Abstract: The invention relates to a metal layer stack for use in electronic components, in particular as a spacer in power electronic components, comprising n bulk metal layers and n or n+1 contact material layers, wherein the bulk metal layers and the contact material layers are stacked in an alternating manner and n is at least two. Additionally, the invention relates to a process for preparing the metal layer stack and a semiconductor module comprising such a metal layer stack.

Abstract: One aspect relates to a method for producing a substrate adapter for the connecting to an electronic component, including arranging at least one contacting material layer between at least one side of a carrier and a surface of a substrate such that the contacting material layer has at least one predetermined breaking point, and joining the carrier and the substrate to the contacting material layer. One aspect also relates to a substrate adapter for connecting to an electronic component.

Abstract: The disclosure relates to a method for generating a three-dimensional environment model using GNSS measurements, comprising at least the following steps: a) receiving a plurality of measuring data sets, each of which describes a propagation path of a GNSS signal between a GNSS satellite and a GNSS receiver; b) selecting from the plurality of measuring data sets individual measuring data sets which meet a first selection criterion, the first selection criterion being characteristic for the presence of an object boundary along the propagation path of the GNSS signal; and c) capturing an object boundary of an object in the environment of at least one GNSS receiver using the measuring data sets selected.

Abstract: One aspect relates to a method for producing a substrate adapter for the connecting to an electronic component, including arranging at least one contacting material layer between at least one side of a carrier and a surface of a substrate such that the contacting material layer has at least one predetermined breaking point, and joining the carrier and the substrate to the contacting material layer. One aspect also relates to a substrate adapter for connecting to an electronic component.

Abstract: One aspect relates to a method for manufacturing a substrate assembly for attachment to an electronic component A substrate is provided with a first side and a second side. A contact material layer is applied to the first side of the substrate. A pre-fixing agent is applied at least to sections of a side of the contact material layer facing away from the substrate.

Abstract: A carrier and the clip are used to produce a packaging having a lead frame by connection to the chip using sintering of the solidified sintering pastes in one work step. The carrier may be a lead frame and a clip for at least one semiconductor element has at least one functional surface for connecting to the semiconductor element and a plurality of connections. The material of the earlier or of the clip includes a metal and a layer made of a solidified sintering paste. The sintering paste may contain silver and/or a silver compound. The sintering paste is arranged on the functional surface. The carrier or clip and the layer made of sintering paste form an intermediate product that can be connected to the semiconductor element.

Abstract: One aspect relates to a method for manufacturing a substrate assembly for attachment to an electronic component A substrate is provided with a first side and a second side. A contact material layer is applied to the first side of the substrate. A pre-fixing agent is applied at least to sections of a side of the contact material layer facing away from the substrate.

Abstract: A carrier and the clip are used to produce a packaging having a lead frame by connection to the chip using sintering of the solidified sintering pastes in one work step. The carrier may be a lead frame and a clip for at least one semiconductor element has at least one functional surface for connecting to the semiconductor element and a plurality of connections. The material of the carrier or of the clip includes a metal and a layer made of a solidified sintering paste. The sintering paste may contain silver and/or a silver compound. The sintering paste is arranged on the functional surface. The carrier or clip and the layer made of sintering paste form an intermediate product that can be connected to the semiconductor element.

Abstract: The invention relates to a support and/or clip for at least one semiconductor element with at least one functional surface (10) for connecting to the semiconductor element. The invention is further characterized by at least one solder resist cavity (12) with at least one flank wall (13), in particular a straight flank wall (13), and a delimiting edge (14) which adjoins the flank wall (13) and delimits the functional surface (10) at least on one side. The delimiting edge (14) forms a protrusion (15) which protrudes past the functional surface (10) in order to retain solder, and/or the flank wall (13) forms an undercut (16) for retaining solder at the delimiting edge (14).

Abstract: In an embodiment, a hand digging shovel includes a handle and a shovel. The hand digging shovel is configured for use in gardens and the like and is intended to permit both low-fatigue working with minimized excavation and also use in tight spaces. These problems are solved by a slightly V-shaped arrangement of handle and shovel relative to one another, wherein said handle and shovel are connected together by means of an arm.

Abstract: A system for procuring services such as, in particular, rideshare opportunities and transportation services, has at least one stationary server and a multitude of subscribers including suppliers and interested parties. The system includes a communications arrangement which enable at least an information exchange between the stationary server and the subscribers. The system further includes a positioning arrangement for determining the current position of the subscribers, and a memory arrangement for at least temporary storage of data and positions of the subscribers.

Abstract: The invention relates to methods for producing a laminate for contacting an electronic component, in which an insulating layer is arranged between first and second metal layers. The method includes contacting the metal layers to each other in a contact region, generating a recess in the insulating layer, laminating the metal layers to the insulating layer, generating a notch for accommodating the electronic component in the contact region in the first metal layer, inserting the electronic component in a depression in the laminate formed through a notch and recess. The electronic component is connected in a conductive manner to the second metal layer, such that an entire circumference of the electronic component is accommodated in the recess and/or notch, and at least part of the height of the electronic component is accommodated in the notch and/or recess. The invention also relates to such a laminate for contacting an electronic component.

Abstract: A method is described for signaling a connection request between data processing devices, in which a connection call (12) is transmitted by broadcast (10), the connection call calling at least one data terminal (2) to set up, via a radio network, a connection (20) suitable for transmitting the data.

Abstract: A method is described for signaling a connection request between data processing devices, in which a connection call is transmitted by broadcast, the connection call calling at least one data terminal to set up, via a radio network, a connection suitable for transmitting the data.

Abstract: A system for procuring services such as, in particular, rideshare opportunities and transportation services, has at least one stationary server and a multitude of subscribers including suppliers and interested parties. The system includes a communications arrangement which enable at least an information exchange between the stationary server and the subscribers. The system further includes a positioning arrangement for determining the current position of the subscribers, and a memory arrangement for at least temporary storage of data and positions of the subscribers.