Abstract: The filling of value documents cassettes involves a cassette receiving device for receiving a value document cassette and a gripping device for transporting a value document stack from a value document container into the value document cassette. The apparatus optionally has a formatting device for the automatic alignment of a value document stack removed from the value document container before the stack is inserted in the value document cassette. A finger element is attached to the transport device of the gripping device, and besides the gripping device, the finger element is guided into the value document cassette before the value documents are inserted.

Abstract: An assembly and a method for processing value documents such that the assembly has a transport apparatus for value-document receptacles which forms a cyclically circulating transport loop for the value-document receptacles. At least one checking apparatus for checking value documents is connected to the transport apparatus in such a manner that a respective value-document stack, possibly together with its value-document receptacle, can be transported via the respective transport interface from the cyclically circulating transport loop to the respective checking apparatus and/or from the respective checking apparatus to the cyclically circulating transport loop. The cyclically circulating transport loop is self-contained in such a manner that the value-document receptacles can circulate around the cyclically circulating transport loop several times in the same direction of circulation, and thus allows a temporally flexible removal of the respective value-document stack.

Abstract: A system for mounting a filter component to a circuit hoard. The system comprises a filter component housing dimensioned to house a filter component. The system further comprises a mount between the filter component housing and the circuit hoard, the mount configured to couple the filter component housing to the circuit board.

Abstract: A modular screw is provided, wherein the screw includes, in an axial direction, the following elements: a screw head, a shank having a second functional portion, a third functional portion for distributing a prestressing force, wherein a washer is arranged in the second functional portion and is mounted so as to be rotatable about a longitudinal axis of the screw, and a fourth functional portion having an external thread, and wherein the washer is secured in an approximately positionally fixed manner in the axial direction by bearing against the second and the fourth functional portion.

Abstract: An arrangement for processing of value documents at a preparation station, prior to their processing by means of a value document processing apparatus, involves inserting the value documents into a container divided into several storage regions. The value documents of the respective deposit are removed at the preparation station from delivery containers which respectively include a unique deposit identification. A monitoring device automatically captures into which storage region of the value document container the value documents are inserted.

Abstract: An apparatus and method for filling containers with value documents and to a system for processing value documents, wherein the apparatus has: a container receiving device which is adapted to receive a container stack having two or several containers for receiving value documents, a lid receiving device which is adapted to receive a lid stack having two or several lids for closing the containers, a container removal device which is adapted to remove, preferably, the respectively lowermost container from the container stack, a closing device and a transport device which is adapted to convey the container removed from the container stack to a filling station, in which the container can be filled with value documents, and to convey the container filled with value documents to the closing device which is adapted to remove a lid from the lid stack and close the filled container with the removed lid.

Abstract: A modular screw is provided, wherein the screw includes, in an axial direction, the following elements: a screw head, a shank having a second functional portion, a third functional portion for distributing a prestressing force, wherein a washer is arranged in the second functional portion and is mounted so as to be rotatable about a longitudinal axis of the screw, and a fourth functional portion having an external thread, and wherein the washer is secured in an approximately positionally fixed manner in the axial direction by bearing against the second and the fourth functional portion.

Abstract: A plug-in connection (1), comprising an electrical connector (2) and a mating electrical connector (3), which can be plugged together with the electrical connector, the electrical connector (2) having a housing, which has a flange (5) and a frame (7), the frame comprising at least one contact chamber (8), in which a contact partner (9) is arranged, the mating electrical connector (3) having a housing and a frame (12), the frame comprising a contact chamber (13), in which at least one contact partner (14) is arranged, characterized in that each contact partner (14) of the mating electrical connector (3) is surrounded by a casing (15), which surrounds the contact partner (14) except from the insertion region for an associated contact partner (9) of the electrical connector (2).

Abstract: A system for mounting a filter component to a circuit hoard. The system comprises a filter component housing dimensioned to house a filter component. The system further comprises a mount between the filter component housing and the circuit hoard, the mount configured to couple the filter component housing to the circuit board.

Abstract: An antenna module for a hearing device includes a hollow core provided with an axial passageway and a winding around the core which is connectable with a hearing device. The antenna module is arranged to be at least partially contained within the ear canal of a user. This enables the antenna to be separated from sources of interference, since it can be positioned inside the ear canal away from hearing device electronics, thus reducing requirements for shielding and/or compensation. The invention further relates to an ear tip and a hearing device including such an antenna module.

Abstract: In a method for producing a semi-conductor module (10) comprising at least two semi-conductor chips (12, 14) and an interposer (20) which has electrically conductive structures (28) connecting the semi-conductor chips (12, 14) to one another, the interposer (20) is printed directly onto a first (12) of the semi-conductor chips. When the interposer (20) is printed on, the electrically conductive structures (28) are produced by means of electrically conductive ink (68). The second semi-conductor chip (14) is mounted on the interposer (20) such that the two semi-conductor chips (12, 14) are arranged one above the other and that the interposer (20) forms an intermediate layer between the two semi-conductor chips (12, 14).

Abstract: An antenna module for a hearing device includes a hollow core provided with an axial passageway and a winding around the core which is connectable with a hearing device. The antenna module is arranged to be at least partially contained within the ear canal of a user. This enables the antenna to be separated from sources of interference, since it can be positioned inside the ear canal away from hearing device electronics, thus reducing requirements for shielding and/or compensation. The invention further relates to an ear tip and a hearing device including such an antenna module.

Abstract: The present invention relates to an antenna module for a hearing device. The antenna module comprises a hollow core provided with an axial passageway and a winding around the core which is connectable with a hearing device. The antenna module is arranged to be at least partially contained within the ear canal of a user. This enables the antenna to be separated from sources of interference, since it can be positioned inside the ear canal away from hearing device electronics, thus reducing requirements for shielding and/or compensation. The invention further relates to an ear tip and a hearing device comprising such an antenna module.

Abstract: In a method for producing a semi-conductor module (10) comprising at least two semi-conductor chips (12, 14) and an interposer (20) which has electrically conductive structures (28) connecting the semi-conductor chips (12, 14) to one another, the interposer (20) is printed directly onto a first (12) of the semi-conductor chips. When the interposer (20) is printed on, the electrically conductive structures (28) are produced by means of electrically conductive ink (68). The second semi-conductor chip (14) is mounted on the interposer (20) such that the two semi-conductor chips (12, 14) are arranged one above the other and that the interposer (20) forms an intermediate layer between the two semi-conductor chips (12, 14).

Abstract: In a method for producing a semi-conductor module (10) comprising at least two semi-conductor chips (12, 14) and an interposer (20) which has electrically conductive structures (28) connecting the semi-conductor chips (12, 14) to one another, the interposer (20) is printed directly onto a first (12) of the semi-conductor chips. When the interposer (20) is printed on, the electrically conductive structures (28) are produced by means of electrically conductive ink (68). The second semi-conductor chip (14) is mounted on the interposer (20) such that the two semi-conductor chips (12, 14) are arranged one above the other and that the interposer (20) forms an intermediate layer between the two semi-conductor chips (12, 14).

Abstract: The present invention relates to an antenna module for a hearing device. The antenna module comprises a hollow core provided with an axial passageway and a winding around the core which is connectable with a hearing device. The antenna module is arranged to be at least partially contained within the ear canal of a user. This enables the antenna to be separated from sources of interference, since it can be positioned inside the ear canal away from hearing device electronics, thus reducing requirements for shielding and/or compensation. The invention further relates to an ear tip and a hearing device comprising such an antenna module.

Abstract: The present patent application relates to a wafer support arrangement, comprising a wafer (1), a support layer system (5, 6) and a separating layer (4), which is arranged between the support layer system (5, 6) and the wafer (1), wherein the support layer system (5, 6) (i) comprises a support layer (6) and (ii) a layer (5) from a through hardened, partially hardened or hardenable elastomer material on the separating layer side or consists of these two layers and wherein the separating layer (4) (iii) is a plasma polymer layer and (iv) the adhesive bond between the support layer system (5, 6) and the separating layer (4), after the elastomer material has through hardened, is greater than the adhesive bond between the wafer (1) and the separating layer (4).

Abstract: In a method for producing a semi-conductor module (10) comprising at least two semi-conductor chips (12, 14) and an interposer (20) which has electrically conductive structures (28) connecting the semi-conductor chips (12, 14) to one another, the interposer (20) is printed directly onto a first (12) of the semi-conductor chips. When the interposer (20) is printed on, the electrically conductive structures (28) are produced by means of electrically conductive ink (68). The second semi-conductor chip (14) is mounted on the interposer (20) such that the two semi-conductor chips (12, 14) are arranged one above the other and that the interposer (20) forms an intermediate layer between the two semi-conductor chips (12, 14).

Abstract: A process and an apparatus are described for the treatment of wafers, in particular for the thinning of wafers. A wafer with a carrier layer and an interlayer arranged between the carrier layer and the wafer is also described, in which the interlayer is a plasmapolymeric layer that adheres to the wafer and adheres more strongly to the carrier layer than to the wafer.

Abstract: A method of controlling an analog signal in an integrated circuit includes generating a first control signal having a first predetermined duration within the integrated circuit. The first control signal is configured to cause the analog signal to have a first signal level. The first signal level is compared to a level of a target signal. A second control signal is generated within the integrated circuit based on a result of the comparison. The second control signal is configured to cause the analog signal to have a second signal level. The second control signal has a second predetermined duration that is different than the first predetermined duration.