Abstract: A beam machining head (10; 100; 200) for beam cutting of a workpiece is provided, having an interface (12) for an energy beam source (14; 14, 201) for generating a focused machining energy beam (15; 206) selected from a particle beam source, a fuel fluid beam source, a plasma beam source and/or a source for electromagnetic radiation; an exit opening (16) for the machining energy beam bounded by an opening edge (18); an optical detector unit (19) for recording at least one image of an electromagnetic radiation (17) emitted from the workpiece (11) through the exit opening into the beam machining head (10; 100; 200) and induced in the workpiece by the machining energy beam; and a monitoring unit (30) connected in a data-transmitting manner to the optical detector unit for monitoring a positional relationship between a centre of the emitted electromagnetic radiation and the exit opening, wherein the monitoring unit (30) has: a first determination module for determining at least one position (180; 182) of the exit

Abstract: A machining head for the laser machining of a workpiece. The machining head may include a first interface for a machining laser source for emitting a machining laser beam, a second interface for an illumination light source for emitting an illumination light beam, an exit opening for the machining laser beam and the illumination light beam, a third interface for a detector device for detecting the illumination light beam reflected from the workpiece, and guide optics for at least partial coaxial guiding of the emitted illumination light beam through the exit opening and of the illumination light beam reflected from the workpiece, through the exit opening, to the third interface. The guide optics have a polarising beam splitter for guiding at least part of the emitted illumination light beam in the direction of the exit opening, and a retardation plate between the polarising beam splitter and the exit opening.

Abstract: A beam machining head (10; 100; 200) for beam cutting of a workpiece is provided, having an interface (12) for an energy beam source (14; 14, 201) for generating a focused machining energy beam (15; 206) selected from a particle beam source, a fuel fluid beam source, a plasma beam source and/or a source for electromagnetic radiation; an exit opening (16) for the machining energy beam bounded by an opening edge (18); an optical detector unit (19) for recording at least one image of an electromagnetic radiation (17) emitted from the workpiece (11) through the exit opening into the beam machining head (10; 100; 200) and induced in the workpiece by the machining energy beam; and a monitoring unit (30) connected in a data-transmitting manner to the optical detector unit for monitoring a positional relationship between a centre of the emitted electromagnetic radiation and the exit opening, wherein the monitoring unit (30) has: a first determination module for determining at least one position (180; 182) of the exit

Abstract: An optical unit fora laser beam for laser machining of a workpiece is disclosed. With particular application to a laser beam, the optical unit may be applied to a high-power laser beam and comprise an optical element for the optical imaging of the laser beam, and two protective glasses that are transparent for the laser beam, the outer edges of which protective glasses being enclosed in an airtight manner by a holder in such a way that they form an interior space with the holder, the optical element also being arranged in the interior space. A laser machining device is also disclosed.

Abstract: The invention relates to a machining head (100) for the laser machining of a workpiece, having a first interface (102) for a machining laser source for emitting a machining laser beam; a second interface (104) for an illumination light source for emitting a linearly polarised illumination light beam; an exit opening (112) for the machining laser beam and the illumination light beam; a third interface (106) for a detector device for detecting the illumination light beam reflected from the workpiece; and guide optics (116, 117) for at least partial coaxial guiding of the emitted illumination light beam through the exit opening and of the illumination light beam reflected from the workpiece, through the exit opening, to the third interface. The guide optics have a polarising beam splitter (116) for guiding at least part of the emitted linearly polarised illumination light beam in the direction of the exit opening; and a retardation plate (117) disposed between the polarising beam splitter and the exit opening.

Abstract: A method for process monitoring of a laser machining process for estimating a machining quality is dicloses. The method may include steps, which are carried out in real time during the machining process of providing at least one captured first signal sequence with a first feature form a machining zone, providing at least one captured second signal sequence with a second feature from the machining zone, and accessing a trained neural network with at least the recorded first and second signal sequences in order to calculate a result for estimating the machining quality.

Abstract: The present invention relates, in one aspect, to a method for process monitoring of a laser machining process for estimating a machining quality, having the following steps, which are carried out in real time during the machining process: —providing (S2) at least one captured first signal sequence with a first feature from the machining zone; —providing (S3) at least one captured second signal sequence with a second feature from the machining zone; —accessing (S4) a trained neural network with at least the recorded first and second signal sequence in order to calculate (S5) a result for estimating the machining quality.

Abstract: A method of laser machining a workpiece is provided, with a) generation of a machining laser beam and imaging of the machining laser beam on the workpiece with at least one optical element; b) machining of the workpiece with the imaged machining laser beam and generation of a cutting gap in the workpiece; c) monitoring of at least one geometric parameter of the cutting gap during step b); and d) regulating the monitored geometric parameter of the cutting gap during step c) for harmonisation with a target value of the geometric parameter of the cutting gap. Further provided is an apparatus for laser machining a workpiece.

Abstract: An optical unit fora laser beam for laser machining of a workpiece is disclosed. With particular application to a laser beam, the optical unit may be applied to a high-power laser beam and comprise an optical element for the optical imaging of the laser beam, and two protective glasses that are transparent for the laser beam, the outer edges of which protective glasses being enclosed in an airtight manner by a holder in such a way that they form an interior space with the holder, the optical element also being arranged in the interior space. A laser machining device is also disclosed.

Abstract: According to the present application, a machining apparatus (10) for the laser machining of a workpiece (12) in a machining zone (13) is provided, having a first interface (14) for a machining laser source for generating a machining laser beam (15), a second interface (16) for a detector device (for detecting radiation (17) emitted by the machining zone (13); an outlet opening (18) for the machining laser beam (14); and first and second laser beam guiding devices (20, 22), wherein the first laser beam guiding device (20), 20a, 20b) is arranged and designed such that it guides the machining laser beam (14) to the second laser beam guiding device (22) and dynamically moves the machining laser beam (14), and the second laser beam guiding device (22) is arranged and designed such that it guides the dynamically moved machining laser beam (14) through the outlet opening (18) and at least partially guides the radiation (17) emitted by the machining zone (13) through the outlet opening to the second interface (16).

Abstract: A machining apparatus for laser machining a workpiece (12) in a machining zone (13) is provided, having a first interface (14) for a machining laser source for generating a machining laser beam (15), an outlet opening (18) for the machining laser beam (15), In an optical system between the first interface (14) and the outlet opening (18), which has at least one laser beam guiding device (22) having at least one movable surface (24) and at least one actuator (26), with which the movable surface (24) is dynamically adjustable, and a cooling device (28) for cooling the at least one actuator (26), wherein the cooling device (28) has at least one primary circuit (30) through which a first cooling fluid can flow without contact with the actuator (26). Furthermore, a set of parts for a machining apparatus for laser machining a workpiece (12) and a method of laser machining a workpiece (12) using such machining apparatus are also provided.

Abstract: The present disclosure relates to a metal machining apparatus having a gas nozzle for generating a gas jet. The apparatus also has a nozzle exit opening on one end on the outside; an electronic camera for acquiring a digital image of the end of the gas nozzle with the nozzle exit opening. The apparatus also includes a pattern recognition module for mapping the digital image to at least one nozzle pattern from the group of nozzle state and/or nozzle type.

Abstract: A machining apparatus for laser machining a workpiece in a machining zone is provided, having an interface for a machining laser source for generating a machining laser beam with a direction of propagation; an outlet opening for the machining laser beam; and an optical system between the interface and the outlet opening, wherein the optical system has: at least one optical unit that adjusts the focal length of the optical system, and at least one stationary laser beam guiding device with at least one movable surface, wherein the at least one movable surface can be adjusted such that it modifies the focal length of the optical system and/or the beam parameter product of the machining laser beam integrated over time in at least one operating mode. Further provided is a method for laser machining a workpiece.

Abstract: According to the present application, a machining apparatus (10) for the laser machining of a workpiece (12) in a machining zone (13) is provided, having a first interface (14) for a machining laser source for generating a machining laser beam (15), a second interface (16) for a detector device (for detecting radiation (17) emitted by the machining zone (13); an outlet opening (18) for the machining laser beam (14); and first and second laser beam guiding devices (20, 22), wherein the first laser beam guiding device (20), 20a, 20b) is arranged and designed such that it guides the machining laser beam (14) to the second laser beam guiding device (22) and dynamically moves the machining laser beam (14), and the second laser beam guiding device (22) is arranged and designed such that it guides the dynamically moved machining laser beam (14) through the outlet opening (18) and at least partially guides the radiation (17) emitted by the machining zone (13) through the outlet opening to the second interface (16).

Abstract: The present disclosure relates to a metal machining apparatus having a gas nozzle for generating a gas jet. The apparatus also has a nozzle exit opening on one end on the outside; an electronic camera for acquiring a digital image of the end of the gas nozzle with the nozzle exit opening. The apparatus also includes a pattern recognition module for mapping the digital image to at least one nozzle pattern from the group of nozzle state and/or nozzle type.

Abstract: A machining apparatus for laser machining a workpiece (12) in a machining zone (13) is provided, having a first interface (14) for a machining laser source for generating a machining laser beam (15), an outlet opening (18) for the machining laser beam (15), In an optical system between the first interface (14) and the outlet opening (18), which has at least one laser beam guiding device (22) having at least one movable surface (24) and at least one actuator (26), with which the movable surface (24) is dynamically adjustable, and a cooling device (28) for cooling the at least one actuator (26), wherein the cooling device (28) has at least one primary circuit (30) through which a first cooling fluid can flow without contact with the actuator (26). Furthermore, a set of parts for a machining apparatus for laser machining a workpiece (12) and a method of laser machining a workpiece (12) using such machining apparatus are also provided.

Abstract: A method and a device for monitoring laser cutting processes in the high-power range above 1 kW mean output envisage automatic quality control after interruption and/or completion of a cutting process carried out with predetermined cutting parameters. According to the disclosure the cutting process is interrupted after a first partial processing step, whereupon a partial section (K1 . . . KX) of the processing path is scanned. This preferably takes place at a higher speed than that for the first partial processing procedure and preferably close to or on the same processing path. On the basis of the scan result at least one quality feature of the processing result is automatically determined and compared with predefined quality specifications. Depending on the result of the comparison a fault message can then be issued, the processing interrupted, reworking of a defect point carried out, at least one cutting parameter adjusted, and the cutting process continued with the changed set of cutting parameters.

Abstract: The present disclosure relates to a machining apparatus for laser machining a workpiece, such as laser cutting. The apparatus includes a machining laser source for generating a machining laser beam; an illumination laser source having a power for generating an illumination laser beam having a spectral range; an outlet opening for the machining laser beam and the illumination laser beam; and a laser beam guiding device which is designed such that the machining laser beam and the illumination laser beam emerge coaxially through the outlet opening; wherein at least one element selected from the power of the illumination laser source and the spectral range of the illumination laser beam is selected such that the illumination by the illumination laser beam is brighter than a self-emission of the workpiece in a machining region during laser machining. Additionally, a method for laser machining a workpiece is also included in the present disclosure.

Abstract: A device and a method for monitoring beam treatment of a workpiece are provided. The device includes at least one illuminating device (12) for illuminating a treatment region of the workpiece during first time intervals; a detecting device (15) for detecting an electromagnetic radiation emanating from the treatment region; and a processing device (19) for separate processing of the electromagnetic radiation detected within the first and within second time intervals. Moreover, a device and a method for laser beam treatment of a workpiece are provided.

Abstract: A method and a device for monitoring laser cutting processes in the high-power range above 1 kW mean output envisage automatic quality control after interruption and/or completion of a cutting process carried out with predetermined cutting parameters. According to the disclosure the cutting process is interrupted after a first partial processing step, whereupon a partial section (K1 . . . . KX) of the processing path is scanned. This preferably takes place at a higher speed than that for the first partial processing procedure and preferably close to or on the same processing path. On the basis of the scan result at least one quality feature of the processing result is automatically determined and compared with predefined quality specifications. Depending on the result of the comparison a fault message can then be issued, the processing interrupted, reworking of a defect point carried out, at least one cutting parameter adjusted, and the cutting process continued with the changed set of cutting parameters.