Abstract: A method for producing ultra-thin glass sheets is provided that results in glass sheets with high edge strength. The method includes: hot forming a continuous glass ribbon with a glass thickness from molten glass; annealing the glass ribbon with an annealing rate chosen based on the glass thickness; producing a laser beam focus area that is longer than the glass thickness; introducing filamentary defects into the glass ribbon using the laser beam so that the filamentary defects extend from one face to the opposite face and are spaced apart from one another along the breaking lines to produce transverse breaking lines and longitudinal breaking lines with margins each comprising a thickened bead; separating the beads along the longitudinal breaking lines and separating glass sheets by severing along the transverse breaking lines.

Abstract: An inductive positioning sensor (100) for small electrical and electronic applications that allows to achieve a higher induced voltage output. The inductive positioning sensor (100) is arranged in a multi-layer printed circuit board, that comprises an excitation coil (1) and at least one receiver coil A (2) and a corresponding duplicated receiver coil A (22), where the excitation coil circularly surrounds the limits defined by the at least one receiver coil A (2) and the corresponding duplicated receiver coil A (22). The at least one receiver coil A (2) comprises a main convergence point (106) and at least one auxiliary convergence point (104), and the corresponding duplicated receiver coil A (22) comprises at least one auxiliary convergence point (104). The at least one receiver coil A (2) and the corresponding duplicated receiver coil A (22) merge together in a secondary convergence point (104).

Abstract: An aqueous composition includes a dihydrotriazine compound of the general formula below, where R1 means (i) a phenyl group or phenylalkyl group, (ii) a naphthyl group or naphthylalkyl group, (iii) a heterocyclic group, heterocyclic alkyl group or heterocyclic aminoalkyl group, (iv) an alkyl group having 1 to 16 carbon atoms or (v) a cycloalkyl group or cycloalkylalkyl group, R1? means a hydrogen atom bonded to the nitrogen atom at position 1 or 3 of the dihydrotriazine ring, R2 and R3 each mean a hydrogen atom or a methyl group, R4 means an alkyl group having 7 to 16 carbon atoms and the dashed line indicates that a double bond is positioned either between positions 1 and 2 or between positions 2 and 3 of the dihydrotriazine ring, or a tautomer thereof or a salt thereof and a defoamer.

Abstract: A lighting device includes: a first optical unit and a second optical unit. The first optical unit includes a primary light source and dichroic separation optics. The primary light source is configured to emit primary light in the visible spectrum. The dichroic separation optics are configured to intercept at least part of the primary light generated by the primary light source and emit, from a first emission surface, at least one first highly collimated light component and at least one diffuse light component. The at least one first highly collimated light component and the at least one diffuse light component forms a light with chromatic components having different angular distributions. The second optical unit includes secondary collimation optics is configured to generate, from the light with chromatic component, a weakly collimated light component and a second highly collimated light component.

Abstract: An inductive position sensor includes (i) a coupling element which can be arranged on a movable element, (ii) at least one sensor unit for detecting a position of the coupling element, the sensor unit having at least one controllable transmitter coil for generating electromagnetic waves and at least one receiver coil for detecting the electromagnetic waves generated by the transmitter coil and influenced by the coupling element, and (iii) a printed circuit board having a plurality of layers. The coils of the sensor unit are formed on the printed circuit board. The transmitter coil and the receiver coil are distributed on the layers of the printed circuit board in such a way that at least some sections of the transmitter coil are axially opposite the receiver coil with respect to an axis oriented perpendicularly to the printed circuit board.

Abstract: An inductive position sensor device for detecting the position of a coupling element which can be arranged on a movable actuator element of an electric machine is disclosed. The inductive position sensor device includes (i) at least one transmitter coil for generating electromagnetic waves, (ii) at least one receiver coil for detecting the electromagnetic waves which are generated by the transmitter coil and are influenced by the actuator element, and (iii) a computing unit which is designed to actuate the transmitter coil and evaluate the electromagnetic waves detected by the receiver coil in order to determine the position. The coils are arranged on a front face of a common printed circuit board, and the computing unit is arranged on a rear face of the common printed circuit board. The coils are electrically connected to the computing unit by connection lines which extend along the printed circuit board and through the printed circuit board. The connection lines run substantially parallel to one another.

Abstract: An apparatus detects gas in a high-voltage device, which is filled with an insulating medium. The apparatus has: an inlet configured for introducing a carrier gas; an outlet configured for discharging the carrier gas; at least one gas sensor configured to detect a gas; a first pump configured to convey the carrier gas in the apparatus; a membrane which comprises at least one semipermeable basic material, which is at least partially surrounded by the insulating medium, and which is arranged to be at least partially subjected to an incident flow of the carrier gas; a second pump configured to convey the carrier gas into the apparatus and out of the apparatus; and a separating column, which is arranged before the gas sensor. The gas sensor is a sensor array.

Abstract: An inductive rotor position sensor device for detecting a rotor angular position of a rotor of an electric machine. The inductive rotor position sensor device includes a transmitter coil for generating electromagnetic waves and a receiver coil for detecting the electromagnetic waves generated by the transmitter coil and influenced by the rotor, and includes a processing unit, which is designed to activate the transmitter coil and to evaluate the electromagnetic waves detected by the receiver coil for determining the rotor angular position. The coils and the processing unit are situated on a shared circuit board. The coils are situated on a front side, and the processing unit is situated on a rear side of the circuit board which faces away from the front side.

Abstract: A sensor for at least detecting steering torque of a steel steering column includes a magnetic field generating element which is configured to generate a magnetic field. The magnetic field penetrates the steering column so as to magnetize a steel material thereof. The sensor also includes a magnetic field detection element which is configured to detect a magnetic field change caused by a magnetoelastic effect of the magnetized steel material of the steering column when the steering column is subjected to torque stress. An output signal of the magnetic field detection element characterizes steering torque. The sensor also includes a base plate bearing the magnetic field generating element and the magnetic field detection element. The base plate is spaced from and separate from the steel steering column. The magnetic field generating element and the magnetic field detection element are directly mounted on the base plate.

Abstract: In a packaging machine, a work station has an interior, which is surrounded by a wall and which has arranged therein a tool with at least one heating element or actor. The invention is characterized by a bus node assembly that is attached to the outside of the wall facing away from the interior and which comprises a housing cap, a circuit board and an interface connected to the circuit board and used for connection to a communication bus.

Abstract: A vehicle wheel monitoring device includes a tire pressure monitoring unit, a tire pressure sensor unit disposed at a wheel of the vehicle and a brake pad wear sensor unit disposed at a wheel of the vehicle. The brake pad wear sensor unit includes a brake pad wear sensor and a wireless transmitter configured to receive the signal emitted from the brake pad wear sensor and wirelessly transmit it to the tire pressure monitoring unit. An energy harvesting device is configured to convert energy derived from an external source into electrical power, and to provide the electrical power to the brake pad wear sensor unit and the transmitter. The brake pad wear sensor unit and the tire pressure sensor unit are monitored by the tire pressure monitoring unit.

Abstract: A sensor for at least detecting steering torque of a steel steering column comprises: a magnetic field generating element, configured to generate a magnetic field, the magnetic field penetrating the steering column so as to magnetize a steel material thereof; a magnetic field detection element, configured to detect a magnetic field change caused by a magnetoelastic effect of the magnetized steel material of the steering column when the steering column is subjected to torque stress, wherein an output signal of the magnetic field detection element characterizes steering torque; and a base plate, bearing the magnetic field generating element and the magnetic field detection element.

Abstract: In a packaging machine, a work station has an interior, which is surrounded by a wall and which has arranged therein a tool with at least one heating element or actor. The invention is characterized by a bus node assembly that is attached to the outside of the wall facing away from the interior and which comprises a housing cap, a circuit board and an interface connected to the circuit board and used for connection to a communication bus.

Abstract: A vehicle wheel monitoring device includes a tire pressure monitoring unit, a tire pressure sensor unit disposed at a wheel of the vehicle and a brake pad wear sensor unit disposed at a wheel of the vehicle. The brake pad wear sensor unit includes a brake pad wear sensor and a wireless transmitter configured to receive the signal emitted from the brake pad wear sensor and wirelessly transmit it to the tire pressure monitoring unit. An energy harvesting device is configured to convert energy derived from an external source into electrical power, and to provide the electrical power to the brake pad wear sensor unit and the transmitter. The brake pad wear sensor unit and the tire pressure sensor unit are monitored by the tire pressure monitoring unit.

Abstract: A semiconductor device with a semiconductor-on-insulator (SOI) structure is provided including an insulating layer and a semiconductor layer formed on the insulating layer and a fuse. The fuse includes a first at least partially silicided raised semiconductor region with a first silicided portion and, adjacent to the first at least partially silicided raised semiconductor region, a second at least partially silicided raised semiconductor region with a second silicided portion. The second silicided portion is formed in direct physical contact with the first silicided portion.

Abstract: A semiconductor device with a semiconductor-on-insulator (SOI) structure is provided including an insulating layer and a semiconductor layer formed on the insulating layer and a fuse. The fuse includes a first at least partially silicided raised semiconductor region with a first silicided portion and, adjacent to the first at least partially silicided raised semiconductor region, a second at least partially silicided raised semiconductor region with a second silicided portion. The second silicided portion is formed in direct physical contact with the first silicided portion.

Abstract: A method of manufacturing a semiconductor device with a fuse is provided including the steps of providing a semiconductor-on-insulator (SOI) structure including an insulating layer and a semiconductor layer formed on the insulating layer, forming a first raised semiconductor region on the semiconductor layer and a second raised semiconductor region on the semiconductor layer adjacent to the first semiconductor region, and performing a silicidation process of the first and second raised semiconductor regions to form a first at least partially silicided raised semiconductor region with a first silicided portion and a second at least partially silicided raised semiconductor region with a second silicided portion.

Abstract: A method of manufacturing a semiconductor device with a fuse is provided including the steps of providing a semiconductor-on-insulator (SOI) structure including an insulating layer and a semiconductor layer formed on the insulating layer, forming a first raised semiconductor region on the semiconductor layer and a second raised semiconductor region on the semiconductor layer adjacent to the first semiconductor region, and performing a silicidation process of the first and second raised semiconductor regions to form a first at least partially silicided raised semiconductor region with a first silicided portion and a second at least partially silicided raised semiconductor region with a second silicided portion.

Abstract: A method of forming a semiconductor device including the steps of forming an electrically programmable fuse (e-fuse) on an isolation region and a transistor on an active region of a wafer, wherein forming the transistor includes forming a dummy gate above a substrate, removing the dummy gate and forming a metal gate in place of the dummy gate, and forming the e-fuse includes forming a metal-containing layer above the isolation region, forming a semiconductor layer on the metal-containing layer during the process of forming the dummy gate and of the same material as the dummy gate, forming a hard mask layer on the semiconductor layer formed on the metal-containing layer, and forming contact openings in the hard mask layer and semiconductor layer during the process of removing the dummy gate.