Abstract: A chip card has a flexible inlay including chip card contacts on an upper face of the inlay and which supports an integrated circuit and an antenna, both of which are spaced apart from the contacts. The chip card further includes a top layer with a recess in which the contacts are placed, and a metal layer which is located below the inlay and includes a slit that extends from a peripheral surface of the metal layer to the area of the recess and extends through the entire thickness of the metal layer.

Abstract: A card-shaped data carrier includes a card body with at least one arrangement region for receiving a chip module arranged in the arrangement region of the card body. The chip module has at least one chip, a contact structure and at least one antenna. The card body is formed from at least two layers, including a first layer configured as a metal layer with at least one slit extending from a circumferential surface of the metal layer into the region of the arrangement region for the chip module and through the entire thickness of the metal layer; a second layer formed as a back injection molded layer including a back injection molding material. The back injection molded layer is arranged on the metal layer so the slit of the metal layer is at least partially filled with the back injection molding material.

Abstract: A data storage medium in the form of a card, includes: a flexible inlay with a contact structure located on an upper face of the inlay. The inlay has an integrated circuit spaced apart from the contact structure and has at least one antenna; an upper layer, which is located above the inlay, wherein the upper layer has an opening, in which the contact structure is located; and a lower layer, which is located below the inlay. The upper layer includes a continuous metal layer and a ferrite layer, the ferrite layer being located between the metal layer and the flexible inlay. A method is provided for producing a data storage medium in the form of a card.

Abstract: A chip card has a flexible inlay including chip card contacts on an upper face of the inlay and which supports an integrated circuit and an antenna, both of which are spaced apart from the contacts. The chip card further includes a top layer with a recess in which the contacts are placed, and a metal layer which is located below the inlay and includes a slit that extends from a peripheral surface of the metal layer to the area of the recess and extends through the entire thickness of the metal layer.

Abstract: A card element for a chip card, includes an outer metal layer with a flat surface interrupted only by a module opening for receiving a chip module. The module opening extends to an inner side and includes a ferrite layer located on the inner side and through which the opening extends. An inner metal layer is disposed on the ferrite layer through which a portion of the module opening has a reduced cross-section extends. A slit extends from a peripheral surface of the inner metal layer to the module opening and extends through the entire thickness of the inner metal layer. A final layer is made of plastic and disposed on the inner metal layer.

Abstract: A laminating body for laminating a foil onto a substrate includes a pressure area on which there is imprinted a structure which forms an embossing in the foil upon lamination of the foil onto the substrate.

Abstract: A laminating body for laminating a foil onto a substrate includes a pressure area on which there is imprinted a structure which forms an embossing in the foil upon lamination of the foil onto the substrate.

Abstract: A laminating body for laminating a foil onto a substrate includes a pressure area on which there is imprinted a structure which forms an embossing in the foil upon lamination of the foil onto the substrate.

Abstract: A laminating body for laminating a foil onto a substrate includes a pressure area on which there is imprinted a structure which forms an embossing in the foil upon lamination of the foil onto the substrate.