Patents by Inventor Andreas M. Th. P. van der Putten

Andreas M. Th. P. van der Putten has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of metallizing contact holes in a semiconductor device
    Patent number: 5198389
    Abstract: A TiW layer (14 and 14') between a nickel plug (16 and 16') and a silicon substrate (1) of a semiconductor device precludes the formation of nickel silicides. The nickel plugs are formed by means of an electroless nickel bath to which stabilizers are added which ensure that the contact holes (13 and 13') are filled with nickel right up to the edge.
    Type: Grant
    Filed: February 10, 1992
    Date of Patent: March 30, 1993
    Assignee: U.S. Philips Corp.
    Inventors: Andreas M. Th. P. van der Putten, Johannes W. G. DeBakker, Johannes M. G. Rikken