Abstract: An apparatus includes a first ferroelectric storage layer and a second ferroelectric storage layer adjacent the first ferroelectric storage layer. A coupling layer may be between the first ferroelectric storage layer and the second ferroelectric storage layer. The ferroelectric storage layers may be configured as a data storage medium for use in a data storage system. A related method is also disclosed.

Abstract: An apparatus that provides for non-destructive readback of a ferroelectric material. The apparatus can include a ferroelectric layer with a scannable surface wherein the ferroelectric layer has a compensation charge adjacent the scannable surface. The apparatus also can include an electrode adjacent the scannable surface to sense the compensation charge. A related method is also disclosed.

Abstract: Media rolls, support structures for the media rolls, and media processing systems are provided. A media roll may include an identification transponder having retrievable information regarding the media units and associated media unit transponders wound around a core of the media roll. A support structure may include a spindle for supporting a media roll and include an identification coupler for communicating with the identification transponder. In addition to the spindle having the identification coupler, the media processing systems may include a second coupler for encoding the media unit transponders and a printhead for printing indicia onto the media units. The information retrieved from the identification transponder may be used to adjust one or more encoding and/or printing settings of the systems.

Abstract: Media rolls, support structures for the media rolls, and media processing systems are provided. A media roll may include an identification transponder having retrievable information regarding the media units and associated media unit transponders wound around a core of the media roll. A support structure may include a spindle for supporting a media roll and include an identification coupler for communicating with the identification transponder. In addition to the spindle having the identification coupler, the media processing systems may include a second coupler for encoding the media unit transponders and a printhead for printing indicia onto the media units. The information retrieved from the identification transponder may be used to adjust one or more encoding and/or printing settings of the systems.

Abstract: Module for contactless chip cards or identification systems having a first antenna contact strip and a second antenna contact strip, which each have a first surface and a second surface facing away from the first surface, a semiconductor chip with at least two contacts, at least one contact contact-connecting the first surface of the first antenna contact strip and at least one further contact contact-connecting the first surface of the second antenna contact strip, and at least one adhesive film strip, which at least partially covers the first surface of both the first antenna contact strip and the second antenna contact strip, the at least one adhesive film strip being arranged outside a region of the first and second antenna contact strips that is covered by the semiconductor chip.

Abstract: An apparatus comprises a ferroelectric storage medium, and a transducer for reading data from the ferroelectric storage medium and for writing data to the ferroelectric storage medium, wherein the transducer includes a substrate and a probe coupled to the substrate, wherein the probe includes a conductive element and a bilayer structure causing the probe to bend toward the ferroelectric storage medium.

Abstract: An apparatus includes a storage medium, and a transducer positioned adjacent to the storage medium, wherein the transducer includes a first electrode and a second electrode, with the width of the first electrode being less than the width of the second electrode. A method including: applying a first voltage to a transducer to write data to a storage medium, and applying a second voltage to the transducer to read data from the storage medium, wherein the magnitude of the first voltage is greater than the magnitude of the second voltage.

Abstract: A near-field coupler for a RFID system is provided. The coupler is configured to selectively communicate with a targeted transponder from among a group of multiple adjacent transponders. The coupler includes a conductive strip terminated by a load. The load is for matching an input impedance of the coupler to a source impedance of a transceiver. The conductive strip is based on a quarter wavelength of the center operating frequency. The conductive strip may have a substantially constant width and a length substantially equal to the quarter wavelength. Or the conductive strip may have a variable width defining a tapered profile and a length less than the quarter wavelength. The tapered profile may be an exponential profile or a Klopfenstein profile. Due to the overall size of the coupler to a typical transponder, the center of the coupler and the center of the transponder may be offset during coupling.

Abstract: An apparatus comprises mechanically scanned ferroelectric data storage media. A scanning electrode contacts the scannable surface with a contact force. The ferroelectric data storage media generates a piezoelectric potential that is picked up by the electrode. The piezoelectric potential has a polarity that varies as a function of data polarity on the data storage media.

Abstract: Ferroelectric media includes a media surface that is scannable by a contact. The contact provides a read signal. A polarization pattern is written in first regions of the media surface. The polarization pattern represents position data. The first regions are selectively exposed to an energy source. The exposing provides an imprint to the polarization pattern that prevents subsequent erasure by the read signal.

Abstract: A metal foam having a nonconductive substrate with a foamed structure which includes pores, the surface of the substrate being provided with conductive particles, and a homogenous metal layer being arranged on the conductive particles.

Abstract: Process for producing a metal structure in foam form, including the steps of providing a nonconductive substrate having a foamed structure, applying conductive particles to the substrate, so that the conductive particles are fixed to the entire surface of the substrate, and in particular to each individual pore of the substrate, and introducing the pretreated substrate into an electroplating device, in which a homogenous metal layer is formed on the conductive particles.

Abstract: The present invention relates to an air-cooled centrifuge comprising a rotor driven around a rotation axis by a motor and a cooling channel, which surrounds one wall of the rotor, wherein the cooling channel is provided for the air transportable in the cooling channel with an outlet opening, through which air can flow out from the centrifuge, and the outlet opening comprises a first wall, which starts at the outer periphery of the cooling channel and continues in such a way that it has an increasing distance from the rotation axis of the rotor with the simultaneously increasing rotation angle around the rotation axis of the rotor, wherein the outlet opening comprises a second wall, which starts at the outer periphery of the cooling channel and continues in such a way that it has an increasing distance from the rotation axis of the rotor with the simultaneously increasing rotation angle around the rotation axis of the rotor, so that the second wall extends as a straight line or has a curved contour, whose cent

Abstract: Module for contactless chip cards or identification systems having a first antenna contact strip and a second antenna contact strip, which each have a first surface and a second surface facing away from the first surface, a semiconductor chip with at least two contacts, at least one contact contact-connecting the first surface of the first antenna contact strip and at least one further contact contact-connecting the first surface of the second antenna contact strip, and at least one adhesive film strip, which at least partially covers the first surface of both the first antenna contact strip and the second antenna contact strip, the at least one adhesive film strip being arranged outside a region of the first and second antenna contact strips that is covered by the semiconductor chip.

Abstract: Module for contactless chip cards or identification systems having a first antenna contact strip and a second antenna contact strip, which each have a first surface and a second surface facing away from the first surface, a semiconductor chip with at least two contacts, at least one contact contact-connecting the first surface of the first antenna contact strip and at least one further contact contact-connecting the first surface of the second antenna contact strip, and at least one adhesive film strip, which at least partially covers the first surface of both the first antenna contact strip and the second antenna contact strip, the at least one adhesive film strip being arranged outside a region of the first and second antenna contact strips that is covered by the semiconductor chip.

Abstract: A method of producing a conductive pattern on a substrate, including the steps of providing a surface of the substrate with a conductive layer, which is formed by providing the surface of the substrate at least partly with conductive particles, by directly using the adhesive power of the surface of the substrate, applying a passivation layer to the conductive layer, the passivation layer being formed as a negative image of the conductive pattern, and forming the conductive pattern in the regions not covered by the passivation layer.

Abstract: Process for producing a metal structure in foam form, including the steps of providing a nonconductive substrate having a foamed structure, applying conductive particles to the substrate, so that the conductive particles are fixed to the entire surface of the substrate, and in particular to each individual pore of the substrate, and introducing the pretreated substrate into an electroplating device, in which a homogenous metal layer is formed on the conductive particles.

Abstract: A method for treating hydrocarbonaceous feedstock to produce hydrogen, electricity, and one or more liquid hydrocarbon product, the method comprising: (a) subjecting hydrocarbonaceous feedstock to hydrotreating hydrogen in the presence of supported catalyst under hydrotreating conditions effective to produce hydrotreated product comprising one or more liquid hydrocarbon product; (b) subjecting hydrotreated product to hydrogen production conditions effective to produce hydrogen product and hydrogen production remainder; (c) subjecting a first part of the hydrogen product to electricity generating conditions effective to produce electricity; and (d) recycling a second part of the hydrogen product as hydrotreating hydrogen.

Abstract: Method for producing hydrogen and a hydroprocessed product from a hydrocarbonaceous feedstock by subjecting it to a catalytic hydrocracking treatment using hydrogen which has been at least partly produced from hydrocracked feedstock and subjecting at least pan of the hydrocracked feedstock, after having subjected it to a separation treatment in the event that hydroprocessed product is to be recovered, to a treatment to produce hydrogen in a single operation which hydrogen is at least partly recovered as product.

Abstract: Module for contactless chip cards or identification systems having a first antenna contact strip and a second antenna contact strip, which each have a first surface and a second surface facing away from the first surface, a semiconductor chip with at least two contacts, at least one contact contact-connecting the first surface of the first antenna contact strip and at least one further contact contact-connecting the first surface of the second antenna contact strip, and at least one adhesive film strip, which at least partially covers the first surface of both the first antenna contact strip and the second antenna contact strip, the at least one adhesive film strip being arranged outside a region of the first and second antenna contact strips that is covered by the semiconductor chip.