Abstract: A position controller that controls an actuator that sets a roll gap of a roll stand by determining an actuating variable (q) for the actuator as a function of a resulting position target value (s*) and a position actual value(s) of the actuator. The (s*) is determined with a resulting base target value (s1*), which is determined as the sum of an initial base target value (s0*) and an additional target value (?s1*), which is determined by a determination element with an inlet-end actual tension (ZE) and an inlet-end reference tension (ZER) and/or with an outlet-end actual tension (ZA) and an outlet-end reference tension (ZAR). Instead of (ZE) and (ZA), the corresponding target tensions (ZE*, ZA*) of corresponding tension control operations can also be used. However, in both cases, (ZER) and (ZAR) are variables that differ from (ZE*) and (ZA*).

Abstract: In a roll stand, the working roll inserts are pressed apart by a bending system. A base set-point value (FBB*) is supplied to a bending controller to determine a resultant set-point value (FB*). An actual value (FB) of the bending force is also supplied to the bending controller to determine a base controlled variable (SB) for the bending system so that, when the bending system is actuated with (SB), (FB) is brought as close as possible to (FBB*). From a stabilisation time (t3) after an entry time (t2), the bending controller determines (FB*), additionally taking an actual rolling force (F) into consideration. During an entry time period before (t2) and ending at (t3), an additional set-point value (FBZ*) is supplied to the bending controller for determining (FB*). (FB) is thus greater than (FBB*).

Abstract: An inductive position sensor includes (i) a coupling element which can be arranged on a movable element, (ii) at least one sensor unit for detecting a position of the coupling element, the sensor unit having at least one controllable transmitter coil for generating electromagnetic waves and at least one receiver coil for detecting the electromagnetic waves generated by the transmitter coil and influenced by the coupling element, and (iii) a printed circuit board having a plurality of layers. The coils of the sensor unit are formed on the printed circuit board. The transmitter coil and the receiver coil are distributed on the layers of the printed circuit board in such a way that at least some sections of the transmitter coil are axially opposite the receiver coil with respect to an axis oriented perpendicularly to the printed circuit board.

Abstract: An inductive position sensor device for detecting the position of a coupling element which can be arranged on a movable actuator element of an electric machine is disclosed. The inductive position sensor device includes (i) at least one transmitter coil for generating electromagnetic waves, (ii) at least one receiver coil for detecting the electromagnetic waves which are generated by the transmitter coil and are influenced by the actuator element, and (iii) a computing unit which is designed to actuate the transmitter coil and evaluate the electromagnetic waves detected by the receiver coil in order to determine the position. The coils are arranged on a front face of a common printed circuit board, and the computing unit is arranged on a rear face of the common printed circuit board. The coils are electrically connected to the computing unit by connection lines which extend along the printed circuit board and through the printed circuit board. The connection lines run substantially parallel to one another.

Abstract: An inductive rotor position sensor device for detecting a rotor angular position of a rotor of an electric machine. The inductive rotor position sensor device includes a transmitter coil for generating electromagnetic waves and a receiver coil for detecting the electromagnetic waves generated by the transmitter coil and influenced by the rotor, and includes a processing unit, which is designed to activate the transmitter coil and to evaluate the electromagnetic waves detected by the receiver coil for determining the rotor angular position. The coils and the processing unit are situated on a shared circuit board. The coils are situated on a front side, and the processing unit is situated on a rear side of the circuit board which faces away from the front side.

Abstract: An apparatus detects gas in a high-voltage device, which is filled with an insulating medium. The apparatus has: an inlet configured for introducing a carrier gas; an outlet configured for discharging the carrier gas; at least one gas sensor configured to detect a gas; a first pump configured to convey the carrier gas in the apparatus; a membrane which comprises at least one semipermeable basic material, which is at least partially surrounded by the insulating medium, and which is arranged to be at least partially subjected to an incident flow of the carrier gas; a second pump configured to convey the carrier gas into the apparatus and out of the apparatus; and a separating column, which is arranged before the gas sensor. The gas sensor is a sensor array.

Abstract: A sensor for at least detecting steering torque of a steel steering column includes a magnetic field generating element which is configured to generate a magnetic field. The magnetic field penetrates the steering column so as to magnetize a steel material thereof. The sensor also includes a magnetic field detection element which is configured to detect a magnetic field change caused by a magnetoelastic effect of the magnetized steel material of the steering column when the steering column is subjected to torque stress. An output signal of the magnetic field detection element characterizes steering torque. The sensor also includes a base plate bearing the magnetic field generating element and the magnetic field detection element. The base plate is spaced from and separate from the steel steering column. The magnetic field generating element and the magnetic field detection element are directly mounted on the base plate.

Abstract: In a packaging machine, a work station has an interior, which is surrounded by a wall and which has arranged therein a tool with at least one heating element or actor. The invention is characterized by a bus node assembly that is attached to the outside of the wall facing away from the interior and which comprises a housing cap, a circuit board and an interface connected to the circuit board and used for connection to a communication bus.

Abstract: A vehicle wheel monitoring device includes a tire pressure monitoring unit, a tire pressure sensor unit disposed at a wheel of the vehicle and a brake pad wear sensor unit disposed at a wheel of the vehicle. The brake pad wear sensor unit includes a brake pad wear sensor and a wireless transmitter configured to receive the signal emitted from the brake pad wear sensor and wirelessly transmit it to the tire pressure monitoring unit. An energy harvesting device is configured to convert energy derived from an external source into electrical power, and to provide the electrical power to the brake pad wear sensor unit and the transmitter. The brake pad wear sensor unit and the tire pressure sensor unit are monitored by the tire pressure monitoring unit.

Abstract: A sensor for at least detecting steering torque of a steel steering column comprises: a magnetic field generating element, configured to generate a magnetic field, the magnetic field penetrating the steering column so as to magnetize a steel material thereof; a magnetic field detection element, configured to detect a magnetic field change caused by a magnetoelastic effect of the magnetized steel material of the steering column when the steering column is subjected to torque stress, wherein an output signal of the magnetic field detection element characterizes steering torque; and a base plate, bearing the magnetic field generating element and the magnetic field detection element.

Abstract: In a packaging machine, a work station has an interior, which is surrounded by a wall and which has arranged therein a tool with at least one heating element or actor. The invention is characterized by a bus node assembly that is attached to the outside of the wall facing away from the interior and which comprises a housing cap, a circuit board and an interface connected to the circuit board and used for connection to a communication bus.

Abstract: A vehicle wheel monitoring device includes a tire pressure monitoring unit, a tire pressure sensor unit disposed at a wheel of the vehicle and a brake pad wear sensor unit disposed at a wheel of the vehicle. The brake pad wear sensor unit includes a brake pad wear sensor and a wireless transmitter configured to receive the signal emitted from the brake pad wear sensor and wirelessly transmit it to the tire pressure monitoring unit. An energy harvesting device is configured to convert energy derived from an external source into electrical power, and to provide the electrical power to the brake pad wear sensor unit and the transmitter. The brake pad wear sensor unit and the tire pressure sensor unit are monitored by the tire pressure monitoring unit.

Abstract: A semiconductor device with a semiconductor-on-insulator (SOI) structure is provided including an insulating layer and a semiconductor layer formed on the insulating layer and a fuse. The fuse includes a first at least partially silicided raised semiconductor region with a first silicided portion and, adjacent to the first at least partially silicided raised semiconductor region, a second at least partially silicided raised semiconductor region with a second silicided portion. The second silicided portion is formed in direct physical contact with the first silicided portion.

Abstract: A semiconductor device with a semiconductor-on-insulator (SOI) structure is provided including an insulating layer and a semiconductor layer formed on the insulating layer and a fuse. The fuse includes a first at least partially silicided raised semiconductor region with a first silicided portion and, adjacent to the first at least partially silicided raised semiconductor region, a second at least partially silicided raised semiconductor region with a second silicided portion. The second silicided portion is formed in direct physical contact with the first silicided portion.

Abstract: A method of manufacturing a semiconductor device with a fuse is provided including the steps of providing a semiconductor-on-insulator (SOI) structure including an insulating layer and a semiconductor layer formed on the insulating layer, forming a first raised semiconductor region on the semiconductor layer and a second raised semiconductor region on the semiconductor layer adjacent to the first semiconductor region, and performing a silicidation process of the first and second raised semiconductor regions to form a first at least partially silicided raised semiconductor region with a first silicided portion and a second at least partially silicided raised semiconductor region with a second silicided portion.

Abstract: A method of manufacturing a semiconductor device with a fuse is provided including the steps of providing a semiconductor-on-insulator (SOI) structure including an insulating layer and a semiconductor layer formed on the insulating layer, forming a first raised semiconductor region on the semiconductor layer and a second raised semiconductor region on the semiconductor layer adjacent to the first semiconductor region, and performing a silicidation process of the first and second raised semiconductor regions to form a first at least partially silicided raised semiconductor region with a first silicided portion and a second at least partially silicided raised semiconductor region with a second silicided portion.

Abstract: A method of forming a semiconductor device including the steps of forming an electrically programmable fuse (e-fuse) on an isolation region and a transistor on an active region of a wafer, wherein forming the transistor includes forming a dummy gate above a substrate, removing the dummy gate and forming a metal gate in place of the dummy gate, and forming the e-fuse includes forming a metal-containing layer above the isolation region, forming a semiconductor layer on the metal-containing layer during the process of forming the dummy gate and of the same material as the dummy gate, forming a hard mask layer on the semiconductor layer formed on the metal-containing layer, and forming contact openings in the hard mask layer and semiconductor layer during the process of removing the dummy gate.

Abstract: Integrated circuits including electronic fuse structures are disclosed. In some examples, the electronic fuse structure includes a fuse part and first and second pre-heating lines positioned generally parallel to and co-planar with the fuse part, and electrically connected with the fuse part. The electronic fuse structure also includes a cathode physically and electrically connected to the first pre-heating line and an anode physically and electrically connected to the second pre-heating line.