Abstract: The method for copper electroplating according to the present invention comprises an aqueous acidic copper plating bath containing a leveler additive which forms copper trenches having a cross-sectional round shape under direct current plating conditions, and at least one reverse current pulse cycle consisting of one forward current pulse and one reverse current pulse wherein the fraction of the reverse charge to the forward charge applied to the substrate in said at least one current pulse cycle ranges between 0.1 to 5%. The method is particularly suitable for simultaneously filling blind micro vias and plating trenches with a rectangular cross-sectional shape.

Abstract: The invention concerns a process of manufacturing optical components. A replication tool, a sub-master or a replica is manufactured using a structured element (for example a master) and a substrate. A structure of the structured element is replicated into liquid or plastically deformable material disposed at a first place on said substrate, then hardened to make it dimensionally stable, whereon the structured element is removed. These replicating, hardening and removing steps are repeated for a second, third, etc. place on said substrate the same structured element.

Abstract: According to the invention, a micro-structured element is manufactured by replicating/shaping (molding or embossing or the like) a 3D-structure in a preliminary product using an replication tool (1). The replication tool comprises a spacer portion (1c) protruding from a replication surface (1a). The replica (the micro-structured element, for example the micro-optical element or micro-optical element component) may be made of epoxy, which is cured—for example UV cured—while the replication tool is still in place. The replication process may be an embossing process, where the deformable or viscous or liquid component of the preliminary product to be shaped is placed on a surface and then the replication tool is pressed against this surface. As an alternative, the replication process may be a molding process.

Abstract: The invention concerns a process of manufacturing optical components. A replication tool, a sub-master or a replica is manufactured using a structured element (for example a master) and a substrate. A structure of the structured element is replicated into liquid or plastically deformable material disposed at a first place on said substrate, then hardened to make it dimensionally stable, whereon the structured element is removed. These replicating, hardening and removing steps are repeated for a second, third, etc. place on said substrate the same structured element.

Abstract: According to the invention, a micro-structured element is manufactured by replicating/shaping (molding or embossing or the like) a 3D-structure in a preliminary product using an replication tool (1). The replication tool comprises a spacer portion (1c) protruding from a replication surface (1a). The replica (the micro-structured element, for example the micro-optical element or micro-optical element component) may be made of epoxy, which is cured—for example UV cured—while the replication tool is still in place. The replication process may be an embossing process, where the deformable or viscous or liquid component of the preliminary product to be shaped is placed on a surface and then the replication tool is pressed against this surface. As an alternative, the replication process may be a molding process.

Abstract: A three-dimensional formed metallic structure with varying thickness including sloping flanks is formed on a substrate. A conductive layer is applied to the substrate initially, in the form of laterally spaced electrically isolated conductive islands. A cathodic potential is connected to at least one of the islands, leaving others unconnected, and deposition proceeds due to the cathodic potential. As metallic material is deposited and builds up, it eventually contacts adjacent islands, thereby coupling the cathodic potential to a wider area where deposition commences. Deposition is thickest at the at least one island initially coupled to the cathodic potential and thinner progressing away, forming flanks that are linearly sloped, curved or similarly formed by thickness variations the vary proceeding away from the initially coupled island or islands.