Abstract: A micromechanical sensor includes a substrate having a cavity; a flexible diaphragm spanning the cavity; and a lever element that spans the diaphragm and has a first and second end section on opposite sides of a center section. A first joint element is between the first end section and the substrate and a second joint element is between the center section and the diaphragm. The lever element can be pivoted due to a deflection of the diaphragm. Two capacitive sensors are provided, each having two electrodes, one electrode of each sensor being mounted at one of the end sections of the lever element, and the other being mounted on the substrate. The electrodes are disposed so that distances between the electrodes of different sensors are influenced oppositely when the lever element is pivoted. Also, an actuator is provided for applying an actuating force between the lever element and the substrate.

Abstract: A micromechanical sensor includes a substrate having a cavity; a flexible diaphragm that spans the cavity; and a lever element that spans the diaphragm and has a first and a second end section, the end sections lying on opposite sides of a center section. A first joint element is fitted between the first end section and the substrate and a second joint element is fitted between the center section and the diaphragm, so that the lever element is able to be pivoted due to a deflection of the diaphragm. In addition, two capacitive sensors are provided, each having two electrodes, one electrode of each sensor being mounted at one of the end sections of the lever element, and the other being mounted on the substrate. The electrodes of the sensors are disposed in such a way that distances between the electrodes of different sensors are influenced oppositely when the lever element is pivoted. Moreover, the sensor includes an actuator for applying an actuating force between the lever element and the substrate.

Abstract: A micromirror assembly is described as including a spring-mounted mirror and at least one stop unit, which is designed to restrict a movement of the mirror in the event of a movement of the mirror in a predefined direction out of its idle position. Furthermore, the invention relates to a projection device.

Abstract: A micromirror device including a drive unit, which includes a movable drive element, which is situated in a first plane, and a guiding device, and a mirror, which is elastically coupled to the drive element and is situated in the idle position in a second plane, which is in parallel to the first plane, the guiding device being designed to guide a movement of the drive element on a straight line situated in the first plane. Furthermore, a corresponding projection device is described.

Abstract: An apparatus for eutectic bonding includes (a) a bonding frame that includes two substrates and (b) a frame device situated on the substrates, the frame device including two frames, the apparatus being usable to develop a eutectic, formed during bonding, in a spatially defined manner, whereby a volume formed by the frames and the substrates can be filled up completely with the eutectic.

Abstract: A micromechanical component includes: a hermetically sealed housing; a first functional element that is situated inside the housing; a first structured electrically conductive layer that contacts the first functional element and that is situated inside the housing; and a second structured electrically conductive layer, the first conductive layer being electrically contacted via the second conductive layer, and the second conductive layer being electrically contacted laterally through the housing via a hermetic through-contacting in the second conductive layer.

Abstract: A micromirror assembly is described as including a spring-mounted mirror and at least one stop unit, which is designed to restrict a movement of the mirror in the event of a movement of the mirror in a predefined direction out of its idle position. Furthermore, the invention relates to a projection device.

Abstract: A micromirror device including a drive unit, which includes a movable drive element, which is situated in a first plane, and a guiding device, and a mirror, which is elastically coupled to the drive element and is situated in the idle position in a second plane, which is in parallel to the first plane, the guiding device being designed to guide a movement of the drive element on a straight line situated in the first plane. Furthermore, a corresponding projection device is described.

Abstract: A micromechanical component includes: at least one micromirror; and an integrated photodiode. The micromechanical component is part of a microprojector which further includes a light source. The integrated photodiode of the micromechanical component receives light from the light source.

Abstract: An apparatus for eutectic bonding includes (a) a bonding frame that includes two substrates and (b) a frame device situated on the substrates, the frame device including two frames, the apparatus being usable to develop a eutectic, formed during bonding, in a spatially defined manner, whereby a volume formed by the frames and the substrates can be be filled up completely with the eutectic.

Abstract: A micromechanical component includes: a hermetically sealed housing; a first functional element that is situated inside the housing; a first structured electrically conductive layer that contacts the first functional element and that is situated inside the housing; and a second structured electrically conductive layer, the first conductive layer being electrically contacted via the second conductive layer, and the second conductive layer being electrically contacted laterally through the housing via a hermetic through-contacting in the second conductive layer.

Abstract: A micromechanical component includes: at least one micromirror; and an integrated photodiode. The micromechanical component is part of a microprojector which further includes a light source. The integrated photodiode of the micromechanical component receives light from the light source.

Abstract: A connecting structure for micromechanical oscillating devices, in particular micromechanical oscillating mirrors. The connecting structure is at least indirectly connectable to a micromechanical oscillating structure, on the one hand, and to an elastic element, on the other hand, for measuring torsions of the micromechanical oscillating structure, and includes at least one, in particular at least two, preferably three, legs which are situated parallel to a rotation axis of the micromechanical oscillating structure, and at least one further leg which is situated perpendicularly to the rotation axis.

Abstract: A connecting structure for micromechanical oscillating devices, in particular micromechanical oscillating mirrors. The connecting structure is at least indirectly connectable to a micromechanical oscillating structure, on the one hand, and to an elastic element, on the other hand, for measuring torsions of the micromechanical oscillating structure, and includes at least one, in particular at least two, preferably three, legs which are situated parallel to a rotation axis of the micromechanical oscillating structure, and at least one further leg which is situated perpendicularly to the rotation axis.

Abstract: A micromechanical sensor and a method for manufacturing a micromechanical sensor which has at least one membrane are provided. The membrane is made of a first material which is accommodated in a surrounding second material, and the membrane is configured for sensing a medium surrounding it. The membrane is reinforced, at least partly, by a third material at break-sensitive points on the membrane rim. Reinforcement of the membrane rim increases the stability and thus also the service life of the membrane and the sensor.

Abstract: A micromechanical sensor and a method for manufacturing a micromechanical sensor which has at least one membrane are provided. The membrane is made of a first material which is accommodated in a surrounding second material, and the membrane is configured for sensing a medium surrounding it. The membrane is reinforced, at least partly, by a third material at break-sensitive points on the membrane rim. Reinforcement of the membrane rim increases the stability and thus also the service life of the membrane and the sensor.

Abstract: A micromechanical apparatus, a pressure sensor, and a method, a closed cavity being provided beneath a membrane, the membrane having a greater thickness in a first membrane region than in a second membrane region.

Abstract: A micromechanical component, in particular a pressure sensor, including a substrate that has a membrane region, a surrounding region of the membrane region, at least one measuring resistance provided in the membrane region and modifiable by deformation of the membrane region, and a corresponding evaluation circuit provided in the surrounding region. An interference effect on the measuring resistance is producible by way of a deformation of parts, in particular conductor paths, of the evaluation circuit relative to the substrate. The invention also creates a corresponding equalization method on a test chip or as an individual final equalization.

Abstract: The invention creates a micromechanical component, in particular a pressure sensor, comprising: a substrate (2) that has a membrane region (10) and a surrounding region of the membrane region (10); at least one measuring resistance (4a, 4b; 41, 42) provided in the membrane region (10) and modifiable by deformation of the membrane region (10); a corresponding evaluation circuit (50) provided in the surrounding region, an interference effect on the measuring resistance (4a, 4b; 41, 42) being producible by way of a deformation of parts, in particular conductor paths, of the evaluation circuit (50) relative to the substrate (2); and at least one patch (60; 70, 70′) provided in the surrounding region and/or in the membrane region (10) and made of a material such that by way of a deformation of the patch or patches (60) relative to the substrate (2), an analog interference effect can be generated in such a way that the interference effect acting on the measuring resistance (4a, 4b; 41, 42) can be compensated

Abstract: A pressure sensor includes a metallic membrane and a frame. For detecting the deflection of the membrane, a silicon bridge element having piezoresistive resistor elements is arranged on the membrane and the frame.