Abstract: A process for manufacturing copper-nickel-silicon alloys includes the sequential steps of casting the copper alloy; hot working the cast copper-base alloy to effect a first reduction in cross-sectional area; solutionizing the cast copper-base alloy at a temperature and for a time effective to substantially form a single phase alloy; first age annealing the alloy at a temperature and for a time effective to precipitate an amount of a second phase effective to form a multi-phase alloy having silicides; cold working the multi-phase alloy to effect a second reduction in cross-sectional area; and second age annealing the multiphase alloy at a temperature and for a time effective to precipitate additional silicides thereby raising conductivity, wherein the second age annealing temperature is less than the first age annealing temperature.

Abstract: A copper alloy having an improved combination of yield strength and electrical conductivity contains, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up to 1% of silver.

Abstract: A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up 1% of silver. A process to manufacture the alloys of the invention as well as other copper-nickel-silicon alloys includes the sequential steps of (a). casting the copper alloy; (b). hot working the cast copper-base alloy to effect a first reduction in cross-sectional area; (c).

Abstract: A lead-free copper alloy based on Cu—Zn—Si and a method of manufacture thereof. The copper alloy is built on the basis of copper, zinc and silicon without toxic additives and consists of: 70 to 83% Cu, 1 to 5% Si and the further matrix-active elements: 0.01 to 2% Sn, 0.01 to 0.3% Fe and/or Co, 0.01 to 0.3% Ni, 0.01 to 0.3% Mn, the remainder Zn and unavoidable impurities.

Abstract: A band-shaped semi-finished product is made out of a ductile material and is configured to be separated into at least two sections. At least one pair of wedge-shaped, non-cuttingly formed longitudinal notches are formed, between the tips of which there remains a thin web of material, which can be torn easily with little force. The semi-finished product is distinguished by burr-free separated edges, defined geometry of the separating surfaces, and extremely reduced breaking-surface portions. It shows improved resistance during static and dynamic stress, in particular for alternating bending loads, in comparison to conventional, for example via the rolling-cutting technique, separated semi-finished products.

Abstract: A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up 1% of silver. A process to manufacture the alloys of the invention as well as other copper-nickel-silicon alloys includes the sequential steps of (a). casting the copper alloy; (b). hot working the cast copper-base alloy to effect a first reduction in cross-sectional area; (c).

Abstract: A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, from 0.5% to 1.5% of silicon, and the balance is copper and inevitable impurities. Further, the total nickel plus cobalt content is from 1.7% to 4.3%, the ratio of nickel to cobalt is from 1.01:1 to 2.6:1, the amount of (Ni+Co)/Si is between 3.5 and 6, the electrical conductivity is in excess of 40% IACS and the yield strength is in excess of 95 ksi. An optional inclusion is up 1% of silver. A process to manufacture the alloy includes the sequential steps of (a). casting; (b). hot working; (c). solutionizing; (d). first age annealing; (e). cold working; and (f). second age annealing wherein the second age annealing temperature is less than the first age annealing temperature.

Abstract: A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up 1% of silver. A process to manufacture the alloys of the invention as well as other copper-nickel-silicon alloys includes the sequential steps of (a). casting the copper alloy; (b). hot working the cast copper-base alloy to effect a first reduction in cross-sectional area; (c).

Abstract: A method for the manufacture of tools and components for the offshore field and the mining industry, in particular, for drilling installations, using a spray formed Cu—Ni—Mn alloy of 10 to 25% Ni, 10 to 25% Mn, the remainder being copper and common impurities. Due to the favorable characteristics of the combination, the alloy is suitable as a replacement material for Be-containing copper materials.

Abstract: A lead-free copper alloy on the base of Cu—Zn—Sn and a method of manufacture. The copper alloy is built on the base of copper, zinc and tin without toxic additives and consists of: 60 to 70% Cu, 0.5 to 3.5% Sn and the further matrix-active elements: 0.01 to 0.5% Fe and/or Co, 0.01 to 0.5% Ni, 0.01 to 0.5% Mn and/or Si, the remainder Zn and unavoidable impurities. Selectively up to 3% Mg, up to 0.2% P and up to 0.5% Ag, Al, As, Sb, Ti, Zr can be added. The demands for a health-conscious and ecological compatibility are thus naturally met.

Abstract: A lead-free copper alloy on the base of Cu—Zn—Si and a method of manufacture. The copper alloy is built on the base of copper, zinc and silicon without toxic additives and consists of: 70 to 83% Cu, 1 to 5% Si and the further matrix-active elements: 0.01 to 2% Sn, 0.01 to 0.3% Fe and/or Co, 0.01 to 0.3% Ni, 0.01 to 0.3% Mn, the remainder Zn and unavoidable impurities. The demands for a health-conscious and ecological compatibility are thus naturally met.

Abstract: A Cu-Ni-Mn alloy which consists of 15 to 25% Ni; 15 to 25% Mn; 0.001 to 1.0% of a chip-breaking additive (lead, carbon, etc.), the remainder being copper and common impurities. The alloy can preferably be used as a replacement material for Be-containing copper materials for the manufacture of disconnectable electrical connections or for the manufacture of tools and components for the offshore field and the mining industry.

Abstract: An age-hardening copper-base alloy and processing method to make a commercially useful strip product for applications requiring high yield strength and moderately high electrical conductivity, in a strip, plate, wire, foil, tube, powder or cast form. The alloys are particularly suited for use in electrical connectors and interconnections. The alloys contain Cu—Ti—X where X is selected from Ni, Fe, Sn, P, Al, Zn, Si, Pb, Be, Mn, Mg, Ag, As, Sb, Zr, B, Cr and Co. and combinations thereof. The alloys offer excellent combinations of yield strength, and electrical conductivity, with excellent stress relaxation resistance. The yield strength is at least of 105 ksi and the electrical conductivity is at least 50% IACS.

Abstract: A copper alloy that consists essentially of, by weight, from 0.15% to 0.7% of chromium, from 0.005% to 0.3% of silver, from 0.01% to 0.15% of titanium, from 0.01% to 0.10% of silicon, up to 0.2% of iron, up to 0.5% of tin, and the balance copper and inevitable impurities has high strength, a yield strength in excess of 80 ksi, and high electrical conductivity, in excess of 80% IACS. The alloy further has substantially isotropic bend characteristics when the processing route includes a solution heat anneal above 850° C. and subsequent cold rolling into sheet, strip or foil interspersed by bell annealing. As a result, the alloy is particularly suited for forming into box-type electrical connectors for both automotive or multimedia applications. The alloy is also suitable for forming into a rod, wire or section.

Abstract: A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up 1% of silver.

Abstract: A band-shaped semi-finished product is made out of a ductile material and is configured to be separated into at least two sections. At least one pair of wedge-shaped, non-cuttingly formed longitudinal notches are formed, between the tips of which there remains a thin web of material, which can be torn easily with little force. The semi-finished product is distinguished by burr-free separated edges, defined geometry of the separating surfaces, and extremely reduced breaking-surface portions. It shows improved resistance during static and dynamic stress, in particular for alternating bending loads, in comparison to conventional, for example via the rolling-cutting technique, separated semi-finished products.

Abstract: A Cu—Ni—Mn alloy which consists of 15 to 25% Ni; 15 to 25% Mn; 0.001 to 1.0% of a chip-breaking additive (lead, carbon, etc.), the remainder being copper and common impurities. The alloy can preferably be used as a replacement material for Be-containing copper materials for the manufacture of disconnectable electric connections or for the manufacture of tools and components for the offshore field and the mining industry.

Abstract: A method for the manufacture of tools and components for the offshore field and the mining industry, in particular for drilling installations using a spray formed Cu—Ni—Mn alloy consisting of 10 to 25% Ni, 10 to 25% Mn, the remainder being copper and the common impurities. Due to the favorable characteristic of the combination, it is suitable as a replacement material for Be-containing copper materials.

Abstract: A copper alloy contains from 4 to 20 wt. % tin and various other metals. The alloys can be used in the manufacture of structural parts which are joined together through the use of heat such as jewelry, clothing accessories and mechanically stressed structural parts in a general machine-building or automotive industry. Iron, titanium, zirconium, hafnium, manganese, zinc, phosphorus and lead can also be present in the alloy composition.

Abstract: A copper-tin-titanium alloy which consists of 12 to 20% by weight tin, 0.002 to 1% by weight titanium, remainder copper and usual impurities. It is possible to add further elements. Semifinished products made from the copper alloy according to the invention are preferably produced by thin-strip casting or spray compacting. Due to a particularly advantageous combination of high mechanical strength properties with excellent ductility, combined with good resistance to corrosion, semifinished products made from the copper alloy according to the invention have numerous possible uses.