Abstract: A method for controlling an electrical drive of an electrically driven air compressor of a motor vehicle and a corresponding control circuit. A prevailing load torque of the air compressor that is applied at a drive shaft of the compressed air compressor is estimated as a function of at least one operating parameter and is fed forward as an estimated disturbance variable to the control circuit of the electrical drive to reduce a control error produced as a result of the prevailing load torque.

Abstract: A method for controlling an electrical drive of an electrically driven air compressor of a motor vehicle and a corresponding control circuit. A prevailing load torque of the air compressor that is applied at a drive shaft of the compressed air compressor is estimated as a function of at least one operating parameter and is fed forward as an estimated disturbance variable to the control circuit of the electrical drive to reduce a control error produced as a result of the prevailing load torque.

Abstract: A high-brightness LED module includes a substrate with a recess in which a light emitting element is mounted. The recess is defined by a sidewalls and a relatively thin membrane. At least two micro-vias are provided in the membrane and include conductive material that passes through the membrane. A p-contact of the light emitting element is coupled to a first micro-via and an n-contact of the light emitting element is coupled to a second micro-via.

Abstract: A leadless package and method for manufacturing silicon based leadless QFN/SON compatible packages are described. In addition the package allows for hermetic sealing of devices while maintaining electrical and optical access. Micro-vias with feed-through metallization through a silicon structure facilitates a surface mount technology-compatible silicon package with bottom SMT pads and top surface device integration. Sloped edges on the SMT side enable solder filleting for post solder inspection. Hermetic seal can be attained for example using anodic bonding of a glass lid or using metal soldering. Metal soldering enables the use of solder bumps to provide electrical connections for the package to the lid with integrated device functionality used for sealing. Hermetically sealed silicon packages eliminates the need for an extra packaging layer required in plastic packages and provides a standard interface for enclosing one or more discrete devices.