality of individual first and second circuit blocks. At least one of said first circuit blocks is signal-connected via signal connections, each running through one or more of the second circuit blocks, to one or more other first circuit blocks or one or more of the terminals. One or more of said signal connections are reconfigurable, by the respective one or more second circuit blocks pertaining to the respective signal connection. The SOC is reconfigurable before or during its operation by reconfiguring at least one of said second circuit blocks.

Abstract: The invention relates to an electronic component comprising a first integrated sub-circuit having a defined interface and a defined fixed-hardware functionality, a second, reconfigurable integrated sub-circuit being signal-connected via the interface to the first sub-circuit to exchange signals therewith, and optionally supply energy thereto, and one or more terminals for electrically connecting the electronic component to its periphery. The second sub-circuit is configured as an interface circuit between the one or more terminals and the first sub-circuit. The second sub-circuit is further configured as a reconfigurable integrated testing unit to test said hardware functionality of the first sub-circuit by applying one or more input signals to the first circuit and evaluating one or more output signals received via the interface from the first sub-circuit in response to the one or more input signals for conformance with one or more predetermined test criteria.

Abstract: The invention relates to a method as well as an apparatus configured for its execution for monitoring the reliability of an electronic system, in particular an electronic system comprising one or more electronic components.

Abstract: An interposer of silicon for use in a semiconductor module, wherein the interposer has a top side serving for arrangement of functional semiconductor and an underside and is subdivided into a connection layer and a thermal layer along a plane running between the top side and the underside. The connection layer forming the surface of the interposer has a network with contact pads arranged on the surface for connection of the functional semiconductors arranged on the surface of the interposer, while the thermal layer has no metallization, and the underside of the interposer formed by the thermal layer serves for dissipating the heat generated by the functional semiconductors.

Abstract: An interposer of silicon for use in a semiconductor module, wherein the interposer has a top side serving for arrangement of functional semiconductor and an underside and is subdivided into a connection layer and a thermal layer along a plane running between the top side and the underside. The connection layer forming the surface of the interposer has a network with contact pads arranged on the surface for connection of the functional semiconductors arranged on the surface of the interposer, while the thermal layer has no metallization, and the underside of the interposer formed by the thermal layer serves for dissipating the heat generated by the functional semiconductors.