Abstract: Disclosed is a printed circuit board having at least one power semiconductor soldered thereon and, as a thermal fuse, a spring having two contact arms fastened to solder pads of the printed circuit board by soldered connections. The spring is under mechanical stress such that at least one of the two contact arms moves away from one of the solder pads by spring force as soon as the soldered connection loses its strength and fails due to overheating. The soldered connection of at least one of the contact arms loses its strength at a lower temperature and is formed from a different alloy than the soldered connection that connects the power semiconductor to the printed circuit board. A method for populating a printed circuit board is also described.