Abstract: A device for attaching an object to an attachment rail, particularly a seat rail, in an aircraft or spacecraft. A base part has a support surface to be placed onto an outer surface of the rail, and a locking element to partially protrude from the support surface along a line of protrusion. The base part and locking element are coupled or configured to be coupled wherein the locking element can be moved relative to the base part along the line of protrusion and rotated with respect to the base part. An end section of the locking element has a tip portion shaped in a dovetail-type manner. The device includes a tensioning arrangement for tensioning the locking element with respect to the rail. An arrangement includes such a device as well as an attachment rail with a rail main body and a plurality of bushes. A method for attaching an object, and a seat rail are disclosed.

Abstract: A structure for an aircraft fuselage, the structure comprising a skin having an outer face and an inner face machined as a grid-stiffened panel, a plurality of frames, each frame shaped as the cross section of the fuselage and the frames being arranged one after the other along a longitudinal direction of the fuselage. The outer perimeter of each frame is secured to the inner face, a plurality of stringers extend parallel to the longitudinal direction, each stringer extending across multiple frames, passing through these at an opening provided to that end in each frame, and each stringer is pressed against the inner face and secured thereto. In the upper part and in the lower part of the fuselage, a torsion box is provided extending parallel to the longitudinal direction, each torsion box comprising a horizontal plate and tabs which secure the plate to the inner face.

Abstract: A structure for an aircraft fuselage, the structure comprising a skin having an outer face and an inner face machined as a grid-stiffened panel, a plurality of frames, each frame shaped as the cross section of the fuselage and the frames being arranged one after the other along a longitudinal direction of the fuselage. The outer perimeter of each frame is secured to the inner face, a plurality of stringers extend parallel to the longitudinal direction, each stringer extending across multiple frames, passing through these at an opening provided to that end in each frame, and each stringer is pressed against the inner face and secured thereto. In the upper part and in the lower part of the fuselage, a torsion box is provided extending parallel to the longitudinal direction, each torsion box comprising a horizontal plate and tabs which secure the plate to the inner face.

Abstract: The invention relates to the use of a hybrid material comprising a) an organopolysilazane material and b) at least one surface-modified nanoscale inorganic oxide as coating material for producing transparent layers having a thickness of less than 500 ?m in optoelectronic components.

Abstract: A hybrid material for light emitting diodes, comprising a) an organopolysilazane material, comprising repeating units of formulae (I) and (II) [—SiR1R2—NR3—]x??(I) [—SiHR4—NR5—]y??(II) wherein the symbols and indices have the following meanings: R1 is C2-C6-alkenyl or C4-C6-alkadienyl; R2 is H or an organic group; R3 is H or an organic group; R4 is H or an organic group; R5 is H or an organic group; x is 0.001 to 0.2; and y is 2x to (1?x), with the proviso that x+y?1 and that y can be 0 if R2 is H, and b) inorganic nanoparticles having a mean diameter in the range of from 1 to 30 nm, which are surface modified with a capping agent comprising a C1-C18-alkyl and/or C1-C18-alkenyl group, is useful as encapsulation material for LEDs.

Abstract: The invention relates to the use of a hybrid material comprising a) an organopolysilazane material and b) at least one surface-modified nanoscale inorganic oxide as coating material for producing transparent layers having a thickness of less than 500 ?m in optoelectronic components.

Abstract: A hybrid material for light emitting diodes, comprising a) an organopolysilazane material, comprising repeating units of formulae (I) and (II) [—SiR1R2—NR3—]x??(I) [—SiHR4—NR5—]y??(II) wherein the symbols and indices have the following meanings: R1 is C2-C6-alkenyl or C4-C6-alkadienyl; R2 is H or an organic group; R3 is H or an organic group; R4 is H or an organic group; R5 is H or an organic group; x is 0.001 to 0.2; and y is 2x to (1?x), with the proviso that x+y?1 and that y can be 0 if R2 is H, and b) inorganic nanoparticles having a mean diameter in the range of from 1 to 30 nm, which are surface modified with a capping agent comprising a C1-C18-alkyl and/or C1-C18-alkenyl group, is useful as encapsulation material for LEDs.

Abstract: The invention relates to a process for the preparation of a photosensitive photoresist solution, characterized in that a novolak resin and a diazonaphthoquinonesulphonyl chloride are dissolved in a solvent from the group consisting of the photoresist solvents, a proportion of from 1 to 70 mol % of the phenolic hydroxyl groups of the novolak resin is reacted with diazonaphthoquinonesulphonyl chloride in the presence of a base, and the reaction mixture is washed with water and optionally diluted with further photoresist solvent.