Abstract: Methods and systems for laser-based processing of materials are disclosed wherein a scalable laser architecture, based on planar waveguide technology, provides for pulsed laser micromachining applications while supporting higher average power applications like laser welding and cutting. Various embodiments relate to improvements in planar waveguide technology which provide for stable operation at high powers with a reduction in spurious outputs and thermal effects. At least one embodiment provides for micromachining with pulsewidths in the range of femtoseconds to nanoseconds. In another embodiment, 100 W or greater average output power operation is provided for with a diode-pumped, planar waveguide architecture.

Abstract: A system for probing circuit elements, includes a panel fixture, probe holder and stage. The fixture has a platen surface to support a work piece having work piece surface. The work piece surface is substantially parallel to the platen surface and has a target element thereon. The probe holder is configured to support a probe for detecting a characteristic of the target element. A stage rotates the probe holder about an axis substantially orthogonal to the platen surface, to align the probe with probe locations associated with the circuit element, so that the characteristic of the circuit element can detected by the probe. Fixturing motion can be optimized for efficient work piece manufacturing. Calibration and vision subassemblies are also provided.

Abstract: Methods and systems for laser-based processing of materials are disclosed wherein a scalable laser architecture, based on planar waveguide technology, provides for pulsed laser micromachining applications while supporting higher average power applications like laser welding and cutting. Various embodiments relate to improvements in planar waveguide technology which provide for stable operation at high powers with a reduction in spurious outputs and thermal effects. At least one embodiment provides for micromachining with pulsewidths in the range of femtoseconds to nanoseconds. In another embodiment, 100W or greater average output power operation is provided for with a diode-pumped, planar waveguide architecture.

Abstract: An automated method for trimming a circuit element disposed on a substrate includes transmitting a first signal to move a substrate, having a circuit element disposed thereon, to a trimming location. A second signal is transmitted to emit a light beam, with the substrate at the trimming location, to trim the circuit element.

Abstract: Methods and systems for laser-based processing of materials are disclosed wherein a scalable laser architecture, based on planar waveguide technology, provides for pulsed laser micromachining applications while supporting higher average power applications like laser welding and cutting. Various embodiments relate to improvements in planar waveguide technology which provide for stable operation at high powers with a reduction in spurious outputs and thermal effects. At least one embodiment provides for micromachining with pulsewidths in the range of femtoseconds to nanoseconds. In another embodiment, 100W or greater average output power operation is provided for with a diode-pumped, planar waveguide architecture.

Abstract: Methods and systems for laser-based processing of materials are disclosed wherein a scalable laser architecture, based on planar waveguide technology, provides for pulsed laser micromachining applications while supporting higher average power applications like laser welding and cutting. Various embodiments relate to improvements in planar waveguide technology which provide for stable operation at high powers with a reduction in spurious outputs and thermal effects. At least one embodiment provides for micromachining with pulsewidths in the range of femtoseconds to nanoseconds. In another embodiment, 100W or greater average output power operation is provided for with a diode-pumped, planar waveguide architecture.