Abstract: The invention relates, inter alia, to a method for producing a component of a container treatment plant. The method comprises additive manufacturing of the component using an additive manufacturing apparatus which has a manufacturing bed with a support face on which the component is additively manufactured. The method further involves forming a structuring into a contact face of the component, which contact face contacts the support face of the manufacturing bed, by means of a predetermined structuring of the support face of the additive manufacturing apparatus during the additive manufacturing of the component.

Abstract: Technologies related to production scheduling within semiconductor fabrication plant(s) are described. Processing chambers may receive requests to complete a workload over a period of time. The workload may be scheduled across the processing chambers to maximize an aggregate time that the processing chambers are in a sleep mode.

Abstract: The present disclosure generally relates to methods and system used to collect waste fluids. A system controller is disclosed to control the operation of at least a portion of the system. The controller has a CPU. The fabrication facility includes a first processing system having fluid dispensed therein for processing a material on a part. A first drain is configured to collect the processing fluid as waste fluid after processing the part. The fabrication facility also includes a waste collection system fluidly coupled to the system drain. The waste collection system has two or more valves configured to couple the system drain and two or more facility drains. Each facility drain is uniquely coupled to one of the two or more valves. The CPU is configured to operate the valves between an open and a closed state in response to the fluid entering the system drain.

Abstract: The present disclosure relates to systems and methods for detecting anomalies in a semiconductor processing system. According to certain embodiments, one or more external sensors are mounted to a sub-fab component, communicating with the processing system via a communication channel different than a communication channel utilized by the sub-fab component and providing extrinsic sensor data that the sub-fab component is not configured to provide. The extrinsic sensor data may be combined with sensor data from a processing tool of the system and/or intrinsic sensor data of the sub-fab component to form virtual sensor data. In the event the virtual data exceeds or falls below a threshold, an intervention or a maintenance signal is dispatched, and in certain embodiments, an intervention or maintenance action is taken by the system.

Abstract: The present disclosure relates to systems and methods for detecting anomalies in a semiconductor processing system. According to certain embodiments, one or more external sensors are mounted to a sub-fab component, communicating with the processing system via a communication channel different than a communication channel utilized by the sub-fab component and providing extrinsic sensor data that the sub-fab component is not configured to provide. The extrinsic sensor data may be combined with sensor data from a processing tool of the system and/or intrinsic sensor data of the sub-fab component to form virtual sensor data. In the event the virtual data exceeds or falls below a threshold, an intervention or a maintenance signal is dispatched, and in certain embodiments, an intervention or maintenance action is taken by the system.

Abstract: Embodiments described herein generally relate to methods for controlling a processing system. Particularly, subfab components of the processing system may be controlled based on the flow of materials into the processing system. In some embodiments, the flow of an inert gas used to dilute the effluent gases may be controlled in accordance with the flow of one or more precursor gases. Thus, the cost of running the processing system is reduced while mitigating critical EHS concerns.

Abstract: The present disclosure generally relates to methods and system used to collect waste fluids. A system controller is disclosed to control the operation of at least a portion of the system. The controller has a CPU. The fabrication facility includes a first processing system having fluid dispensed therein for processing a material on a part. A first drain is configured to collect the processing fluid as waste fluid after processing the part. The fabrication facility also includes a waste collection system fluidly coupled to the system drain. The waste collection system has two or more valves configured to couple the system drain and two or more facility drains. Each facility drain is uniquely coupled to one of the two or more valves. The CPU is configured to operate the valves between an open and a closed state in response to the fluid entering the system drain.

Abstract: The invention relates to a wear part (10E). The wear part (10E) has a part interior (14) and a wear layer (12E). The wear layer (12E) is produced by additive manufacturing, covers the part interior (14) and has a wear indicator (18E) which is produced by additive manufacturing and is designed to indicate a state of wear of the wear part (10E) if the wear indicator (18E) is exposed and/or removed due to wear. Advantageously, the wear part (10E) can allow a simple wear monitoring by monitoring the wear indicator (18E).

Abstract: The present disclosure relates to systems and methods for detecting anomalies in a semiconductor processing system. According to certain embodiments, one or more external sensors are mounted to a sub-fab component, communicating with the processing system via a communication channel different than a communication channel utilized by the sub-fab component and providing extrinsic sensor data that the sub-fab component is not configured to provide. The extrinsic sensor data may be combined with sensor data from a processing tool of the system and/or intrinsic sensor data of the sub-fab component to form virtual sensor data. In the event the virtual data exceeds or falls below a threshold, an intervention or a maintenance signal is dispatched, and in certain embodiments, an intervention or maintenance action is taken by the system.

Abstract: Embodiments described herein generally relate to methods for controlling a processing system. Particularly, subfab components of the processing system may be controlled based on the flow of materials into the processing system. In some embodiments, the flow of an inert gas used to dilute the effluent gases may be controlled in accordance with the flow of one or more precursor gases. Thus, the cost of running the processing system is reduced while mitigating critical EHS concerns.

Abstract: Embodiments described herein generally relate to methods for controlling a processing system. Particularly, subfab components of the processing system may be controlled based on the flow of materials into the processing system. In some embodiments, the flow of an inert gas used to dilute the effluent gases may be controlled in accordance with the flow of one or more precursor gases. Thus, the cost of running the processing system is reduced while mitigating critical EHS concerns.

Abstract: Embodiments described herein generally relate to methods for controlling a processing system. Particularly, subfab components of the processing system may be controlled based on the flow of materials into the processing system. In some embodiments, the flow of an inert gas used to dilute the effluent gases may be controlled in accordance with the flow of one or more precursor gases. Thus, the cost of running the processing system is reduced while mitigating critical EHS concerns.

Abstract: Embodiments of a system, a gas panel and method thereof having reduced exhaust requirements for the delivery of gases include distributing an inert gas in at least one interior portion of the gas panel in which a gas to be delivered by the gas panel is present. Embodiments can further include monitoring for leaks in the interior portion of the gas panel and, in response to a detected leak, increasing the distribution of the inert gas in at least the portion of the gas panel in which the leak was detected. Embodiments may further include exhausting gases out of the gas panel. In such embodiments, in response to a detected leak, a rate of the exhausting of the gases is increased. The gas panel can also be sealed to reduce an amount of gas that leaks out of or air that enters into the gas panel.

Abstract: Subfab components of the processing system may be controlled based on the flow of materials into the processing system. In some embodiments, the flow of an inert gas used to dilute the effluent gases may be controlled in accordance with the flow of one or more precursor gases. Thus, the cost of running the processing system is reduced while mitigating critical EHS concerns.

Abstract: Embodiments of a system, a gas panel and method thereof having reduced exhaust requirements for the delivery of gases include distributing an inert gas in at least one interior portion of the gas panel in which a gas to be delivered by the gas panel is present. Embodiments can further include monitoring for leaks in the interior portion of the gas panel and, in response to a detected leak, increasing the distribution of the inert gas in at least the portion of the gas panel in which the leak was detected. Embodiments may further include exhausting gases out of the gas panel. In such embodiments, in response to a detected leak, a rate of the exhausting of the gases is increased. The gas panel can also be sealed to reduce an amount of gas that leaks out of or air that enters into the gas panel.

Abstract: Embodiments described herein generally relate to methods for controlling a processing system. Particularly, subfab components of the processing system may be controlled based on the flow of materials into the processing system. In some embodiments, the flow of an inert gas used to dilute the effluent gases may be controlled in accordance with the flow of one or more precursor gases. Thus, the cost of running the processing system is reduced while mitigating critical EHS concerns.

Abstract: Methods and apparatus for controlling a processing system are provided herein. In some embodiments, a method of controlling a processing system may include operating a vacuum pump coupled to a process chamber at a first baseline pump idle speed selected to maintain the process chamber at a pressure equal to a first baseline pump idle pressure; monitoring the pressure in the process chamber while operating the vacuum pump at the first baseline pump idle speed; and determining whether the first baseline pump idle pressure can be maintained in the process chamber when the vacuum pump is operating at the first baseline pump idle speed.

Abstract: A resource usage optimization server determines a degradation caused by a first resource. The resource usage optimization server determines a cleaning caused by a second resource. The resource usage optimization server calculates a ratio of the degradation and the cleaning.

Abstract: Methods and apparatus for controlling a processing system are provided herein. In some embodiments, a method of controlling a processing system may include operating a vacuum pump coupled to a process chamber at a first baseline pump idle speed selected to maintain the process chamber at a pressure equal to a first baseline pump idle pressure; monitoring the pressure in the process chamber while operating the vacuum pump at the first baseline pump idle speed; and determining whether the first baseline pump idle pressure can be maintained in the process chamber when the vacuum pump is operating at the first baseline pump idle speed.

Abstract: A resource usage optimization server determines a degradation caused by a first resource. The resource usage optimization server determines a cleaning caused by a second resource. The resource usage optimization server calculates a ratio of the degradation and the cleaning.