Patents by Inventor Andreas C. Cangellaris

Andreas C. Cangellaris has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040222514
    Abstract: A cluster grid array semiconductor die package and mating socket provide electrical connection between one or more semiconductor dies housed within the die package and substrate, such as a printed circuit board, on which the mating socket is mounted. The die package and the mating socket may be easily connected and disconnected. The die package may include power and ground planes built into and distributed within the housing of the die package.
    Type: Application
    Filed: February 20, 2004
    Publication date: November 11, 2004
    Applicant: Silicon Bandwidth, Inc.
    Inventors: Stanford W. Crane, Myoung-soo Jeon, Charley Takeshi Ogata, Ton-Yong Wang, Andreas C. Cangellaris, Jose Schutt-Aine
  • Patent number: 6803650
    Abstract: A cluster grid array semiconductor die package and mating socket provide electrical connection between one or more semiconductor dies housed within the die package and substrate, such as a printed circuit board, on which the mating socket is mounted. The die package and the mating socket may be easily connected and disconnected. The die package may include power and ground planes built into and distributed within the housing of the die package.
    Type: Grant
    Filed: May 31, 2001
    Date of Patent: October 12, 2004
    Assignee: Silicon Bandwidth Inc.
    Inventors: Stanford W. Crane, Jr., Myoung-soo Jeon, Charley Takeshi Ogata, Ton-Yong Wang, Andreas C. Cangellaris, Jose Schutt-Aine
  • Publication number: 20020117751
    Abstract: A cluster grid array semiconductor die package and mating socket provide electrical connection between one or more semiconductor dies housed within the die package and substrate, such as a printed circuit board, on which the mating socket is mounted. The die package and the mating socket may be easily connected and disconnected. The die package may include power and ground planes built into and distributed within the housing of the die package.
    Type: Application
    Filed: May 31, 2001
    Publication date: August 29, 2002
    Applicant: Silicon Bandwidth, Inc.
    Inventors: Stanford W. Crane, Jr., Myoung-soo Jeon, Charley Takeshi Ogata, Ton-Yong Wang, Andreas C. Cangellaris, Jose Schutt-Aine