Abstract: A computer-implemented method of monitoring a process includes obtaining a sample data distribution. The sample data represents one or more parameters of a process. The sample data is collected by one or a plurality of sampling units. The method further includes calculating a control limit based on an evaluation of at least one difference of percentiles near an upper edge of the sample data distribution or a lower edge of the sample data distribution.

Abstract: A method for manufacturing integrated circuits (“IC”) on wafers to manage crack damage in the ICs such that crack propagation into the IC active array is reduced or eliminated. The method provides for a defined separation or divide of the IC gate conductor from the IC crack stop or IC edge. The method is especially useful in managing crack damage induced through the delamination of one or more of the gate conductor surface interfaces as a result of the IC wafer dicing process. Circuits or chips manufactured according to the methods disclosed are also taught.

Abstract: In preparation for etch processing a semiconductor chip having areas of little or no pattern and areas that are heavily patterned, adding non-operative patterns to the areas having little or no pattern so that the overall pattern density is about the same across the chip.