Patents by Inventor Andreas Neuber

Andreas Neuber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250123186
    Abstract: The present disclosure relates to systems and methods for detecting anomalies in a semiconductor processing system. According to certain embodiments, one or more external sensors are mounted to a sub-fab component, communicating with the processing system via a communication channel different than a communication channel utilized by the sub-fab component and providing extrinsic sensor data that the sub-fab component is not configured to provide. The extrinsic sensor data may be combined with sensor data from a processing tool of the system and/or intrinsic sensor data of the sub-fab component to form virtual sensor data. In the event the virtual data exceeds or falls below a threshold, an intervention or a maintenance signal is dispatched, and in certain embodiments, an intervention or maintenance action is taken by the system.
    Type: Application
    Filed: December 20, 2024
    Publication date: April 17, 2025
    Inventors: Ryan T. DOWNEY, Hemant P. MUNGEKAR, James L'HEUREUX, Andreas NEUBER, Michael W. JOHNSON, Joseph VAN GOMPEL, Gino Gerardo CRISPIERI, Tony H. TONG, Maxime CAYER, John L. KOENIG, Mike M. HUANG
  • Patent number: 12203828
    Abstract: The present disclosure relates to systems and methods for detecting anomalies in a semiconductor processing system. According to certain embodiments, one or more external sensors are mounted to a sub-fab component, communicating with the processing system via a communication channel different than a communication channel utilized by the sub-fab component and providing extrinsic sensor data that the sub-fab component is not configured to provide. The extrinsic sensor data may be combined with sensor data from a processing tool of the system and/or intrinsic sensor data of the sub-fab component to form virtual sensor data. In the event the virtual data exceeds or falls below a threshold, an intervention or a maintenance signal is dispatched, and in certain embodiments, an intervention or maintenance action is taken by the system.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: January 21, 2025
    Assignee: Applied Materials, Inc.
    Inventors: Ryan T. Downey, Hemant P. Mungekar, James L'Heureux, Andreas Neuber, Michael W. Johnson, Joseph A. Van Gompel, Gino Gerardo Crispieri, Tony H. Tong, Maxime Cayer, John L Koenig, Mike M. Huang
  • Patent number: 12134823
    Abstract: Embodiments described herein generally relate to methods for controlling a processing system. Particularly, subfab components of the processing system may be controlled based on the flow of materials into the processing system. In some embodiments, the flow of an inert gas used to dilute the effluent gases may be controlled in accordance with the flow of one or more precursor gases. Thus, the cost of running the processing system is reduced while mitigating critical EHS concerns.
    Type: Grant
    Filed: July 1, 2022
    Date of Patent: November 5, 2024
    Assignee: Applied Materials, Inc.
    Inventor: Andreas Neuber
  • Publication number: 20240077890
    Abstract: The present disclosure generally relates to methods and system used to collect waste fluids. A system controller is disclosed to control the operation of at least a portion of the system. The controller has a CPU. The fabrication facility includes a first processing system having fluid dispensed therein for processing a material on a part. A first drain is configured to collect the processing fluid as waste fluid after processing the part. The fabrication facility also includes a waste collection system fluidly coupled to the system drain. The waste collection system has two or more valves configured to couple the system drain and two or more facility drains. Each facility drain is uniquely coupled to one of the two or more valves. The CPU is configured to operate the valves between an open and a closed state in response to the fluid entering the system drain.
    Type: Application
    Filed: September 1, 2022
    Publication date: March 7, 2024
    Inventors: Maxime CAYER, John L. KOENIG, Tony H. TONG, Shaun W. CRAWFORD, James L'HEUREUX, Andreas NEUBER, Ching-Hong HSIEH
  • Publication number: 20240053226
    Abstract: The invention relates to a wear part (10E). The wear part (10E) has a part interior (14) and a wear layer (12E). The wear layer (12E) is produced by additive manufacturing, covers the part interior (14) and has a wear indicator (18E) which is produced by additive manufacturing and is designed to indicate a state of wear of the wear part (10E) if the wear indicator (18E) is exposed and/or removed due to wear. Advantageously, the wear part (10E) can allow a simple wear monitoring by monitoring the wear indicator (18E).
    Type: Application
    Filed: December 9, 2021
    Publication date: February 15, 2024
    Inventors: Reinhard ORTNER, Andreas NEUBER
  • Publication number: 20220341821
    Abstract: The present disclosure relates to systems and methods for detecting anomalies in a semiconductor processing system. According to certain embodiments, one or more external sensors are mounted to a sub-fab component, communicating with the processing system via a communication channel different than a communication channel utilized by the sub-fab component and providing extrinsic sensor data that the sub-fab component is not configured to provide. The extrinsic sensor data may be combined with sensor data from a processing tool of the system and/or intrinsic sensor data of the sub-fab component to form virtual sensor data. In the event the virtual data exceeds or falls below a threshold, an intervention or a maintenance signal is dispatched, and in certain embodiments, an intervention or maintenance action is taken by the system.
    Type: Application
    Filed: April 26, 2021
    Publication date: October 27, 2022
    Inventors: Ryan T. DOWNEY, Hemant P. MUNGEKAR, James L'HEUREUX, Andreas NEUBER, Michael W. JOHNSON, Joseph A. VAN GOMPEL, Gino Gerardo CRISPIERI, Tony H. TONG, Maxime CAYER, John L. KOENIG, Mike M. HUANG
  • Publication number: 20220333238
    Abstract: Embodiments described herein generally relate to methods for controlling a processing system. Particularly, subfab components of the processing system may be controlled based on the flow of materials into the processing system. In some embodiments, the flow of an inert gas used to dilute the effluent gases may be controlled in accordance with the flow of one or more precursor gases. Thus, the cost of running the processing system is reduced while mitigating critical EHS concerns.
    Type: Application
    Filed: July 1, 2022
    Publication date: October 20, 2022
    Inventor: Andreas NEUBER
  • Patent number: 11396699
    Abstract: Embodiments described herein generally relate to methods for controlling a processing system. Particularly, subfab components of the processing system may be controlled based on the flow of materials into the processing system. In some embodiments, the flow of an inert gas used to dilute the effluent gases may be controlled in accordance with the flow of one or more precursor gases. Thus, the cost of running the processing system is reduced while mitigating critical EHS concerns.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: July 26, 2022
    Assignee: Applied Materials, Inc.
    Inventor: Andreas Neuber
  • Publication number: 20190368037
    Abstract: Embodiments described herein generally relate to methods for controlling a processing system. Particularly, subfab components of the processing system may be controlled based on the flow of materials into the processing system. In some embodiments, the flow of an inert gas used to dilute the effluent gases may be controlled in accordance with the flow of one or more precursor gases. Thus, the cost of running the processing system is reduced while mitigating critical EHS concerns.
    Type: Application
    Filed: August 19, 2019
    Publication date: December 5, 2019
    Inventor: Andreas NEUBER
  • Patent number: 10460960
    Abstract: Embodiments of a system, a gas panel and method thereof having reduced exhaust requirements for the delivery of gases include distributing an inert gas in at least one interior portion of the gas panel in which a gas to be delivered by the gas panel is present. Embodiments can further include monitoring for leaks in the interior portion of the gas panel and, in response to a detected leak, increasing the distribution of the inert gas in at least the portion of the gas panel in which the leak was detected. Embodiments may further include exhausting gases out of the gas panel. In such embodiments, in response to a detected leak, a rate of the exhausting of the gases is increased. The gas panel can also be sealed to reduce an amount of gas that leaks out of or air that enters into the gas panel.
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: October 29, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Ashish Kumar, Vijayakumar Venugopal, Niladri Roy, Ramachandra Murthy Gunturi, Andreas Neuber, Stephen C. Wolgast
  • Patent number: 10428420
    Abstract: Subfab components of the processing system may be controlled based on the flow of materials into the processing system. In some embodiments, the flow of an inert gas used to dilute the effluent gases may be controlled in accordance with the flow of one or more precursor gases. Thus, the cost of running the processing system is reduced while mitigating critical EHS concerns.
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: October 1, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Andreas Neuber
  • Publication number: 20160326643
    Abstract: Embodiments described herein generally relate to methods for controlling a processing system. Particularly, subfab components of the processing system may be controlled based on the flow of materials into the processing system. In some embodiments, the flow of an inert gas used to dilute the effluent gases may be controlled in accordance with the flow of one or more precursor gases. Thus, the cost of running the processing system is reduced while mitigating critical EHS concerns.
    Type: Application
    Filed: April 26, 2016
    Publication date: November 10, 2016
    Inventor: Andreas NEUBER
  • Patent number: 9080576
    Abstract: Methods and apparatus for controlling a processing system are provided herein. In some embodiments, a method of controlling a processing system may include operating a vacuum pump coupled to a process chamber at a first baseline pump idle speed selected to maintain the process chamber at a pressure equal to a first baseline pump idle pressure; monitoring the pressure in the process chamber while operating the vacuum pump at the first baseline pump idle speed; and determining whether the first baseline pump idle pressure can be maintained in the process chamber when the vacuum pump is operating at the first baseline pump idle speed.
    Type: Grant
    Filed: January 27, 2012
    Date of Patent: July 14, 2015
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Youssef Loldj, Jay J. Jung, Mehran Moalem, Paul E. Fisher, Joshua Putz, Andreas Neuber
  • Patent number: 8874416
    Abstract: A resource usage optimization server determines a degradation caused by a first resource. The resource usage optimization server determines a cleaning caused by a second resource. The resource usage optimization server calculates a ratio of the degradation and the cleaning.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: October 28, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Krishna Vepa, Parris C. M. Hawkins, Andreas Neuber
  • Publication number: 20120143574
    Abstract: A resource usage optimization server determines a degradation caused by a first resource. The resource usage optimization server determines a cleaning caused by a second resource. The resource usage optimization server calculates a ratio of the degradation and the cleaning.
    Type: Application
    Filed: November 30, 2011
    Publication date: June 7, 2012
    Inventors: Krishna Vepa, Parris C.M. Hawkins, Andreas Neuber
  • Publication number: 20110070811
    Abstract: The present invention generally relates to apparatus and method for recycling both polishing slurry and rinse water from CMP processes. The present invention also relates to rheology measurements and agglomeration prevention using centrifugal pumps.
    Type: Application
    Filed: March 23, 2010
    Publication date: March 24, 2011
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Andreas Neuber, Phil Chandler, Clifford C. Stow, Daniel O. Clark, Michael Kiefer, Jamie Stuart Leighton
  • Publication number: 20100249968
    Abstract: A method and system for factory resource optimization identification is described herein. In one embodiment, an expected usage rate is determined for a resource in a manufacturing facility and an actual usage rate is determined for the resource in the manufacturing facility. A comparison between the expected usage rate and the actual usage rate is facilitated. A determination is made, based on the comparison, of whether a variance between the expected usage rate and the actual usage rate exceeds a threshold. A notification is provided if the variance exceeds the threshold.
    Type: Application
    Filed: March 24, 2010
    Publication date: September 30, 2010
    Inventors: Andreas Neuber, Parth Sethia, Parris C.M. Hawkins, Krishna Vepa, Raymond Murray
  • Publication number: 20100096110
    Abstract: Methods and apparatus for recovering heat from disposed effluents are disclosed herein. In some embodiments, an apparatus may include a first process chamber configured for gaseous or liquid processes; a second process chamber configured for liquid processes; and a heat pump having a compressor and a first heat exchanger, wherein the compressor is configured to use a first effluent exhausted from the first process chamber and wherein the first heat exchanger having first and second sides configured to transfer heat therebetween, wherein the first side is configured to flow a liquid reagent therethrough and into the second process chamber, and wherein the second side is configured to flow the pressurized first effluent from the first process chamber therethrough. In some embodiments, a heater may be disposed between the heat pump and the second process chamber to further heat the liquid reagent prior to entering the second process chamber.
    Type: Application
    Filed: October 15, 2009
    Publication date: April 22, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Andreas Neuber, Daniel O. Clark