Patents by Inventor Andreas Eifler

Andreas Eifler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive line comprising a capping layer
    Patent number: 7777266
    Abstract: An integrated circuit includes a conductive line, the conductive line having a conductive layer made of a metal or a first compound including a metal and a capping layer made of a second compound comprising the metal, the capping layer being in contact with the conductive layer, the first compound being different from the second compound.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: August 17, 2010
    Assignee: Qimonda AG
    Inventors: Peter Baars, Andreas Eifler, Klaus Muemmler, Stefan Tegen
  • CONDUCTIVE LINE COMPRISING A CAPPING LAYER
    Publication number: 20090140307
    Abstract: An integrated circuit includes a conductive line, the conductive line having a conductive layer made of a metal or a first compound including a metal and a capping layer made of a second compound comprising the metal, the capping layer being in contact with the conductive layer, the first compound being different from the second compound.
    Type: Application
    Filed: November 29, 2007
    Publication date: June 4, 2009
    Inventors: Peter Baars, Andreas Eifler, Klaus Muemmler, Stefan Tegen