Patents by Inventor Andreas Kitzler

Andreas Kitzler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of processing a semiconductor wafer, semiconductor wafer, and semiconductor die produced from a semiconductor wafer
    Patent number: 11610817
    Abstract: A method of processing a semiconductor wafer includes: forming a first metal layer or metal layer stack on a backside of the semiconductor wafer; forming a plating preventative layer on the first metal layer or metal layer stack, the plating preventative layer being formed at least over a kerf region of the semiconductor wafer and such that part of the first metal layer or metal layer stack is uncovered by the plating preventative layer, wherein the kerf region defines an area for dividing the semiconductor wafer along the kerf region into individual semiconductor dies; and plating a second metal layer or metal layer stack on the part of the first metal layer or metal layer stack uncovered by the plating preventative layer, wherein the plating preventative layer prevents plating of the second metal layer or metal layer stack over the kerf region.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: March 21, 2023
    Assignee: Infineon Technologies Austria AG
    Inventors: Andreas Kitzler, John Cooper, Jakob Simon Dohr, Michael Knabl, Matic Krivec, Daniel Pieber
  • METHOD OF PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER, AND SEMICONDUCTOR DIE PRODUCED FROM A SEMICONDUCTOR WAFER
    Publication number: 20220301933
    Abstract: A method of processing a semiconductor wafer includes: forming a first metal layer or metal layer stack on a backside of the semiconductor wafer; forming a plating preventative layer on the first metal layer or metal layer stack, the plating preventative layer being formed at least over a kerf region of the semiconductor wafer and such that part of the first metal layer or metal layer stack is uncovered by the plating preventative layer, wherein the kerf region defines an area for dividing the semiconductor wafer along the kerf region into individual semiconductor dies; and plating a second metal layer or metal layer stack on the part of the first metal layer or metal layer stack uncovered by the plating preventative layer, wherein the plating preventative layer prevents plating of the second metal layer or metal layer stack over the kerf region.
    Type: Application
    Filed: March 19, 2021
    Publication date: September 22, 2022
    Inventors: Andreas Kitzler, John Cooper, Jakob Simon Dohr, Michael Knabl, Matic Krivec, Daniel Pieber
  • Record carrier for storage and reproduction arrangement and storage arrangement for processing data not related to the record carrier
    Publication number: 20030053379
    Abstract: In a preferably disc-like scannable record carrier (3) which contains at least one subcode channel, strange data not related to the disc-like record carrier (3) are stored in the at least one subcode channel. A playback device (1) for scanning such a disc-like record carrier (3) includes playback device data processing means (5, 10) which are arranged for processing strange data formed by update data, which update data are transferred to non-volatile memory means (13) for updating a routine of a function unit (12).
    Type: Application
    Filed: August 29, 2002
    Publication date: March 20, 2003
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventors: Andreas Kitzler, Wolfgang Wimmer, Alois Homer