Patents by Inventor Andreas Hodjicostis

Andreas Hodjicostis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High Resolution Intravascular Ultrasound Transducer Assembly Having A Flexible Substrate
    Publication number: 20110034809
    Abstract: An ultrasound transducer assembly of the present invention includes a flexible circuit to which an ultrasound transducer array and integrated circuitry are attached during fabrication of the ultrasound transducer assembly. The flexible circuit comprises a flexible substrate to which the integrated circuitry and transducer elements are attached while the flexible substrate is in a substantially flat shape. The flexible circuit further comprises electrically conductive lines that are deposited upon the flexible substrate. The electrically conductive lines transport electrical signals between the integrated circuitry and the transducer elements. After assembly, the flexible circuit is re-shapable into a final form such as, for example, a substantially cylindrical shape.
    Type: Application
    Filed: October 13, 2010
    Publication date: February 10, 2011
    Applicant: VOLCANO CORPORATION
    Inventors: Michael J. Eberle, Douglas N. Stephens, Gary Rizzuti, Horst F. Kiepen, Andreas Hodjicostis
  • High resolution intravascular ultrasound transducer assembly having a flexible substrate
    Patent number: 7846101
    Abstract: An ultrasound transducer assembly of the present invention includes a flexible circuit to which an ultrasound transducer array and integrated circuitry are attached during fabrication of the ultrasound transducer assembly. The flexible circuit comprises a flexible substrate to which the integrated circuitry and transducer elements are attached while the flexible substrate is in a substantially flat shape. The flexible circuit further comprises electrically conductive lines that are deposited upon the flexible substrate. The electrically conductive lines transport electrical signals between the integrated circuitry and the transducer elements. After assembly, the flexible circuit is re-shapable into a final form such as, for example, a substantially cylindrical shape.
    Type: Grant
    Filed: June 4, 2007
    Date of Patent: December 7, 2010
    Assignee: Volcano Corporation
    Inventors: Michael J. Eberle, Douglas N. Stephens, Gary Rizzuti, Horst Kiepen, Andreas Hodjicostis
  • High resolution intravascular ultrasound transducer assembly having a flexible substrate
    Patent number: 7226417
    Abstract: An ultrasound transducer assembly of the present invention includes a flexible circuit to which an ultrasound transducer array and integrated circuitry are attached during fabrication of the ultrasound transducer assembly. The flexible circuit comprises a flexible substrate to which the integrated circuitry and transducer elements are attached while the flexible substrate is in a substantially flat shape. The flexible circuit further comprises electrically conductive lines that are deposited upon the flexible substrate. The electrically conductive lines transport electrical signals between the integrated circuitry and the transducer elements. After assembly, the flexible circuit is re-shapable into a final form such as, for example, a substantially cylindrical shape.
    Type: Grant
    Filed: September 13, 1996
    Date of Patent: June 5, 2007
    Assignee: Volcano Corporation
    Inventors: Michael J. Eberle, Douglas N. Stephens, Gary Rizzuti, Horst F. Kiepen, Andreas Hodjicostis