Abstract: A MEMS mirror array module can be used in photolithographic projection exposure apparatuses.

Abstract: An optical system for a lithography system comprises: a number of optical elements for guiding radiation; a support device supporting the optical elements; and a plurality of active and/or passive components. The active and/or passive components are arranged on the support device in at least two different planes. The active and/or passive components are arranged on one side of the support device.

Abstract: A mirror arrangement, for example for a lithography system, comprises: a plurality of mirror elements, for example in the form of MEMS mirror modules, for reflecting radiation; a plurality of carrier elements, each having a head region for accommodating one of the mirror elements; and a mount arrangement comprising insert openings, which are designed to accommodate a respective seat portion of the carrier elements. The plurality of carrier elements are accommodated with the seat portions in the insert openings in the mount arrangement. Each carrier element comprises a channel device for guiding a coolant, which comprises an inlet for the coolant and an outlet for the coolant.

Abstract: An assembly for an optical system having a mirror array having a plurality of mirror elements arranged on a first carrier. The first carrier contains control leads to the mirror elements. A first heat transport path can dissipate heat from the mirror array to a cooling mechanism during the operation of the optical system. At least one second heat transport path dissipates heat from the mirror array to a cooling mechanism during the operation of the optical system. The first heat transport path and the at least one second heat transport path are spatially separated from one another at least in regions. The first heat transport path extends via an interface component. The first heat transport path extends via the first carrier and the interface component from the mirror array to a cooling mechanism surrounding the interface component.

Abstract: The invention relates to a method for improving the imaging properties of a micro lithography projection objective, wherein the projection objective has a plurality of lenses between an object plane and an image plane, a first lens of the plurality of lenses being assigned a first manipulator for actively deforming the lens, the first lens being deformed for at least partially correcting an aberration, at least one second lens of the plurality of lenses furthermore being assigned at least one second manipulator, and the second lens being deformed in addition to the first lens. Furthermore, a method is described for selecting at least one lens of a plurality of lenses of a projection objective as actively deformable element, and a projection objective.

Abstract: A damping device of an optical element of a projection exposure machine includes at least two mass dampers arranged spaced apart from one another, the vibration absorbers each having at least one damper mass and at least one damping element and the damper masses of the at least two mass dampers being interconnected by at least one connecting element. The optical element can be part of a projection exposure machine.

Abstract: The invention relates to a method for improving the imaging properties of a micro lithography projection objective, wherein the projection objective has a plurality of lenses between an object plane and an image plane, a first lens of the plurality of lenses being assigned a first manipulator for actively deforming the lens, the first lens being deformed for at least partially correcting an aberration, at least one second lens of the plurality of lenses furthermore being assigned at least one second manipulator, and the second lens being deformed in addition to the first lens. Furthermore, a method is described for selecting at least one lens of a plurality of lenses of a projection objective as actively deformable element, and a projection objective.

Abstract: The invention relates to a method for improving the imaging properties of a micro lithography projection objective, wherein the projection objective has a plurality of lenses between an object plane and an image plane, a first lens of the plurality of lenses being assigned a first manipulator (ml, Mn) for actively deforming the lens, the first lens being deformed for at least partially correcting an aberration, at least one second lens of the plurality of lenses furthermore being assigned at least one second manipulator, and the second lens being deformed in addition to the first lens. Furthermore, a method is described for selecting at least one lens of a plurality of lenses of a projection objective as actively deformable element, and a projection objective.

Abstract: A hexapod system for aligning an optical element in semiconductor clean rooms or in a vacuum, particularly in an illumination device for a microlithographic EUV projection exposure apparatus, comprises six hexapod supporting structures (42, 44, 46, 94; 42?, 44?, 46?, 94?, 106). Using a set of at least two replaceable spacer elements (94; 94?) having a different extent in at least one direction, at least one of the six supporting structures (42, 44, 46, 94; 42?, 44?, 46?, 94?, 106) can be adjusted. The latter is adapted so that a spacer element (94; 94?) can be removed or a spacer element (94; 94?) can be added while the coupling of the first coupling end (46; 46?) to the carrying structure (38; 38?) and the coupling of the second coupling end (54a; 54?) to the optical element (34; 34?) are maintained.

Abstract: The invention relates to a method-for improving the imaging properties of a micro lithography projection objective, wherein the projection objective has a plurality of lenses between an object plane and an image plane, a first lens of the plurality of lenses being assigned a first manipulator (ml, Mn) for actively deforming the lens, the first lens being deformed for at least partially correcting an aberration, at least one second lens of the plurality of lenses furthermore being assigned at least one second manipulator, and the second lens being deformed in addition to the first lens. Furthermore, a method is described for selecting at least one lens of a plurality of lenses of a projection objective as actively deformable element, and a projection objective.

Abstract: The invention relates to a method -for improving the imaging properties of a micro lithography projection objective (50), wherein the projection objective has a plurality of lenses (L1, L2, L3, L4, L5, L6, L7, L8) between an object plane and an image plane, a first lens of the plurality of lenses being assigned a first manipulator (ml, Mn) for actively deforming the lens, the first lens being deformed for at least partially correcting an aberration, at least one second lens of the plurality of lenses furthermore being assigned at least one second manipulator, and the second lens being deformed in addition to the first lens. Furthermore, a method is described for selecting at least one lens of a plurality of lenses of a projection objective as actively deformable element, and a projection objective.

Abstract: There is provided an optical element comprising an optical element body, a reflecting area and an optical passageway. The optical element body defines an axis of rotational symmetry. The reflecting area is disposed on the optical element body and adapted to be optically used in an exposure process. The optical passageway is arranged within the optical element body and allows light to pass the optical element body, the optical passageway being arranged eccentrically with respect to the axis of rotational symmetry.

Abstract: A projection objective for a microlithography apparatus with improved imaging properties is provided. A manipulator for a projection objective is provided. A microlithography apparatus including a projection objective of this type and/or a manipulator of this type is provided. A method for improving the imaging properties of a projection objective is provided.

Abstract: In the case of a method of producing aspherical optical surfaces of optical elements (1), in particular for use in microlithography for producing semiconductor elements, the optical element (1) is ground for example in the form of a meniscus. In a first method step, the optical element (1) is introduced into a basic form (2), which has a spherical form bed and is being held at a distance over the form bed (3). After that, an intermediate medium (6) is introduced in the basic form (2) between the optical element (1) and the form bed (3) and, subsequently the optical element (1) being removed together with the intermediate medium (6) from the basic form. Then, the spherical form bed (3) of the basic form (2) or a second basic form is transformed into an aspherical form bed (3?) computationally determined in advance.

Abstract: The invention relates to a method -for improving the imaging properties of a micro lithography projection objective (50), wherein the projection objective has a plurality of lenses (L1, L2, L3, L4, L5, L6, L7, L8) between an object plane and an image plane, a first lens of the plurality of lenses being assigned a first manipulator (ml, Mn) for actively deforming the lens, the first lens being deformed for at least partially correcting an aberration, at least one second lens of the plurality of lenses furthermore being assigned at least one second manipulator, and the second lens being deformed in addition to the first lens. Furthermore, a method is described for selecting at least one lens of a plurality of lenses of a projection objective as actively deformable element, and a projection objective.

Abstract: An optical subassembly with an optical element, for example a mirror element (7), has an optical surface (9) and bearing points (12) arranged on the circumference. The optical element (7) is connected to a mount (13) at the bearing points (12) via connecting elements (14, 15, 16, 17, 18). Stress-decoupling cutouts, for example curved slots (11), are provided between the optical surface (9) and the bearing points (12).

Abstract: An optical subassembly with an optical element, for example a mirror element (7), has an optical surface (9) and bearing points (12) arranged on the circumference. The optical element (7) is connected to a mount (13) at the bearing points (12) via connecting elements (14, 15, 16, 17, 18). Stress-decoupling cutouts, for example curved slots (11), are provided between the optical surface (9) and the bearing points (12).

Abstract: There is provided an optical element comprising an optical element body, a reflecting area and an optical passageway. The optical element body defines an axis of rotational symmetry. The reflecting area is disposed on the optical element body and adapted to be optically used in an exposure process. The optical passageway is arranged within the optical element body and allows light to pass the optical element body, the optical passageway being arranged eccentrically with respect to the axis of rotational symmetry.

Abstract: In the case of a method of producing aspherical optical surfaces of optical elements (1), in particular for use in microlithography for producing semiconductor elements, the optical element (1) is ground for example in the form of a meniscus. In a first method step, the optical element (1) is introduced into a basic form (2), which has a spherical form bed and is being held at a distance over the form bed (3). After that, an intermediate medium (6) is introduced in the basic form (2) between the optical element (1) and the form bed (3) and, subsequently the optical element (1) being removed together with the intermediate medium (6) from the basic form. Then, the spherical form bed (3) of the basic form (2) or a second basic form is transformed into an aspherical form bed (3?) computationally determined in advance.