Patents by Inventor Andreas Heckmann

Andreas Heckmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12152290
    Abstract: A powder has the contents (in wt. %): C max. 0.5%, S max. 0.15%, in particular max. 0.03%, N max. 0.25%, Cr 14-35%, in particular 17-28%, Ni radical (>38%), Mn max. 4%, Si max. 1.5%, Mo>0-22%, Ti<4%, in particular <3.25%, Nb up to 6.0%, Cu up to 3%, in particular up to 0.5%, Fe<50%, P max. 0.05%, in particular max. 0.04%, Al up to 3.15%, in particular up to 2.5%, Mg max. 0.015%, V max. 0.6%, Zr max. 0.12%, in particular max. 0.1%, W up to 4.5%, in particular up to max. 3%, Co up to 28%, B<0.125%, O>0.00001-0.1% and impurities due to production, wherein Ni+Fe+Co represents 56-80% Nb+Ta<6.0%.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: November 26, 2024
    Assignee: VDM Metals International GmbH
    Inventors: Christina Schmidt, Andreas Heckmann
  • Publication number: 20220205066
    Abstract: A powder has the contents (in wt. %): C max. 0.5%, S max. 0.15%, in particular max. 0.03%, N max. 0.25%, Cr 14-35%, in particular 17-28%, Ni radical (>38%), Mn max. 4%, Si max. 1.5%, Mo >0-22%, Ti <4%, in particular <3.25%, Nb up to 6.0%, Cu up to 3%, in particular up to 0.5%, Fe <50%, P max. 0.05%, in particular max. 0.04%, Al up to 3.15%, in particular up to 2.5%, Mg max. 0.015%, V max. 0.6%, Zr max. 0.12%, in particular max. 0.1%, W up to 4.5%, in particular up to max. 3%, Co up to 28%, B<0.125%, O>0.00001-0.1% and impurities due to production, wherein Ni+Fe+Co represents 56-80% Nb+Ta<6.0%.
    Type: Application
    Filed: July 1, 2020
    Publication date: June 30, 2022
    Applicant: VDM Metals International GmbH
    Inventors: Christina SCHMIDT, Andreas HECKMANN
  • Patent number: 10923248
    Abstract: A method for producing a metal film from an over 50% nickel alloy melts more than one ton of the alloy in a furnace, followed by VOD or VLF system treatment, then pouring off to form a pre-product, followed by re-melting by VAR and/or ESU. The pre-product is annealed 1-300 hours between 800 and 1350° C. under air or protection gas, then hot-formed between 1300 and 600° C., such that the pre-product then has 1-100 mm thickness after the forming and is not recrystallized, recovered, and/or (dynamically) recrystallized having a grain size below 300 ?m. The pre-product is pickled, then cold-formed to produce a film having 10-600 ?m end thickness and a deformation ratio greater than 90%. The film is cut into 5-300 mm strips, annealed 1 second to 5 hours under protection gas between 600 and 1200° C. in a continuous furnace, then recrystallized to have a high cubic texture proportion.
    Type: Grant
    Filed: June 6, 2014
    Date of Patent: February 16, 2021
    Assignee: VDM Metals International GmbH
    Inventors: Nicole De Boer, Stefan Gilges, Heike Hattendorf, Andreas Heckmann
  • Publication number: 20160071632
    Abstract: A method for producing a metal film from an alloy having more than 50% nickel includes the following steps: (a) the alloy is melted in volumes of more than one ton in a vacuum induction furnace, or open in an induction or arc furnace, followed by treatment in a VOD or VLF system, (b) the alloy is then poured off in blocks, electrodes or as continuous casting to form a pre-product, followed by single or multiple re-melting by VAR and/or ESU (c) the pre-product is then annealed between 800 and 1350° C. for 1-300 hours under air or protection gas, (d) the pre-product is then hot-formed between 1300 and 600° C. to reduce the thickness of the input material by the factor 1.
    Type: Application
    Filed: June 6, 2014
    Publication date: March 10, 2016
    Applicant: VDM METALS GMBH
    Inventors: Nicole DE BOER, Stefan GILGES, Heike HATTENDORF, Andreas HECKMANN
  • Patent number: 7427215
    Abstract: A plug connection for guiding a cable through an opening of a partition, comprising a device socket having a plug receiving portion, and a plug with an insertion body with a locking ring that cooperates with locking elements of the plug receiving portion. At least one cable adapter is connectable to the device socket or plug. A cadmium-free electrically conductive surface coating is provided on at least an inner or outer continuous surface of the electrically conductive components of the plug connection. The contact points between base bodies of the socket device and plug on the one hand, and base bodies of the respective cable adapter on the other hand, are embodied as interengaging teeth. The contact point between the base bodies of the device socket and the plug is produced by a ground ring on one of them and has resilient tongues that rest on the other one.
    Type: Grant
    Filed: August 26, 2005
    Date of Patent: September 23, 2008
    Assignee: Krauss-Maffei Wegmann GmbH & Co.
    Inventors: Andreas Heckmann, Peter Fiedler, Roland Bühler
  • Publication number: 20080045072
    Abstract: A plug connection for guiding a cable through an opening of a partition, comprising a device socket having a plug receiving portion, and a plug with an insertion body with a looking ring that cooperates with locking elements of the plug receiving portion. At least one cable adapter is connectable to the device socket or plug. A cadmium-free electrically conductive surface coating is provided on at least an inner or outer continuous surface of the electrically conductive components of the plug connection. The contact points between base bodies of the socket device and plug on the one hand, and base bodies of the respective cable adapter on the other hand, are embodied as interengaging teeth. The contact point between the base bodies of the device socket and the plug is produced by a ground ring on one of them and has resilient tongues that rest on the other one.
    Type: Application
    Filed: August 26, 2005
    Publication date: February 21, 2008
    Inventors: Andreas Heckmann, Peter Fiedler, Roland Buhler