Abstract: The invention relates to a wiring harness (10) for an airbag module of a vehicle occupant safety system, particularly for a driver's airbag module, having a connector (11) for connecting to a pyrotechnic igniter of the airbag module, at least one module connecting cable (12) connected to the connector (11) for connecting the connector (11) to a vehicle wiring harness, and at least one actuator unit (13) having a pyrotechnic actuator (17) and an actuator connecting cable (14) which is formed integrally with the actuator unit (13) and is connected to the connector (11). The invention further relates to an airbag module, vehicle cabling and a vehicle occupant safety system having a wiring harness of this kind and to a method of production.

Abstract: The invention relates to a wiring harness (10) for an airbag module of a vehicle occupant safety system, particularly for a driver's airbag module, having a connector (11) for connecting to a pyrotechnic igniter of the airbag module, at least one module connecting cable (12) connected to the connector (11) for connecting the connector (11) to a vehicle wiring harness, and at least one actuator unit (13) having a pyrotechnic actuator (17) and an actuator connecting cable (14) which is formed integrally with the actuator unit (13) and is connected to the connector (11). The invention further relates to an airbag module, vehicle cabling and a vehicle occupant safety system having a wiring harness of this kind and to a method of production.

Abstract: An electrical component, e.g., a diplexer or a duplexer, can have one of a number of diverse arrangements for terminal surfaces on the substrate bottom. For example, the terminal surfaces for first and second filters are not disposed at the maximum distance from one another. First and second filters can be disposed as one or two discrete components on the substrate, wherein one filter can be implemented as being integrated in a multilayer substrate.

Abstract: An electrical component, e.g., a diplexer or a duplexer, can have one of a number of diverse arrangements for terminal surfaces on the substrate bottom. For example, the terminal surfaces for first and second filters are not disposed at the maximum distance from one another. First and second filters can be disposed as one or two discrete components on the substrate, wherein one filter can be implemented as being integrated in a multilayer substrate.

Abstract: An electrical component, e.g., a diplexer or a duplexer, can have one of a number of diverse arrangements for terminal surfaces on the substrate bottom. For example, the terminal surfaces for first and second filters are not disposed at the maximum distance from one another. First and second filters can be disposed as one or two discrete components on the substrate, wherein one filter can be implemented as being integrated in a multilayer substrate.

Abstract: An electrical component includes a first signal path and a second signal path electrically connected to a common signal path. The electrical component also includes a first filter in the first signal path and a second filter in the second signal path. The electrical component also includes a first matching circuit comprising a shunt arm to ground. The first matching circuit is electrically connected to the first signal path, the second signal path, and the common signal path.

Abstract: An electrical component, e.g., a diplexer or a duplexer, can have one of a number of diverse arrangements for terminal surfaces on the substrate bottom. For example, the terminal surfaces for first and second filters are not disposed at the maximum distance from one another. First and second filters can be disposed as one or two discrete components on the substrate, wherein one filter can be implemented as being integrated in a multilayer substrate.

Abstract: An electrical component is described with a first signal path (TX, RX1) and a second signal path (RX, RX2) that are connected to a common signal path (ANT, RX12). In the first signal path a first filter (F1) is arranged, and in the second signal path a second filter (F2) is arranged. The component comprises a first matching circuit (MA1) that comprises a shunt arm to ground. In the shunt arm, an inductor (L) is arranged, which is connected to the first signal path, the second signal path, and the common signal path. The component comprises a carrier substrate (SU) on which the filters (F1, F2), which are preferably implemented as chips, are mounted. The inductor (L) is integrated in the carrier substrate (SU).

Abstract: A method for producing a vehicle part with an integrated antenna element includes providing a plastic substrate by a molding process, providing a coating layer by a film coating process, and providing at least one antenna element disposed between the coating layer and the plastic substrate.