Patents by Inventor Andreas Meckes
Andreas Meckes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10209204Abstract: An X-ray inspection system includes an X-ray source and a detector. A rotary table is arranged between the X-ray source and the detector. The rotary table is configured to secure a test object on the rotary table. The rotary table is arranged on a positioning table. The positioning table is configured to move parallel to an xy-plane between the X-ray source and the detector. The xy-plane is perpendicular to a surface of the detector extending parallel to the xz-plane and the rotary table is configured to rotate about a z-axis.Type: GrantFiled: October 21, 2014Date of Patent: February 19, 2019Assignee: YXLON INTERNATIONAL GMBHInventors: Andreas Mecke, Jan Spalding, Axel Klein
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Publication number: 20160238541Abstract: An X-ray inspection system includes an X-ray source and a detector. A rotary table is arranged between the X-ray source and the detector. The rotary table is configured to secure a test object on the rotary table. The rotary table is arranged on a positioning table. The positioning table is configured to move parallel to an xy-plane between the X-ray source and the detector. The xy-plane is perpendicular to a surface of the detector extending parallel to the xz-plane and the rotary table is configured to rotate about a z-axis.Type: ApplicationFiled: October 21, 2014Publication date: August 18, 2016Inventors: Andreas Mecke, Jan Spalding, Axel Klein
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Publication number: 20110133297Abstract: A semiconductor is disclosed. In one embodiment, the semiconductor includes a semiconductor substrate having an active area region, a covering configured to protect the active area region, and a carrier. An interspace is located between the carrier and the covering. The interspace is filled with an underfiller material is disclosed.Type: ApplicationFiled: February 11, 2011Publication date: June 9, 2011Applicant: Avago Technologies Wireless IP (Singapore) Pte. Ltd.Inventors: Martin FRANOSCH, Andreas MECKES, Edward FUERGUT
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Patent number: 7692317Abstract: Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure to form a cavity together with the substrate between the substrate and the photo-resist material structure, wherein the cavity separates the micromechanical structure and the photo-resist material structure and has an opening, and a closure for closing the opening to close the cavity.Type: GrantFiled: September 28, 2007Date of Patent: April 6, 2010Assignee: Infineon Technologies AGInventors: Martin Franosch, Andreas Meckes, Winfried Nessler, Klaus-Gunter Oppermann
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Patent number: 7682777Abstract: A method for producing a polymer structure on a patterning region of a substrate surface includes the steps of depositing an adhesion layer having a first polymer material onto the substrate surface, patterning the adhesion layer such that the first polymer material of the adhesion layer is removed in a first region and the first polymer material of the adhesion layer remains in a second region including the patterning region, depositing a polymer layer of a second polymer material onto the substrate surface and the adhesion layer and patterning the polymer layer such that the polymer structure forms in the second region.Type: GrantFiled: March 22, 2006Date of Patent: March 23, 2010Assignee: Infineon Technologies AGInventors: Martin Franosch, Andreas Meckes, Klaus-Guenter Oppermann
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Patent number: 7515018Abstract: An acoustic resonator is described, the acoustic resonator comprising a stack of a first and a second piezoelectric body, wherein said first and second piezoelectric bodies have substantially the same spatial piezoelectric orientation, an intermediate intermediate electrode being arranged between said first and said second piezoelectric body forming a first terminal of said acoustic resonator, and first and second electrodes, wherein said first electrode is arranged such that said first piezoelectric body is arranged between said first electrode and said intermediate electrode, wherein said second electrode is arranged such that said second piezoelectric body is arranged between said second electrode and said intermediate electrode, and wherein said first and said second electrode are electrically connected to each other forming a second terminal of said acoustic resonator.Type: GrantFiled: August 31, 2006Date of Patent: April 7, 2009Inventors: Martin Handtmann, Jyrki Kaitila, Andreas Meckes, Lueder Elbrecht
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Publication number: 20080055020Abstract: An acoustic resonator is described, the acoustic resonator comprising a stack of a first and a second piezoelectric body, wherein said first and second piezoelectric bodies have substantially the same spatial piezoelectric orientation, an intermediate intermediate electrode being arranged between said first and said second piezoelectric body forming a first terminal of said acoustic resonator, and first and second electrodes, wherein said first electrode is arranged such that said first piezoelectric body is arranged between said first electrode and said intermediate electrode, wherein said second electrode is arranged such that said second piezoelectric body is arranged between said second electrode and said intermediate electrode, and wherein said first and said second electrode are electrically connected to each other forming a second terminal of said acoustic resonator.Type: ApplicationFiled: August 31, 2006Publication date: March 6, 2008Applicant: Infineon Technologies AGInventors: Martin Handtmann, Jyrki Kaitila, Andreas Meckes, Lueder Elbrecht
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Publication number: 20080017974Abstract: Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure to form a cavity together with the substrate between the substrate and the photo-resist material structure, wherein the cavity separates the micromechanical structure and the photo-resist material structure and has an opening, and a closure for closing the opening to close the cavity.Type: ApplicationFiled: September 28, 2007Publication date: January 24, 2008Applicant: Infineon Technologies AGInventors: MARTIN FRANOSCH, Andreas Meckes, Winfried Nessler, Klaus-Gunter Oppermann
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Patent number: 7300823Abstract: Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure to form a cavity together with the substrate between the substrate and the photo-resist material structure, wherein the cavity separates the micromechanical structure and the photo-resist material structure and has an opening, and a closure for closing the opening to close the cavity.Type: GrantFiled: November 17, 2004Date of Patent: November 27, 2007Assignee: Infineon Technologies AGInventors: Martin Franosch, Andreas Meckes, Winfried Nessler, Klaus-Gunter Oppermann
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Patent number: 7288435Abstract: In a method for producing a cover for a region of a substrate, first a frame structure is produced in the region of the substrate, and then a cap structure is attached to the frame structure so that the region under the cap structure is covered. Thus, sensitive devices may be protected easily and at low cost from external influences and particularly from a casting material for casting the entire packaged device, which results when a diced chip is cast.Type: GrantFiled: August 18, 2004Date of Patent: October 30, 2007Assignee: Infineon Technologies AGInventors: Robert Aigner, Martin Franosch, Andreas Meckes, Klaus-Guenter Oppermann, Marc Strasser
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Patent number: 7268436Abstract: An electronic device can include a top side with circuit structures. The circuit structures form the bottom region of a cavity. Each cavity can be surrounded by a cavity frame made of plastic and can have a cavity cover made of semiconductor material.Type: GrantFiled: March 9, 2004Date of Patent: September 11, 2007Assignee: Infineon Technologies AGInventors: Robert Aigner, Albert Auburger, Frank Daeche, Guenter Ehrler, Andreas Meckes, Horst Theuss, Michael Weber
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Publication number: 20070182029Abstract: A semiconductor is disclosed. In one embodiment, the semiconductor includes a semiconductor substrate having an active area region, a covering configured to protect the active area region, and a carrier. An interspace is located between the carrier and the covering. The interspace is filled with an underfiller material is disclosed.Type: ApplicationFiled: February 8, 2007Publication date: August 9, 2007Applicant: INFINEON TECHNOLOGIES AGInventors: Martin Franosch, Andreas Meckes, Edward Fuergut
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Patent number: 7234237Abstract: In a method for producing a protective cover for a device formed in a substrate, at first a sacrificial structure is produced on the substrate, wherein the sacrificial structure comprises a first portion covering a first area of the substrate including the device and a second portion extending from the first portion into a second area of the substrate including no device. Then a first cover layer is deposited that encloses the sacrificial structure such that the second portion of the sacrificial structure is at least partially exposed. Then the sacrificial structure is removed, and the structure formed by the removal of the sacrificial structure is closed.Type: GrantFiled: April 9, 2004Date of Patent: June 26, 2007Assignee: Infineon Technologies AGInventors: Martin Franosch, Andreas Meckes, Klaus-Günter Oppermann
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Publication number: 20060240643Abstract: A method for producing a polymer structure on a patterning region of a substrate surface includes the steps of depositing an adhesion layer having a first polymer material onto the substrate surface, patterning the adhesion layer such that the first polymer material of the adhesion layer is removed in a first region and the first polymer material of the adhesion layer remains in a second region including the patterning region, depositing a polymer layer of a second polymer material onto the substrate surface and the adhesion layer and patterning the polymer layer such that the polymer structure forms in the second region.Type: ApplicationFiled: March 22, 2006Publication date: October 26, 2006Applicant: Infineon Technologies AGInventors: Martin Franosch, Andreas Meckes, Klaus-Guenter Oppermann
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Publication number: 20060234476Abstract: An electronic component includes a semiconductor die which exhibits on its active top side above an active surface area a self-supporting electrically conductive cover layer which is supported by through lines and forms a hollow space to the active surface area. A method for producing the electronic component includes additional features.Type: ApplicationFiled: June 13, 2006Publication date: October 19, 2006Inventors: Andreas Meckes, Horst Theuss, Michael Weber
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Publication number: 20060191868Abstract: In the inventive method for the wet-chemical removal of a sacrificial material in a material structure, there is first provided the material structure, wherein the material structure has a treatment region with the sacrificial material accessible through an opening. Subsequently, the sacrificial material is brought into contact with a wet-chemical treatment agent through the opening for the removal of the sacrificial material, wherein a mechanical vibration is generated in the wet-chemical treatment agent or in the wet-chemical treatment agent and the material structure during the contacting of the sacrificial material with the wet-chemical treatment agent.Type: ApplicationFiled: February 2, 2006Publication date: August 31, 2006Applicant: Infineon Technologies AGInventors: Martin Franosch, Andreas Meckes, Klaus-Guenter Oppermann
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Patent number: 7061098Abstract: An electronic component includes a semiconductor die which exhibits on its active top side above an active surface area a self-supporting electrically conductive cover layer which is supported by through lines and forms a hollow space to the active surface area. A method for producing the electronic component includes additional features.Type: GrantFiled: November 26, 2003Date of Patent: June 13, 2006Assignee: Infineon Technologies AGInventors: Andreas Meckes, Horst Theuss, Michael Weber
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Patent number: 7037844Abstract: A method for manufacturing a chip housing includes a first basis having a photolithograpically structurable layer on a main face, structured into a cover. A chip has the structure at a main face between first contact elements. A second photolithograpically structurable layer applied to the main face is structured forming a recess surrounded by a wall near the structure exposing the first contact elements. Then, the first basis and the chip are merged with the structure and the cover facing and aligned with each other, and the recess closed by the cover. Removing the first basis leads to an on-chip cavity. Afterwards, a second basis and the chip are merged with the first contact elements connected to the second basis via a conductive structure. Afterwards, the second basis is removed for exposing the conductive structure. The method is less subject to cost and size limitations of known housing technologies.Type: GrantFiled: October 2, 2003Date of Patent: May 2, 2006Assignee: Infineon Technologies AGInventors: Frank Dāche, Jochen Dangelmaier, Günter Ehrler, Andreas Meckes, Michael Weber
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Patent number: 6955950Abstract: In a method for generating a protective cover for a device, where a substrate is provided, which comprises the device, first, a sacrificial pattern is generated on the substrate. The sacrificial pattern covers at least an area of the substrate, which comprises the device. Then, a polymer layer is deposited, which comprises at least on sacrificial pattern. Then, an opening will be formed in the polymer layer to expose a portion of the sacrificial pattern. Then, the sacrificial pattern will be removed and the formed opening in the polymer layer is closed.Type: GrantFiled: July 9, 2004Date of Patent: October 18, 2005Assignee: Infineon Technologies AGInventors: Robert Aigner, Martin Franosch, Andreas Meckes, Klaus-Günter Oppermann, Marc Strasser
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Patent number: 6939734Abstract: In a method for producing a protective cover for a device which is formed in a substrate, a first cover layer is initially deposited on the substrate, the first cover layer covering an area of the substrate which includes the device. Subsequently, an opening is formed in the first cover layer, the opening exposing that area of the substrate which includes the device. Then the opening formed in the first cover layer is filled up using a filling material. Subsequently, a second cover layer is deposited on the first cover layer and in the opening of the first cover layer which is filled up with the filling material. Thereafter, an opening is formed in the second cover layer to expose an area of the filling material. Finally, the filling material covering that area of the substrate which includes the device is removed, and the opening formed in the second cover layer is closed.Type: GrantFiled: April 8, 2004Date of Patent: September 6, 2005Assignee: Infineon Technologies AGInventors: Martin Franosch, Andreas Meckes, Klaus-Günter Oppermann