Abstract: A bulk capacitor assembly for an inverter includes a stacked busbar, the stacked busbar including a first direct current (DC) busbar and a second DC busbar; one or more first capacitors on a first side of the stacked busbar, the one or more first capacitors electrically connected to the first DC busbar and the second DC busbar; and one or more second capacitors on a second side of the stacked busbar, the first side being opposite to the second side, the one or more second capacitors electrically connected to the first DC busbar and the second DC busbar.

Abstract: A system may include a capacitor assembly, the capacitor assembly including: a planar busbar, the planar busbar including a first direct current (DC) busbar and a second DC busbar, one or more first capacitors on a first side of the planar busbar, the one or more first capacitors including a first bobbin with a positive end facing a first direction with respect to the planar busbar; and one or more second capacitors on the first side of the planar busbar, the one or more second capacitors including a second bobbin with a positive end facing a second direction with respect to the planar busbar, wherein the one or more first capacitors are alternately arranged with the one or more second capacitors with respect to the planar busbar.

Abstract: A system for an electric vehicle includes: an inverter housing including an inner wall, a first channel, and an exterior surface; and a heatsink coupled to the exterior surface of the inverter housing, the heatsink including a second channel; wherein the first channel in the inverter housing and the second channel in the heatsink define a cooling circuit, and wherein the first channel is fluidly connected to the second channel to pass a coolant through the cooling circuit.

Abstract: An inverter including: a housing including a first surface and a second surface opposite to the first surface; a power module including a first surface and a second surface opposite to the first surface, wherein the first surface of the power module contacts the first surface of the housing; a heat sink including a first surface and a second surface opposite to the first surface, wherein the first surface of the heat sink is coupled to the second surface of the power module; a multi-functional structural element, the multi-functional structural element including a first surface and a second surface, wherein the first surface of the multi-functional structural element contacts the second surface of the heat sink; and a printed circuit board, the printed circuit board being coupled to the second surface of the multi-functional structural element; wherein the housing and heat sink define a cooling circuit.

Abstract: A power converter including a semiconductor module having a base plate and a cooling housing. The cooling housing includes a receptacle plate and a cover. The receptacle plate has an opening. The receptacle plate is connected to the base plate of the semiconductor module around the opening. The cover is connected to the receptacle plate along a closure path around the opening, and either the receptacle plate or the cover is formed as a stamped or deep-drawn plate.

Abstract: A power converter including a semiconductor module having a base plate and a cooling housing. The cooling housing includes a receptacle plate and a cover. The receptacle plate has an opening. The receptacle plate is connected to the base plate of the semiconductor module around the opening. The cover is connected to the receptacle plate along a closure path around the opening, and either the receptacle plate or the cover is formed as a stamped or deep-drawn plate.

Abstract: Power electronics arrangement including a printed circuit board and at least one power module fastened on the printed circuit board, which has one or more electronic components potted by a potting compound. At least one module connecting point of the power module is electrically contacted with at least one board connecting point of the printed circuit board by an electrically conductive pin. A base section of the pin is fastened on the module connecting point or on the board connecting point, and the end of the pin opposite to the base section is pressed in the installation position into a contacting opening assigned or assignable to the respective other connecting point.

Abstract: An inverter for an electric machine is provided. The electric machine includes a rotor and a stator. The inverter includes a DC/AC converter and a DC/DC converter. The DC/AC converter includes at least one chip of silicon carbide having at least one MOSFET. The DC/DC converter includes at least one chip of silicon having at least one IGBT. The DC/DC converter is connectible to a first one of the rotor or the stator of the electric machine and the DC/AC converter is connectible to a second one of the rotor or the stator of the electric machine.

Abstract: Power electronics arrangement including a printed circuit board and at least one power module fastened on the printed circuit board, which has one or more electronic components potted by a potting compound. At least one module connecting point of the power module is electrically contacted with at least one board connecting point of the printed circuit board by an electrically conductive pin. A base section of the pin is fastened on the module connecting point or on the board connecting point, and the end of the pin opposite to the base section is pressed in the installation position into a contacting opening assigned or assignable to the respective other connecting point.

Abstract: A power converter including a semiconductor module having a base plate and a cooling housing. The cooling housing includes a receptacle plate and a cover. The receptacle plate has an opening. The receptacle plate is connected to the base plate of the semiconductor module around the opening. The cover is connected to the receptacle plate along a closure path around the opening, and either the receptacle plate or the cover is formed as a stamped or deep-drawn plate.

Abstract: A method for operating an electrical circuit including at least one half-bridge formed from two transistors wherein the electrical circuit is switched over between a first switching state, in which the first transistor of the half-bridge is switched to conductive by a first voltage value of a first control voltage and the second transistor of the half-bridge is switched to blocking by a second voltage value of a second control voltage, and a second switching state, in which the first transistor is switched to blocking by a second voltage value of the first control voltage and the second transistor is switched to conductive by a first voltage value of the second control voltage, wherein a dead time state, in which both transistors are switched to blocking, is assumed chronologically between the first switching state and the second switching state.

Abstract: An inverter for an electric machine is provided. The electric machine includes a rotor and a stator. The inverter includes a DC/AC converter and a DC/DC converter. The DC/AC converter includes at least one chip of silicon carbide having at least one MOSFET. The DC/DC converter includes at least one chip of silicon having at least one IGBT. The DC/DC converter is connectible to a first one of the rotor or the stator of the electric machine and the DC/AC converter is connectible to a second one of the rotor or the stator of the electric machine.

Abstract: An electronic power module, including at least one semiconductor component, which is arranged on a support, as well as a cooling element, which is in thermal contact with the semiconductor component, wherein the support includes a semiconductor material and, at the same time, serves as a cooling element.

Abstract: A power electronics module includes a substrate with a substrate metallization layer, which is separated into conducting areas for providing conducting paths for the power electronics module; a semiconductor switch chip bonded with a first power electrode to a first conducting area of the substrate metallization layer; a conductor plate bonded to a second power electrode of the semiconductor switch chip opposite to the first power electrode.

Abstract: A power semiconductor module, including a housing; a power semiconductor chip within the housing; power terminals protruding from the housing and electrically interconnected with power electrodes of the semiconductor chip; and auxiliary terminals protruding from the housing and electrically interconnected with a gate electrode and one of the power electrodes; wherein three auxiliary terminals are arranged in a coaxial auxiliary terminal arrangement, which comprises an inner and two outer auxiliary terminals, which are arranged on opposing sides of the inner auxiliary terminal. The inner auxiliary terminal is electrically interconnected with the gate electrode or one of the power electrodes and the two outer auxiliary terminals are electrically connected with the other one of the gate electrode and the one of the power electrodes.

Abstract: A converter device for an electrical machine, including a switch with a plurality of switching elements to generate a multiphase alternating current for the electrical machine and a plurality of phase conductors for conducting an alternating current generated in each case by the switch to the electrical machine, wherein a number of first phase conductors that is one less in number than the total number of phase conductors are coordinated with a current measuring means, and a control device is provided, which is designed to determine a calculated value describing a current along the second phase conductor from first measured values of the current measuring means, wherein the control device is designed to check the plausibility of the calculated value on the basis at least one second measured value of a short circuit detecting device coordinated with a switching element.

Abstract: A power electronics module includes a substrate with a substrate metallization layer, which is separated into conducting areas for providing conducting paths for the power electronics module; a semiconductor switch chip bonded with a first power electrode to a first conducting area of the substrate metallization layer; a conductor plate bonded to a second power electrode of the semiconductor switch chip opposite to the first power electrode.

Abstract: A method for adjusting a modulation of at least one electrical operating parameter of at least one component of a power electronics unit, wherein an electric machine of a vehicle is operated by the power electronics unit, wherein the modulation is adjusted by a user of the vehicle.

Abstract: A method for operating an electrical circuit including at least one half-bridge formed from two transistors wherein the electrical circuit is switched over between a first switching state, in which the first transistor of the half-bridge is switched to conductive by a first voltage value of a first control voltage and the second transistor of the half-bridge is switched to blocking by a second voltage value of a second control voltage, and a second switching state, in which the first transistor is switched to blocking by a second voltage value of the first control voltage and the second transistor is switched to conductive by a first voltage value of the second control voltage, wherein a dead time state, in which both transistors are switched to blocking, is assumed chronologically between the first switching state and the second switching state.

Abstract: An electronics device with at least one component to be cooled, a cooling element for cooling the component to be cooled, at least one power supply line, and a respective current sensor for recording a current strength of a current flowing through the respective power supply line, wherein the cooling element has a recess, in which the current sensor engages or in which the current sensor is arranged.