Abstract: A micromechanical rate-of-rotation sensor set-up, including a first rate-of-rotation sensor device capable of being driven rotationally by a driving device via a drive frame device, so as to oscillate about a first axis, and is for measuring a first outer rate of rotation about a second axis and a second outer rate of rotation about a third axis; and a second rate-of-rotation sensor device capable of being driven by the driving device via the drive frame device, so as to oscillate linearly along the second axis, and is for measuring a third outer rate of rotation about the first axis. The first rate-of-rotation sensor device is connected to the second rate-of-rotation sensor device by the drive frame device. The drive frame device includes a first and second drive frame, which may be driven by the driving device in phase opposition, along the third axis, in an oscillatory manner.

Abstract: Embodiments are directed to a superconducting microwave circuit. The circuit includes a substrate and two electrodes. The latter form an electrode pair dimensioned so as to support an electromagnetic field, which allows the circuit to be operated in the microwave domain. The substrate exhibits a raised portion, which includes a top surface and two lateral surfaces. The top surface connects the two lateral surfaces, which show respective undercuts (on the lateral sides of the raised portions). Each of the electrodes includes a structure that includes a potentially superconducting material. Two protruding structures are accordingly formed, which are shaped complementarily to the respective undercuts. This way, the shaped structure of each of the electrodes protrudes toward the other one of the electrodes of the pair.

Abstract: Embodiments are directed to a superconducting microwave circuit. The circuit includes a substrate and two electrodes. The latter form an electrode pair dimensioned so as to support an electromagnetic field, which allows the circuit to be operated in the microwave domain. The substrate exhibits a raised portion, which includes a top surface and two lateral surfaces. The top surface connects the two lateral surfaces, which show respective undercuts (on the lateral sides of the raised portions). Each of the electrodes includes a structure that includes a potentially superconducting material. Two protruding structures are accordingly formed, which are shaped complementarily to the respective undercuts. This way, the shaped structure of each of the electrodes protrudes toward the other one of the electrodes of the pair.

Abstract: A device for fixing an edge material to a narrow side of a panel-shaped workpiece is provided, which has a feed mechanism for supplying the edge material to the narrow side of the workpiece, at least one infrared emitter for activating an adhesive layer, facing the workpiece, of the edge material, and a pressing mechanism for pressing the edge material onto the narrow side of the workpiece. In order to activate the adhesive layer of the edge material by means of infrared radiation using a reliable process without adversely affecting the visible face of the edge material, a radiation exposure zone with a specifiable size is arranged in the feed path of the edge material. In the exposure zone, the adhesive layer of the edge material is exposed to infrared radiation. The device has a guide mechanism for guiding the edge material through the radiation exposure zone.

Abstract: A device for fixing an edge material to a narrow side of a panel-shaped workpiece is provided, which has a feed mechanism for supplying the edge material to the narrow side of the workpiece, at least one infrared emitter for activating an adhesive layer, facing the workpiece, of the edge material, and a pressing mechanism for pressing the edge material onto the narrow side of the workpiece. In order to activate the adhesive layer of the edge material by means of infrared radiation using a reliable process without adversely affecting the visible face of the edge material, a radiation exposure zone with a specifiable size is arranged in the feed path of the edge material. In the exposure zone, the adhesive layer of the edge material is exposed to infrared radiation. The device has a guide mechanism for guiding the edge material through the radiation exposure zone.