Patents by Inventor Andreas C. Pfahnl

Andreas C. Pfahnl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6448575
    Abstract: A semiconductor structure for controlling the temperature of a component is described. The structure includes a resistive layer having one or more channels provided therein and having a resistance characteristic such that a signal applied thereto causes the resistive layer to generate heat. A cooling fluid is fed through the one or more channels to cool both the structure and a component disposed on the structure. By providing the cooling channels in the resistive layer, the heating and cooling sources are intermingled. The structure can optionally include precising and vacuum clamping structures, to locate and hold the component that is to be temperature controlled.
    Type: Grant
    Filed: February 2, 2000
    Date of Patent: September 10, 2002
    Assignee: Teradyne, Inc.
    Inventors: Alexander H. Slocum, Andreas C. Pfahnl, Ernest P. Walker, Ronald A. Sartschev
  • Patent number: 6091062
    Abstract: A semiconductor device handler with a temperature controlled test area. Temperature control is provided in part through the use of temperature controlled air forced across the test area. For heating the test area, electrical resistance heaters are uniformly distributed through the test area and are controlled to provide the desired temperature. The handler has a close pitch between adjacent sockets such that is not possible to distribute refrigeration elements over the test area. Instead, a refrigeration element is placed on one side of the test area. To prevent formation of an undesirable temperature gradient, heat is injected at a specific location in the test area.
    Type: Grant
    Filed: January 27, 1998
    Date of Patent: July 18, 2000
    Assignee: Kinetrix, Inc.
    Inventors: Andreas C. Pfahnl, John H. Lienhard, V, Daniel J. Watson
  • Patent number: 6036023
    Abstract: Convective heat transfer enhancement features are formed in trays for carrying and thermally conditioning semiconductor devices or on integrated circuit chip packages. Upward extending ribs, perpendicular to a fluid flow, are formed in the trays and/or packages for increasing the mixing of the fluid flow near the devices under test, thereby enhancing convective heat transfer to or from the devices. Downward extending ribs are also formed in the trays and/or packages. The upward and downward extending ribs formed in the trays are in a staggered relationship for facilitating the stacking of trays. Alternatively, a surface roughness is applied to the trays and/or packages. The surface roughness applied to the packages is such that sufficient smooth regions remain on the packages for allowing pick-and-place machines to handle the packages.
    Type: Grant
    Filed: July 10, 1997
    Date of Patent: March 14, 2000
    Assignee: Teradyne, Inc.
    Inventors: Andreas C. Pfahnl, Alexander H. Slocum, John H. Lienhard, V