Abstract: A mechanism is provided for integrated power delivery and distribution via a heat sink. The mechanism comprises a processor layer coupled to a signaling and input/output (I/O) layer via a first set of coupling devices and a heat sink coupled to the processor layer via a second set of coupling devices. In the mechanism, the heat sink comprises a plurality of grooves on one face, where each groove provides either a path for power or a path for ground to be delivered to the processor layer. In the mechanism, the heat sink is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism and the signaling and I/O layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: A business object model, which reflects data that is used during a given business transaction, is utilized to generate interfaces. This business object model facilitates commercial transactions by providing consistent interfaces that are suitable for use across industries, across businesses, and across different departments within a business during a business transaction. Specifically, example business objects include DemandPlan, DemandPlanningCharacteristicValueCombination, and DemandViewOfPromotion.

Abstract: A circuit arrangement for operating a discharge lamp is provided. The circuit arrangement may include a commutating device, which is configured to exhibit an input which is coupled to a direct-current source and has an output which can be coupled to a discharge lamp; the commutating device being configured in such a manner that it couples the direct-current source to the output and the polarity with which the direct-current source is coupled to the output can be commutated by a control device; the control device including a measurement input which is coupled to a measuring device which is configured to deliver a measurement value which is a measure of the magnitude of a lamp voltage; wherein the control device is configured to control the commutating device in such a manner that the polarity at which a higher lamp voltage prevails is coupled longer to the output.

Abstract: An inductor may include an electrical conductor for generating a magnetic field; and at least one inductor core unit which is arranged in the region of the conductor and includes an inductor core composed of a magnetizable material and also at least one air gap, a filling material being introduced at least into part of the air gap for the purpose of mechanical stabilization, wherein the filling material is configured in such a way that it has a coefficient of thermal expansion, the value of which lies in a range of ±70% of the value of the coefficient of thermal expansion of the magnetizable material of which the inductor core is composed.

Abstract: The invention relates to a novel operating method and corresponding ballast for illuminating systems having temporally sequential color filtering and a high-pressure discharge lamp operated by alternating current. In this case, at least three commutations of the lamp current are used within a color filtering sequence, in order to be able to operate the lamp advantageously without an excessive increase in the operating frequency of the color filter system.

Abstract: A mechanism is provided for optimizing semiconductor packing in a three-dimensional (3D) very-large-scale integration (VLSI) device. The 3D VLSI device comprises a processor layer coupled, via a first set of coupling devices, to at least one signaling and input/output (I/O) layer. The 3D VLSI device further comprises a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the 3D VLSI device the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the three-dimensional VLSI device, and the at least one signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: A computer-implemented framework and method for maintaining product allocation data objects comprising a plurality of product allocation data objects, a plurality of software modules, an interface for the software modules, and a plurality of computer-applications, wherein the product allocation data objects are representative of product allocations for several participants within an e-business system, wherein a product allocation data object is processed by at least one of the plurality of computer-applications, the software modules providing access to the product allocation data objects, and the interface provides concurrent access to the software modules for online collaboration, wherein a collaborative planning process of the product allocation data objects is executed by the software modules and controlled by the applications.

Abstract: An exemplary combustor includes at least a portion having an inner liner and an outer cover plate, which together form an interposed cooling chamber. A plurality of hollow elements extend from the liner and protrude into the cooling chamber. Each hollow element defines a damping volume connected to an inner volume of the combustion chamber via a calibrated duct. During operation, the hollow elements damp pressure pulsations and, in addition, also transfer heat.

Abstract: A mechanism is provided for optimizing semiconductor packing in a three-dimensional (3D) very-large-scale integration (VLSI) device. The 3D VLSI device comprises a processor layer coupled, via a first set of coupling devices, to at least one signaling and input/output (I/O) layer. The 3D VLSI device further comprises a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the 3D VLSI device the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the three-dimensional VLSI device, and the at least one signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: An integrated circuitry structure includes at least first and second regions. An optical layer includes optical waveguides. A heat-conductive material transfers heat from at least the second region through the optical layer to a heat sink.

Abstract: Monocrystalline semiconductor wafers have defect-reduced regions, the defect-reduced regions having a density of GOI-relevant defects within the range of 0/cm2 to 0.1/cm2 and occupy overall an areal proportion of 10% to 100% of the planar area of the semiconductor wafer, wherein the remaining regions of the semiconductor wafer have a significantly higher defect density than the defect-reduced regions. The wafers may be produced by a method for annealing GOI relevant defects in the wafer, by irradiating defined regions of a side of the semiconductor wafer by laser wherein each location is irradiated with a power density of 1 GW/m2 to 10 GW/m2 for at least 25 ms, wherein the laser emits radiation of a wavelength above the absorption edge of the wafer semiconductor material and wherein the temperature of the wafer rises by less than 20 K as a result of irradiation.

Abstract: A computer-implemented framework and method for maintaining product allocation data objects comprising a plurality of product allocation data objects, a plurality of software modules, an interface for the software modules, and a plurality of computer-applications, wherein the product allocation data objects are representative of product allocations for several participants within an e-business system, wherein a product allocation data object is processed by at least one of the plurality of computer-applications, the software modules providing access to the product allocation data objects, and the interface provides concurrent access to the software modules for online collaboration, wherein a collaborative planning process of the product allocation data objects is executed by the software modules and controlled by the applications.

Abstract: An illumination device may include a flexible printed circuit board; a power electronics module; and a light-emitting diode module, which is electrically connected to the power electronics module by means of the flexible printed circuit board.

Abstract: A circuit arrangement for the closed-loop control of the current through at least one discharge lamp may include a control loop including: a setpoint value input for supplying a setpoint value; an actual value input for supplying an actual value; and an output for providing a signal, which has been correlated with the current through the at least one discharge lamp, the actual value having been correlated with the value of the current through the discharge lamp; and a setpoint value input apparatus, which is designed to provide the setpoint value to the control loop; wherein the setpoint value input apparatus includes: a microprocessor with at least one input, the microprocessor being designed to couple the at least one input to a potential from a group of at least two different potentials; and a wiring apparatus with at least one input, which is coupled to the at least one input of the microprocessor, and at least one output, which is coupled to at least one point of the control loop.

Abstract: An integrated circuit coupling device includes an integrated circuit package; and an optical data transmission medium connected to the integrated circuit package, and comprising a movable coolant, adapted to remove heat from the integrated circuit package, in operation.

Abstract: An integrated circuit coupling device includes an integrated circuit package with N integrated circuit layers (L1-LN) arranged as a 3D stack; and a data transmission medium with n data transmission layers (l1-ln), wherein n?1 and N?2, and wherein the N integrated circuit layers are electrically connectable to the n data transmission layers.

Abstract: A mechanism is provided for optimizing semiconductor packing in a three-dimensional (3D) very-large-scale integration (VLSI) device. The 3D VLSI device comprises a processor layer coupled, via a first set of coupling devices, to at least one signaling and input/output (I/O) layer. The 3D VLSI device further comprises a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the 3D VLSI device the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the three-dimensional VLSI device, and the at least one signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: A mechanism is provided for integrated power delivery and distribution via a heat sink. The mechanism comprises a processor layer coupled to a signaling and input/output (I/O) layer via a first set of coupling devices and a heat sink coupled to the processor layer via a second set of coupling devices. In the mechanism, the heat sink comprises a plurality of grooves on one face, where each groove provides either a path for power or a path for ground to be delivered to the processor layer. In the mechanism, the heat sink is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism and the signaling and I/O layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: A mechanism is provided for a thermal power plane that delivers power and constitutes minimal thermal resistance. The mechanism comprises a processor layer coupled, via a first set of coupling devices, to a signaling and input/output (I/O) layer and a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the mechanism, the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism. In the mechanism, the power delivery layer comprises a plurality of conductors, a plurality of insulating materials, one or more ground planes, and a plurality of through laminate vias. In the mechanism, the signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Abstract: A circuit arrangement for starting a discharge lamp, comprising: a first and a second input terminal for connecting an input voltage; an inverter, which has an input and an output, the input being coupled to the first and the second input terminal; a first and a second output terminal for connecting the discharge lamp; a resonant inductor, which is coupled between the output of the inverter and the first output terminal; a resonant circuit, which comprises the resonant inductor; a regulating apparatus for regulating the frequency of the signal provided at the inverter output; and a current measuring apparatus, which is arranged so as to measure a current which is correlated with the current in the resonant circuit, wherein the regulating apparatus is adapted to regulate the frequency at the output of the inverter as a function of the measured current.