Abstract: A semi-transparent coating material for coating glass or glass ceramics includes at least one sol-gel hybrid-polymer coating system having a hybrid-polymer or inorganic sol-gel-based matrix, and nanoparticles and nanoscale pigments and/or dyes are added to the hybrid-polymer or inorganic sol-gel-based matrix.

Abstract: The present invention relates to the use of modified nanoparticles in wood based panels, in particular OSB-panels for reduction of the emission of volatile organic compounds (VOCs). The invention further relates to a wood based panel containing the modified particles and to a method for producing such a wood based panel.

Abstract: The present invention relates to a hybrid adhesive, in particular for use in the production of engineered wood such as particle boards, fiber boards, plywood or glued-laminated timber, comprising at least one polycondensation adhesive, at least one polyaddition adhesive, and at least one particular, in particular a nanoparticle smaller than 500 nm, wherein the at least one particle is modified with at least one compound of the general Formula (I) RaSiX(4-a), or the general Formula (II) ObXc(OH)dReSiO(4-b-c-d-e)/2. The present invention also relates to the use of the adhesive in engineered wood boards and to methods for the production thereof.

Abstract: A coating solution made from a mixture of at least one silane and at least one polysiloxane which can be hardened on a substrate by hydrolysis and condensation to give a coating on the substrate, wherein the at least one silane is of general formula RxSi(OR?)4-x and the at least one polysiloxane is of general formula [R2SiO]y or R3Si—(O—SiR2)Y—O—SiR3, where R independently=alkyl, aryl, arylalkyl, alkylaryl or H, Rprime independently=H, methyl, ethyl, n- or i-propyl, n-, iso-, sec.- or tert.-butyl, x=0 or 1 (for the first silane), x=0, 1, 2, 3 or 4 (for each further silane) and y=a whole number of at least 2, wherein the coating solution includes at least one alkali or earth alkali oxide or hydroxide.

Abstract: A composite material designed as a substrate glass for LED's is provided. The composite material includes a structured coating made of a hybrid polymer matrix that contains nanoparticles made of an oxide.

Abstract: A process for functionalizing hard material includes reacting at least one anchor molecule with at least one hard material particle, where an anchor molecule has at least one silane bonding group and at least one polymerizable group. A functionalized hard material, in particular a-alumina, and surface coatings containing functionalized hard material, and a workpiece, in particular a wood material panel, an abrasive or a clutch disc, which is in each case provided with a surface coating containing functionalized hard material are described.

Abstract: A coating solution made from a mixture of at least one silane and at least one polysiloxane which can be hardened on a substrate by hydrolysis and condensation to give a coating on the substrate, wherein the at least one silane is of general formula PxSi(OR?)4?x and the at least one polysiloxane is of general formula [R2SiO]y or R3Si—(O—SiR2)Y—O—SiR3, where R independently=alkyl, aryl, arylalkyl, alkylaryl or H, Rprime independently=H, methyl, ethyl, n- or i-propyl, n-, iso-, sec.- or tert.-butyl, x=0 or 1 (for the first silane), x=0, 1 , 2, 3 or 4 (for each further silane) and y=a whole number of at least 2, wherein the coating solution includes at least one alkali or earth alkali oxide or hydroxide.

Abstract: The invention relates to a method for microstructuring electronic components, which yields high resolutions (?200 nm) at a good aspect ratio while being significantly less expensive than photolithographic methods. The inventive method comprises the following steps: i) a planar unhardened sol film of a nanocomposite composition according to claim 1 is produced; ii) a target substrate consisting of a bottom coat (b) and a support (c) is produced; iii) sol film material obtained in step i) is applied to the bottom coat (b) obtained in step ii) by means of a microstructured transfer embossing stamp; iv) the applied sol film material is hardened; v) the transfer embossing stamp is separated, whereby an embossed microstructure is obtained as a top coat (a).

Abstract: The invention relates to a method for microstructuring electronic components, which yields high resolutions (?200 nm) at a good aspect ratio while being significantly less expensive than photolithographic methods. The inventive method comprises the following steps: i) a planar unhardened sol film of a nanocomposite composition according to claim 1 is produced; ii) a target substrate consisting of a bottom coat (b) and a support (c) is produced; iii) sol film material obtained in step i) is applied to the bottom coat (b) obtained in step ii) by means of a microstructured transfer embossing stamp; iv) the applied sol film material is hardened; v) the transfer embossing stamp is separated, whereby an embossed microstructure is obtained as a top coat (a).

Abstract: A method is described for producing a microstructured surface relief by applying to a substrate a coating composition which is thixotropic or which acquires thixotropic properties by pretreatment on the substrate, embossing the surface relief into the applied thixotropic coating composition with an embossing device, and curing the coating composition following removal of the embossing device. The substrates obtainable by this method, provided with a microstructured surface relief, are particularly suitable for optical, electronic, micromechanical and/or dirt repellency applications.

Abstract: A coating composition comprises a polycondensate obtained by reacting a prehydrolysate based on at least on epoxide-containing hydrolysable silane; at least one amine component selected from a prehydrolysate based on at least one amino-containing hydrolysable silane and an amine compound containing at least two amino groups; and an amino group protective reagent. The coating composition is particulary suitable for coating glass, glass ceramic, ceramic, and plastic, and permits an increase in strength and protection against damage.

Abstract: A method is described for producing a microstructured surface relief by applying to a substrate a coating composition which is thixotropic or which acquires thixotropic properties by pretreatment on the substrate, embossing the surface relief into the applied thixotropic coating composition with an embossing device, and curing the coating composition following removal of the embossing device. The substrates obtainable by this method, provided with a microstructured surface relief, are particularly suitable for optical, electronic, micromechanical and/or dirt repellency applications.