Abstract: An etching composition for non-conductive substrates such as polyester, polyether, polyimide, polyurethane, epoxy resin, polysulfone, polyethersulfone, polyetherimide, and polyamide, comprising a halogenide and/or nitrate of a metal selected from the group consisting of Na, Mg, Al, Si, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Ca, Zn, and combinations thereof such as FeCl3, FeCl2, TiCl3, CaCl2, CuCl2, CrCl3, ZnCl2, MgCl2, MnCl2, and Cr(NO3)3; and a related method for etching.

Abstract: In the plating of non-conductive substrates, a metal-salt solution for treatment of such a substrate having been treated with a metal colloid for activation, and associated method for coating non-conductive substrates, characterized by reduced incrustation the associated equipment; the metal-salt solution comprising a metal that can be reduced by the metal of the metal colloid, a complexing agent, and a metal salt having a metal of the group consisting of lithium, sodium, calcium, rubidium, and cesium in the form of a salt selected from the group consisting of fluorides, chlorides, iodides, bromides, nitrates, sulphates, and mixtures thereof.

Abstract: This invention concerns a method for metal plating plastic substrates, where the plastic surfaces are etched, activated, rinsed, optionally treated with an accelerator, and metal plated by chemical reductive or electrolytic means.