Abstract: Disclosed herein are thermal interface material comprising liquid epoxy resin that is free of aromatic groups and high loading of aluminum trihydroxide and the use thereof in battery powered vehicles.

Abstract: Disclosed herein are thermal interface materials (TIM) composition comprising: a) a non-reactive polyurethane prepolymer; b) about 70-95 wt % of aluminum trihydroxide (ATH); c) about 0.15-1.5 wt % of at least one silane terminated urethane prepolymer; and d) about 1-20 wt % of at least one plasticizer, with the total weight of the thermal interface material totaling to 100 wt %.

Abstract: Disclosed is a composition including one or more isocyanate functional prepolymers; one or more catalysts for the reaction of isocyanate moieties and active hydrogen containing moieties; one or more mercapto silanes; one or more amino silanes, isocyanato silanes or a mixture thereof; one or more reinforcing fillers comprising one or more high surface area carbon blacks; one or more untreated calcium carbonates; one or more polyisocyanates having an isocyanate functionality of about 2 or greater; and one or more linear plasticizers. Preferably, the isocyanate functional prepolymer is prepared in the presence of at least a portion of the linear plasticizer. Preferably, the isocyanate functional polymer is prepared in the presence of a dialkyl malonate. The composition may be one-part adhesive composition. Also disclosed are methods of applying the compositions to substrates.

Abstract: Provided is a waveguide arrangement, comprising a diffractive input coupling element (11), in particular a volume hologram, a diffractive output coupling element (13), in particular a volume hologram, and optionally a beam expansion element (12), in particular a volume hologram. The expansion element (12) and the output coupling element (13) expand a light beam in different directions.

Abstract: The teachings herein relate to new compositions for thermal interface materials that provide improved thermal conductivity without requiring filler materials that are expensive or abrasive. The improved thermal conductivity is achieved using a combination of increased filler loading, selection of a filler having abroad particle size distribution, and selection of filler that is non-abrasive. In order to achieve maximum thermal conductivity, the combination of the liquid matrix material and the filler preferably are chosen to avoid forming bonds between filler particles. Such bonds can also be avoided by including a surface modifier that modifies the surface of the filler particles.

Abstract: Disclosed is an adhesive system and method of use thereof wherein the adhesive composition comprises a moisture curable adhesive comprised of an isocyanate terminated prepolymer and a cure accelerator having two curatives components having different cure kinetics. The cure accelerator is comprised of an isocyanate reactive compound comprising a primary, secondary or tertiary amino group, or a primary thiol group having faster curing kinetics resulting an increase in bead stability within the first minutes and a polyol selected from a diol and/or triol with slower curing kinetics allowing for sufficient open time and yet a fast strength build up. The preferred method of application of the adhesive system is via a 1K application gun.

Abstract: The teachings herein relate to new compositions for thermal interface materials that provide improved thermal conductivity without requiring filler materials that are expensive or abrasive. The improved thermal conductivity is achieved using a combination of increased filler loading, selection of a filler having abroad particle size distribution, and selection of filler that is non-abrasive. The thermal interface material preferably has a specific gravity of about 4.0 or less, about 3.0 or less, about 2.5 or less, or about 2.4 or less. The thermal interface material may be a two-part composition. In order to achieve maximum thermal conductivity, each part preferably includes a liquid matrix material and dispersed filler. Upon mixing, the first and second parts may react to increase this viscosity (e.g., by polymerizing and/or cross-linking). The first part preferably includes a carbamate-containing compound that reacts with a carbamate-reactive compound, which is preferably in the second component.

Abstract: Disclosed herein are thermal interface materials comprising non-reactive polyurethane prepolymer and high loading of aluminum trihydroxide and the use thereof in battery powered vehicles.

Abstract: Disclosed is epoxy adhesive composition that combine the benefits of both 1K and 2K technologies in one system which demonstrates a good balance of fast fixation, curing speed, desirable mechanical performance, durability, and good oil adsorption once cured. Said epoxy adhesive composition comprising an epoxy resin, a reactive urethane group- and/or urea group-containing polymer having capped isocyanate, an epoxy curing catalyst, a dicyandiamide, and a hardener.

Abstract: The present invention is a toughened one component epoxy adhesive composition demonstrating improved resistance to humidity. Wherein said one-part structural adhesive comprises: A) a blocked PU-polymer toughener compound; B) an epoxy resin component comprising a solid epoxy resin, a liquid epoxy resin, or mixture thereof; C) a curing agent; D) a urea compound; and E) optionally a filler, wherein the blocked PU-polymer toughener (A) is a reaction product of a reaction mixture comprising of: i) a polyether, ii) a hydroxyl-terminated polybutadiene, iii) a polyisocyanate, iv) a chain extender, and v) a capping group.

Abstract: Methods and apparatuses for mounting a material (1) on a carrier (6) are provided. To this end, the material is arranged on a porous layer (2) of an air bearing arrangement (2, 3).

Abstract: A one-component toughened epoxy-modified polyurethane and/or urea adhesive includes a mixture of dicyandiamide and a dihdyrazide as curing agents. The mixture of curing agents permits the adhesive to be cured at lower temperatures while developing good adhesive and mechanical properties in the cured adhesive.

Abstract: The invention is directed to a toughener for epoxy adhesives, the toughener being a reaction product of a bisphenolic blocked PU toughener with a diglycidyl ether-bisphenol product such as liquid DGEBA. The invention includes adhesives comprising the inventive tougheners, methods of using the tougheners and adhesives comprising them, as well as cured inventive adhesives and products comprising them.

Abstract: Adhesive bonds are applied by mixing two adhesives with different properties and dispensing them to form bondlines between substrate pairs. The adhesives are then thermally cured and cooled. Varying the mix ratio permits one to vary the properties of the adhesive mixture so formed for use in bonding many different substrate pairs. The process allows potentially infinite variations of adhesive properties between those of the respective starting adhesives, simply by varying the mix ratio. The invention is especially adapted for use in manufacturing settings in which adhesives are to be applied in multiple places, but differing adhesive properties are needed among the various bonding areas.

Abstract: The present invention relates to an apparatus for flow tempering medical irrigation fluids and to a method carried out with the aid of this apparatus.

Abstract: A system for transporting a carrying plate may include a lifting assembly comprising a carriage, and a carrying assembly. The lifting assembly may include a carriage having one or more lifting arms configured to lift the carrying assembly at least in part by one or more carrying arms of the carrying assembly. A carrying assembly may include a perimeter frame surrounding a perimeter of a carrying plate, one or more carrying arms attached to the perimeter frame, and one or more indexing pins extending or extensible inwardly from the perimeter frame. The one or more indexing pins may detachably secure the carrying plate to the perimeter frame. A method of transporting a carrying plate may include detachably securing a carrying plate to a perimeter frame of a carrying assembly and transporting the carrying assembly with a lifting assembly.

Abstract: Plant (1) comprising at least one apparatus (2-4) for additively manufacturing three-dimensional objects by means of successive layerwise selective irradiation and consolidation of layers of a build material which can be consolidated by means of an energy source, which plant (1) comprises at least one module (5) separably connected or connectable with the apparatus (2-4), wherein the plant (1) comprises at least one tunnel structure (7) through which the at least one module (5) is moveable in a tunnel transport direction (10).

Abstract: Adhesive bonds are applied by mixing two adhesives with different properties and dispensing them to form bondlines between substrate pairs. The adhesives are then thermally cured and cooled. Varying the mix ratio permits one to vary the properties of the adhesive mixture so formed for use in bonding many different substrate pairs. The process allows potentially infinite variations of adhesive properties between those of the respective starting adhesives, simply by varying the mix ratio. The invention is especially adapted for use in manufacturing settings in which adhesives are to be applied in multiple places, but differing adhesive properties are needed among the various bonding areas.

Abstract: Epoxy adhesives include a latent curing agent, a reactive toughener having capped isocyanate groups, and certain urea compounds. The toughener is made by chain extending and capping a mixture of isocyanate-terminated prepolymers. The prepolymers include an isocyanate-terminated polyether and an isocyanate-terminated diene polymer. The adhesives have excellent wash-off resistance and excellent ability to adhere to oily substrates.

Abstract: The invention is an epoxy resin system useful as an adhesive for high temperature applications. The system is a combination of a diglycidyl ether a bisphenol epoxy resin(s), at amounts of 30-70% by weight, with 1-10% by weight of an epoxy novolac resin 10-30% by weight of a polyurethane toughener which preferably has the terminal isocyanate functional group blocked, 1-8% by weight of a hardener, 0.1-% by weight of a cure accelerator, preferably a latent urea cure accelerator, provides the desired balance of mechanical strength and elastic modulus. The epoxy novolac resin is characterized by at least one of the following features: (i) having a viscosity at 25 degrees C. of less than 3000 mPa-s according to ASTM D-445, (ii) an average number of epoxide groups per molecule of more than 2 but less than 3.7, and (iii) a molecular weight of less than 750 g/mol.