Patents by Inventor Andreas Menhard

Andreas Menhard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9269525
    Abstract: A high-temperature-resistant composite body is formed by joining over an area of a first, nonmetallic section via a bonding solder layer to a second, metallic section composed of Mo, an Mo-based alloy, W or a W-based alloy. A first arrangement composed of the first section, a first Zr solder and an intermediate layer is firstly soldered together in a first soldering step. A second arrangement of the resulting partial composite body, a second solder adjoining the intermediate layer and the second section is subsequently soldered together in a second soldering step. The intermediate layer at least 90 atom % of at least one of the elements Ta, Nb, W. The second solder is formed by precisely one material selected from Ti, Ti-based solder combination, V-based solder combination, Zr or Zr-based solder combination and it melts at a lower temperature than the first Zr solder in the second arrangement.
    Type: Grant
    Filed: November 22, 2012
    Date of Patent: February 23, 2016
    Assignee: Plansee SE
    Inventors: Thomas Mueller, Klaus Ennemoser, Wolfgang Glatz, Andreas Menhard
  • Publication number: 20140334606
    Abstract: A high-temperature-resistant composite body is formed by joining over an area of a first, nonmetallic section via a bonding solder layer to a second, metallic section composed of Mo, an Mo-based alloy, W or a W-based alloy. A first arrangement composed of the first section, a first Zr solder and an intermediate layer is firstly soldered together in a first soldering step. A second arrangement of the resulting partial composite body, a second solder adjoining the intermediate layer and the second section is subsequently soldered together in a second soldering step. The intermediate layer at least 90 atom % of at least one of the elements Ta, Nb, W. The second solder is formed by precisely one material selected from Ti, Ti-based solder combination, V-based solder combination, Zr or Zr-based solder combination and it melts at a lower temperature than the first Zr solder in the second arrangement.
    Type: Application
    Filed: November 22, 2012
    Publication date: November 13, 2014
    Inventors: Thomas Mueller, Klaus Ennemoser, Wolfgang Glatz, Andreas Menhard