Patents by Inventor Andreas Fehkuhrer
Andreas Fehkuhrer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11742205Abstract: A method and device for bonding a first substrate with a second substrate inside a sealed bonding chamber. The method includes: a) fixing of the first and second substrates, b) arranging of the first and second substrates, c) mutual approaching of the first and second substrates, d) contacting the first and second substrates at respective bond initiation points, e) generating a bonding wave running from the bond initiation points to side edges of the substrates, and f) influencing the bonding wave during course of the bonding wave, wherein targeted influencing of the bonding wave takes place by a regulated and/or controlled change of pressure inside the bonding chamber.Type: GrantFiled: July 16, 2021Date of Patent: August 29, 2023Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Andreas Fehkuhrer
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Publication number: 20210343530Abstract: A method and device for bonding a first substrate with a second substrate inside a sealed bonding chamber. The method includes: a) fixing of the first and second substrates, b) arranging of the first and second substrates, c) mutual approaching of the first and second substrates, d) contacting the first and second substrates at respective bond initiation points, e) generating a bonding wave running from the bond initiation points to side edges of the substrates, and f) influencing the bonding wave during course of the bonding wave, wherein targeted influencing of the bonding wave takes place by a regulated and/or controlled change of pressure inside the bonding chamber.Type: ApplicationFiled: July 16, 2021Publication date: November 4, 2021Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Andreas Fehkuhrer
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Patent number: 11101132Abstract: A method and device for bonding a first substrate with a second substrate inside a sealed bonding chamber. The method includes: a) fixing of the first and second substrates, b) arranging of the first and second substrates, c) mutual approaching of the first and second substrates, d) contacting the first and second substrates at respective bond initiation points, e) generating a bonding wave running from the bond initiation points to side edges of the substrates, and f) influencing the bonding wave during course of the bonding wave, wherein targeted influencing of the bonding wave takes place by a regulated and/or controlled change of pressure inside the bonding chamber.Type: GrantFiled: May 21, 2020Date of Patent: August 24, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Andreas Fehkuhrer
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Publication number: 20200286733Abstract: A method and device for bonding a first substrate with a second substrate inside a sealed bonding chamber. The method includes: a) fixing of the first and second substrates, b) arranging of the first and second substrates, c) mutual approaching of the first and second substrates, d) contacting the first and second substrates at respective bond initiation points, e) generating a bonding wave running from the bond initiation points to side edges of the substrates, and f) influencing the bonding wave during course of the bonding wave, wherein targeted influencing of the bonding wave takes place by a regulated and/or controlled change of pressure inside the bonding chamber.Type: ApplicationFiled: May 21, 2020Publication date: September 10, 2020Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Andreas Fehkuhrer
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Patent number: 10755930Abstract: A method and device for bonding a first substrate with a second substrate inside a sealed bonding chamber. The method includes: a) fixing of the first and second substrates, b) arranging of the first and second substrates, c) mutual approaching of the first and second substrates, d) contacting the first and second substrates at respective bond initiation points, e) generating a bonding wave running from the bond initiation points to side edges of the substrates, and f) influencing the bonding wave during course of the bonding wave, wherein targeted influencing of the bonding wave takes place by a regulated and/or controlled change of pressure inside the bonding chamber.Type: GrantFiled: March 5, 2020Date of Patent: August 25, 2020Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Andreas Fehkuhrer
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Patent number: 10755929Abstract: A method and a device for bonding a first substrate with a second substrate inside a sealed bonding chamber. The method includes: a) fixing of the first and second substrates, b) arranging of the first and second substrates, c) mutual approaching of the first and second substrates, d) contacting the first and second substrates at respective bond initiation points, e) generating a bonding wave running from the bond initiation points to side edges of the substrates, and f) influencing the bonding wave during course of the bonding wave, wherein targeted influencing of the bonding wave takes place by a regulated and/or controlled change of pressure inside the bonding chamber.Type: GrantFiled: February 16, 2016Date of Patent: August 25, 2020Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Andreas Fehkuhrer
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Publication number: 20200203165Abstract: A method and device for bonding a first substrate with a second substrate inside a sealed bonding chamber. The method includes: a) fixing of the first and second substrates, b) arranging of the first and second substrates, c) mutual approaching of the first and second substrates, d) contacting the first and second substrates at respective bond initiation points, e) generating a bonding wave running from the bond initiation points to side edges of the substrates, and f) influencing the bonding wave during course of the bonding wave, wherein targeted influencing of the bonding wave takes place by a regulated and/or controlled change of pressure inside the bonding chamber.Type: ApplicationFiled: March 5, 2020Publication date: June 25, 2020Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Andreas Fehkuhrer
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Patent number: 10475672Abstract: A device and method for at least partial loosening of a connecting layer of a temporarily bonded substrate stack. The device has at least one ring, whereby the substrate stack can be placed within the at least one ring, the at least one ring having a plurality of nozzles. The nozzles are arranged distributed at least over a portion of the periphery of the at least one ring, the nozzles directed onto the connecting layer. The device sprays solvent from the nozzles onto an edge area of the connecting layer.Type: GrantFiled: November 3, 2015Date of Patent: November 12, 2019Assignee: EV Group E. Thallner GmbHInventor: Andreas Fehkuhrer
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Publication number: 20190148148Abstract: A method and a device for bonding a first substrate with a second substrate inside a sealed bonding chamber. The method includes: a) fixing of the first and second substrates, b) arranging of the first and second substrates, c) mutual approaching of the first and second substrates, d) contacting the first and second substrates at respective bond initiation points, e) generating a bonding wave running from the bond initiation points to side edges of the substrates, and f) influencing the bonding wave during course of the bonding wave, wherein targeted influencing of the bonding wave takes place by a regulated and/or controlled change of pressure inside the bonding chamber.Type: ApplicationFiled: February 16, 2016Publication date: May 16, 2019Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Andreas Fehkuhrer
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Publication number: 20190109034Abstract: A method and device for temporarily bonding a product substrate to a carrier substrate. The method includes a) applying a bonding adhesive to the product substrate and/or the carrier substrate to form a bonding adhesive layer having first and second areas; b) connecting the carrier substrate to the product substrate via the bonding adhesive layer; and c) after step b), hardening only the first area of the bonding adhesive layer, wherein the second area of the bonding adhesive layer is not hardened or at least is not substantially hardened.Type: ApplicationFiled: April 4, 2017Publication date: April 11, 2019Applicant: EV Group E. Thallner GmbHInventor: Andreas Fehkuhrer
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Patent number: 10049902Abstract: A substrate stack holder, a container comprising a plurality of substrate stack holders, and a method for parting a substrate stack. The substrate stack holder includes (a) a holding and separating device for (i) holding a substrate stack during a parting process in which the substrate stack is split into a first substrate stack part and a second substrate stack part, said substrate stack comprised of a first substrate, a second substrate, and a connecting region therebetween, and (ii) separating the first substrate stack part from the second substrate stack part after the parting process; and (b) a fixing device for receiving and fixing the separated first and second substrate stack parts.Type: GrantFiled: August 19, 2015Date of Patent: August 14, 2018Assignee: EV GROUP E. THALLNER GMBHInventor: Andreas Fehkuhrer
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Publication number: 20180174832Abstract: A method and device for coating a substrate with a film layer. The device comprises application means for applying a thermoplastic film layer material and distribution means for distributing the film layer material on the substrate for the formation of the film layer.Type: ApplicationFiled: October 22, 2015Publication date: June 21, 2018Applicant: EV Group E. Thallner GmbHInventor: Andreas Fehkuhrer
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Publication number: 20180096962Abstract: A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding.Type: ApplicationFiled: November 22, 2017Publication date: April 5, 2018Applicant: EV Group E. Thallner GmbHInventor: Andreas Fehkuhrer
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Patent number: 9922862Abstract: A device for detaching a first substrate from a second substrate in a detaching direction (L) with: at least two elements guided crosswise to the detaching direction (L) and in a radial direction (R) to the first substrate for clamping the first substrate crosswise to the detaching direction (L), a substrate holding device for holding the second substrate, and detaching means for detaching the first substrate from the second substrate by moving the first substrate, attached by the clamping elements, in the detaching direction (L) and/or by moving the substrate holding device opposite to the detaching direction (L). In addition, this invention relates to a corresponding method.Type: GrantFiled: January 28, 2014Date of Patent: March 20, 2018Assignee: EV GROUP E. THALLNER GMBHInventor: Andreas Fehkuhrer
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Publication number: 20180040489Abstract: A device and method for at least partial loosening of a connecting layer of a temporarily bonded substrate stack. The device has at least one ring, whereby the substrate stack can be placed within the at least one ring, the at least one ring having a plurality of nozzles. The nozzles are arranged distributed at least over a portion of the periphery of the at least one ring, the nozzles directed onto the connecting layer. The device sprays solvent from the nozzles onto an edge area of the connecting layer.Type: ApplicationFiled: November 3, 2015Publication date: February 8, 2018Applicant: EV Group E. Thallner GmbHInventor: Andreas FEHKÜHRER
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Patent number: 9859246Abstract: A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding.Type: GrantFiled: December 18, 2014Date of Patent: January 2, 2018Assignee: EV GROUP E. THALLNER GMBHInventor: Andreas Fehkuhrer
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Publication number: 20170316962Abstract: A substrate stack holder and a container comprising a multiplicity of such substrate stack holders as well as a method for parting a substrate stack.Type: ApplicationFiled: August 19, 2015Publication date: November 2, 2017Applicant: EV GROUP E. THALLNER GMBHInventor: Andreas FEHKUHRER
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Patent number: 9786487Abstract: A method for temporary coating of cavities, which at least partially run through a semiconductor substrate and are provided for a permanent coating and/or equipping, with a temporarily applied coating material before processing steps for processing at least one surface of the semiconductor substrate. In addition, a method for removing a temporary coating of cavities of a semiconductor substrate, whereby the coating is applied according to a previously-mentioned method and whereby, in particular immediately afterwards, a permanent coating and/or equipping of the cavities is carried out.Type: GrantFiled: January 9, 2015Date of Patent: October 10, 2017Assignee: EV GROUP E. THALLNER GMBHInventor: Andreas Fehkuhrer
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Publication number: 20160365241Abstract: A method for temporary coating of cavities, which at least partially run through a semiconductor substrate and are provided for a permanent coating and/or equipping, with a temporarily applied coating material before processing steps for processing at least one surface of the semiconductor substrate. In addition, a method for removing a temporary coating of cavities of a semiconductor substrate, whereby the coating is applied according to a previously-mentioned method and whereby, in particular immediately afterwards, a permanent coating and/or equipping of the cavities is carried out.Type: ApplicationFiled: January 9, 2015Publication date: December 15, 2016Applicant: EV GROUP E. THALLNER GMBHInventor: Andreas FEHKUHRER
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Publication number: 20160358881Abstract: A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding.Type: ApplicationFiled: December 18, 2014Publication date: December 8, 2016Applicant: EV GROUP E. THALLNER GMBHInventor: Andreas FEHKUHRER