Abstract: A manufacturing method is provided which comprises forming recesses in a front side of a wafer, connecting a first temporary holding body to the front side of the recessed wafer, thereafter thinning the wafer from a back side, connecting a second temporary holding body to the back side, and thereafter removing the first temporary holding body.

Abstract: A transponder inlay for a document for personal identification having a transponder substrate, for arrangement of a transponder unit comprising a chip and an antenna, a covering layer, an adhesive layer, wherein the adhesive layer is arranged between the transponder substrate and the covering layer, wherein the transponder substrate has a cutout and the adhesive layer extends at least partly into the cutout.

Abstract: A smart card module for a smart card, comprising a chip having electrical contacts at a front side; a first laminate layer, wherein a rear side of the chip is connected to the first laminate layer, the rear side of the chip opposite the front side; a second laminate layer; a first conductive layer, wherein the electrical contacts of the chip are connected to the first conductive layer and the first conductive layer is arranged between the chip and the second laminate layer; and an adhesive material arranged between the chip and the conductive layer and/or the second laminate layer.

Abstract: A smart card module for use in a smart card includes a microchip and a contact zone for making contact with the microchip by means of a reader. The microchip can be enclosed by an encapsulation which can enclose the microchip completely from all sides.

Abstract: A smart card module for use in a smart card includes a microchip and a contact zone for making contact with the microchip by means of a reader. The microchip can be enclosed by an encapsulation which can enclose the microchip completely from all sides.

Abstract: In various embodiments, a transponder inlay for a document for personal identification may include a cover; an adhesive layer arranged on the cover; a chip arranged on the adhesive layer; an antenna connected to the chip; and a top layer on the adhesive layer, wherein the top layer has a top and a bottom and wherein the bottom of the top layer is connected to the cover by means of the adhesive layer and wherein the antenna is arranged on the top of the top layer such that the antenna is at least to some extent physically separated from the adhesive layer by the top layer.

Abstract: A smart card module and a method for producing a smart card module are provided. The smart card module comprises a semiconductor chip having a contact side with a plurality of contacts, and a base material with at least one metal layer. The contact side of the semiconductor chip faces the base material and the plurality of contacts of the semiconductor chip are electrically connected to the metal layer. The semiconductor chip and at least a portion of the base material are covered with an encapsulation layer.

Abstract: A document for personal identification, having a chip module including the following components: a chip and a leadframe, wherein the chip is connected to the leadframe, an outer cover, wherein the outer cover is connected to a transponder substrate. A first component of the chip module is connected to the outer cover and a second component of the chip module is connected to the transponder substrate in such a way that, in the case of separation of outer cover and transponder substrate, the first component of the chip module is separated from the second component of the chip module.

Abstract: In various embodiments, a transponder inlay for a document for personal identification may include a cover; an adhesive layer arranged on the cover; a chip arranged on the adhesive layer; an antenna connected to the chip; and a top layer on the adhesive layer, wherein the top layer has a top and a bottom and wherein the bottom of the top layer is connected to the cover by means of the adhesive layer and wherein the antenna is arranged on the top of the top layer such that the antenna is at least to some extent physically separated from the adhesive layer by the top layer.

Abstract: A smart card module and a method for producing a smart card module are provided. The smart card module comprises a semiconductor chip having a contact side with a plurality of contacts, and a base material with at least one metal layer. The contact side of the semiconductor chip faces the base material and the plurality of contacts of the semiconductor chip are electrically connected to the metal layer. The semiconductor chip and at least a portion of the base material are covered with an encapsulation layer.

Abstract: A chip module comprises a substrate, a chip arranged on one side of the substrate and conductor structures arranged on at least one side of the substrate and conductively connected to the chip. At least one stiffening element is arranged on one side of the substrate and a moulding cap encapsulates at least the chip. For producing the chip module, provision is made for providing a substrate and applying conductor structures to at least one side of the substrate. At least one stiffening element is mounted onto one side of the substrate. Furthermore, a chip is mounted onto one side of the substrate and connected to the conductor structures. A moulding compound is applied on the substrate, such that the chip is covered.

Abstract: A document for personal identification, having a chip module including the following components: a chip and a leadframe, wherein the chip is connected to the leadframe, an outer cover, wherein the outer cover is connected to a transponder substrate. A first component of the chip module is connected to the outer cover and a second component of the chip module is connected to the transponder substrate in such a way that, in the case of separation of outer cover and transponder substrate, the first component of the chip module is separated from the second component of the chip module.

Abstract: A transponder inlay for a document for personal identification having a transponder substrate, for arrangement of a transponder unit comprising a chip and an antenna, a covering layer, an adhesive layer, wherein the adhesive layer is arranged between the transponder substrate and the covering layer, wherein the transponder substrate has a cutout and the adhesive layer extends at least partly into the cutout.

Abstract: A chip module comprises a substrate, a chip arranged on one side of the substrate and conductor structures arranged on at least one side of the substrate and conductively connected to the chip. At least one stiffening element is arranged on one side of the substrate and a moulding cap encapsulates at least the chip. For producing the chip module, provision is made for providing a substrate and applying conductor structures to at least one side of the substrate. At least one stiffening element is mounted onto one side of the substrate. Furthermore, a chip is mounted onto one side of the substrate and connected to the conductor structures. A moulding compound is applied on the substrate, such that the chip is covered.

Abstract: A chip card module including a substrate and also conductor patterns, which are applied on at least one side of the substrate without any adhesive. A chip is arranged on one side of the substrate and connected in an electrically conducting manner to the conductor patterns. A mold cap encapsulates at least part of the chip and of the conductor patterns. The method of producing such a chip card module includes providing a substrate, applying conductor patterns to at least one side of the substrate without any adhesive, mounting a chip on one side of the substrate, connecting the chip to the conductor patterns, and applying a molding compound on the substrate, so that at least part of the chip and of the conductor patterns is covered.

Abstract: A contactless chip card and a method for producing a contactless chip card in which a plastic carrier having clearances is provided, on which an antenna coil is arranged on an upper side of the plastic carrier and a device having an integrated circuit is arranged on a rear side of the plastic carrier that is opposite from the upper side, an electrical connection is produced between the coil and the device, the plastic carrier is introduced into an injection mold and a card body is molded onto the rear side of the plastic carrier by the injection-molding process.

Abstract: A contactless data storage medium has at least two antennas, in each case for different transmission bands. This makes it possible to configure a data storage medium such that it can be operated with read/write units that operate in accordance with different standards. At least two of the antennas form a unit, so that a configuration such as this can be produced at very low cost.

Abstract: A method is described for producing a structured metal layer used, for example, as an antenna for RF ID tags. The structured metal layer is electrodeposited on a cathode, on the surface of which conducting and non-conducting regions are defined. Applied to the deposited metal layer in a residual volume is an adhesive with which the structured metal layer can be made to adhere firmly on a carrier layer.