Abstract: A device and method for at least partial loosening of a connecting layer of a temporarily bonded substrate stack. The device has at least one ring, whereby the substrate stack can be placed within the at least one ring, the at least one ring having a plurality of nozzles. The nozzles are arranged distributed at least over a portion of the periphery of the at least one ring, the nozzles directed onto the connecting layer. The device sprays solvent from the nozzles onto an edge area of the connecting layer.

Abstract: A substrate stack holder and a container comprising a multiplicity of such substrate stack holders as well as a method for parting a substrate stack.

Abstract: A method for temporary coating of cavities, which at least partially run through a semiconductor substrate and are provided for a permanent coating and/or equipping, with a temporarily applied coating material before processing steps for processing at least one surface of the semiconductor substrate. In addition, a method for removing a temporary coating of cavities of a semiconductor substrate, whereby the coating is applied according to a previously-mentioned method and whereby, in particular immediately afterwards, a permanent coating and/or equipping of the cavities is carried out.

Abstract: A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding.