Patents by Inventor Andreas Grundmann

Andreas Grundmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pelletizing die with even heat distribution and with polymer channel to orifice transition zone, process for orifice thermal stabilization and process for forming a pelletizing die with brazing and thin hard face layer
    Patent number: 6976834
    Abstract: A pelletizing die includes a pelletizing die member with a die exit side exposed to cooling fluid and a die entry side for receiving polymer fed thereto. The die member has a plurality of polymer channels and a plurality of extrusion orifices connected to a respective one of the channels to form a extrusion orifice section. A heating medium system has additional heating medium conduits between channels and a supply and intermediate header for heating the channels (radially from each side) and providing once in and once out heating medium flow. The die member may be formed by high temperature brazing of components using coordinated solder (Ni based or gold-nickel) and component heat treatment temperature. A thin hard face coating may be provided on raised extrusion orifice ring faces around each extrusion orifice section.
    Type: Grant
    Filed: July 9, 2001
    Date of Patent: December 20, 2005
    Assignee: Borsig GmbH
    Inventors: Clifton T. Knight, Judeth Brannon Corry, Jürgen Blum, Andreas Grundmann, Dieter Bormann, Andreas Forster
  • Pelletizing die with even heat distribution and with polymer channel to orifice transition zone, process for orifice thermal stabilization and process for forming a pelletizing die with brazing and thin hard face layer
    Publication number: 20030008026
    Abstract: A pelletizing die includes a pelletizing die member with a die exit side exposed to cooling fluid and a die entry side for receiving polymer fed thereto. The die member has a plurality of polymer channels and a plurality of extrusion orifices connected to a respective one of the channels to form a extrusion orifice section. A heating medium system has additional heating medium conduits between channels and a supply and intermediate header for heating the channels (radially from each side) and providing once in and once out heating medium flow. The die member may be formed by high temperature brazing of components using coordinated solder (Ni based or gold-nickel) and component heat treatment temperature. A thin hard face coating may be provided on raised extrusion orifice ring faces around each extrusion orifice section.
    Type: Application
    Filed: July 9, 2001
    Publication date: January 9, 2003
    Inventors: Clifton T. Knight, Judeth Brannon Corry, Jurgen Blum, Andreas Grundmann, Dieter Bormann, Andreas Forster