Abstract: In accordance with a exemplary embodiments, methods for performing reliability testing of a plurality of transistors formed on a substrate includes simultaneously stressing the plurality of transistors by applying a voltage potential from each of a plurality of voltage sources to respective drain contacts of a like plurality of row groups and to gate contacts of a like plurality of column groups for a time interval, while applying a reference potential to the substrate and source contacts of the plurality of transistors. After stressing the plurality of transistors for a time interval, the transistors are each measured individually to collect reliability data.

Abstract: A semiconductor circuit is provided that includes a short channel device, and a long channel device that is electrically isolated from the short channel device. The long channel device comprises a plurality of first gate electrodes, a first source region adjacent one of the plurality of first gate electrodes, a first drain region adjacent another of the plurality of first gate electrodes, and a plurality of common source/drain regions positioned between adjacent ones of the plurality of first gate electrodes. The first gate electrodes each overlie portions of a layer of high-dielectric constant (k) gate insulator material. Each of the first gate electrodes are electrically coupled to at least one of the other first gate electrodes.

Abstract: Semiconductor-on-insulator substrates and methods for fabricating semiconductor-on-insulator substrates are provided. One exemplary method comprises providing a first silicon-comprising substrate, providing a second silicon-comprising substrate, forming a first silicon nitride layer overlying the second silicon-comprising substrate, and coupling the first silicon-comprising substrate to the second silicon-comprising substrate such that the first silicon nitride layer is interposed between the two substrates.

Abstract: A semiconductor circuit is provided that includes a short channel device, and a long channel device that is electrically isolated from the short channel device. The long channel device comprises a plurality of first gate electrodes, a first source region adjacent one of the plurality of first gate electrodes, a first drain region adjacent another of the plurality of first gate electrodes, and a plurality of common source/drain regions positioned between adjacent ones of the plurality of first gate electrodes. The first gate electrodes each overlie portions of a layer of high-dielectric constant (k) gate insulator material. Each of the first gate electrodes are electrically coupled to at least one of the other first gate electrodes.