Abstract: A method for producing a rubber-plastic composite, including the steps of (a) shaping an unvulcanized elastomer, (b) partially vulcanizing the shaped elastomer at a temperature of at least 140° C. up to a degree of vulcanization in the range from 10% to 40%, (c) cooling the partially vulcanized elastomer to a temperature of less than 100° C. within less than 20 minutes, (d) overmolding the partially vulcanized elastomer with a plastic, and (e) heat treating the partially vulcanized elastomer overmolded with a plastic at a temperature in the range from 100° C. to 170° C. for a duration of from 5 minutes to 5 hours to complete the vulcanization and form a rubber-plastic composite. The method further relates to a rubber-plastic composite obtainable by the method according to the invention and also to a shoe comprising the rubber-plastic composite obtainable by the method according to the invention.

Abstract: The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.

Abstract: The present invention relates to a thermoplastic composition that provides improved thermal aging stability. The thermoplastic composition includes a polyamide resin, glass fibers, tin(II) oxalate, and a functional additive. It has been found that a combination of a polyamide resin with tin(II) oxalate and a functional additive produces a superior product demonstrating greater thermal stability than the polyamide resin alone.

Abstract: A multilayered laminate film containing dispersed pigment which is suitable as a back cover for a solar module is provided. The film comprises, in the order listed: a) a layer of a moulding composition which comprises: at least 35% by weight, of polyamide; and from 1 to 65% by weight of a light-reflecting filler; b) optionally, a layer of a thermoplastic moulding composition; and c) a layer of a moulding composition which comprises at least 35% by weight, of polyamide; and from 1 to 65% by weight of a light-reflecting filler; wherein at least one of layers a) and c) further comprises from 1 to 25% by weight of the layer composition of a polyamide elastomer which is a polyetheresteramide, a polyetheramide or a combination thereof. A solar module containing the multilayered laminate film is also provided.

Abstract: A multilayer film containing layers of polyamide and polyester, suitable as a back cover for a photovoltaic module is provided. The film comprises, in the order listed: a) a layer which comprises at least 35% by weight of polyamide; c) a layer which comprises at least 35% by weight, of a thermoplastic polyester; and e) a layer which comprises at least 35% by weight of polyamide; wherein the layers a) and e) further comprise 0.1 to 60% by weight, of a polyamine-polyamide graft copolymer, or the layer c) further comprises 0.1 to 30% by weight of polyamine-polyamide graft copolymer. The polyamine-polyamide graft copolymer comprises as copolymerized monomers: a polyamine having at least 4 nitrogen atoms and at least one polyamide-forming unit selected from the group consisting of a lactam, an ?-aminocarboxylic acid and an equimolar combinations of a diamine and a dicarboxylic acid. In another embodiment, adhesion promoting layers are placed between the layers.

Abstract: The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.

Abstract: Polymers can be prepared from monomers comprising laurolactam, by a process including a. Beckmann rearrangement of cyclododecanone oxime to give laurolactam in the presence of a Beckmann rearrangement catalyst, b. removal of impurities from the laurolactam to obtain purified laurolactam, and c. polymerization of monomers comprising purified laurolactam. For avoidance of discolouration or yellowing under ageing conditions, prior to the polymerization, polycyclic substances containing 24 carbon atoms and at least one heteroatom selected from oxygen and nitrogen and having a molar mass between 300 and 380 g/mol are limited to 500 ppm, based on laurolactam.

Abstract: The present invention relates to a thermoplastic composition that provides improved thermal aging stability. The thermoplastic composition includes a polyamide resin, glass fibers, tin(II) oxalate, and a functional additive. It has been found that a combination of a polyamide resin with tin(II) oxalate and a functional additive produces a superior product demonstrating greater thermal stability than the polyamide resin alone.

Abstract: The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.

Abstract: A metallic pipe for contact with a hydrolyzing medium provides longer operating times and improved high temperature resistance. The pipe contains a layer of a polyamide moulding composition containing at least 50% by weight of polyamide content containing: I) 60 to 98 parts by weight of a polyamide which contains 10 to 70 meq/kg of a terminal carboxy group and has a relative solution viscosity ?rel of at least 1.90, and II) 2 to 40 parts by weight of a polyamine-polyamide graft copolymer produced from: a) 0.5 to 25% by weight, based on the entire monomer mixture, of a polyamine having at least 4 nitrogen atoms, and b) 75 to 99.5% by weight, based on the entire monomer mixture, of polyamide-forming monomers selected from lactams, ?-aminocarboxylic acids and/or equimolar combinations of diamine and dicarboxylic acid, with the proviso that the amino group concentration of the graft copolymer is in the range from 100 to 2500 meq/kg, wherein the sum of the parts by weight of I) and II) is 100.

Abstract: A metallic pipe for contact with a hydrolyzing medium provides longer operating times and improved high temperature resistance. The pipe contains a layer of a polyamide moulding composition containing at least 50% by weight of polyamide content containing: I) 60 to 98 parts by weight of a polyamide which contains 10 to 70 meq/kg of a terminal carboxy group and has a relative solution viscosity ?rel of at least 1.90, and II) 2 to 40 parts by weight of a polyamine-polyamide graft copolymer produced from: a) 0.5 to 25% by weight, based on the entire monomer mixture, of a polyamine having at least 4 nitrogen atoms, and b) 75 to 99.5% by weight, based on the entire monomer mixture, of polyamide-forming monomers selected from lactams, ?-aminocarboxylic acids and/or equimolar combinations of diamine and dicarboxylic acid, with the proviso that the amino group concentration of the graft copolymer is in the range from 100 to 2500 meq/kg, wherein the sum of the parts by weight of I) and II) is 100.

Abstract: Multilayer films of polyamide and polypropylene which have good layer adhesion and are suitable for a back cover of a solar module are provided. In a first embodiment, the multilayer film contains in the order listed: a) a layer containing at least 35% by weight, of polyamide; c) a layer containing at least 35% by weight of a polypropylene; and e) a layer containing at least 35% by weight, of polyamide; wherein the layer c) further comprises a polypropylene having acid anhydride groups or a polypropylene compatible functionalized polyolefin having functional groups to adhere the layer c) to each of layers a) and e). In a second embodiment adhesion promoter layers are present between the respective polyamide and polypropylene layers.

Abstract: The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.

Abstract: A description is given of the use of reactive hotmelt adhesives based on copolyamide and further comprising isocyanate and epoxide and also a functionalized polyolefin in hybrid components. These hybrid components find applications in vehicle construction and in aircraft construction, for example.

Abstract: A molding compound, containing at least 30% by weight of a copolyamide, which is derived from the following monomers: a) 50 to 95 mole percent of the combination of a diamine, selected from the group consisting of 1,9-nonane diamine, 1,10-decane diamine, 1,11-undecane diamine and 1,12-dodecane diamine, and terephthalic acid, and b) 5 to 50 mole percent of the combination of a diamine, selected from the group consisting of 2,2,4-trimethylhexamethylene diamine, 2,4,4-trimethylhexamethylene diamine, and mixtures thereof, and terephthalic acid. The copolyamide is crystalline and has low water absorption.

Abstract: In a composite component assembled from at least one component piece comprising a polyamide molding composition with at least one component piece comprising a vulcanized elastomer, the polyamide molding composition comprises at least 40% by weight of a mixture of the following constituents: a) 60 to 99 parts by weight of polyamide and b) 1 to 40 parts by weight of a graft copolymer obtainable using the following monomers: a) 0.5% to 25% by weight, based on the graft copolymer, of a polyamine having at least 4 nitrogen atoms and also ?) 75% to 99.5% by weight, based on the graft copolymer, of polyamide-forming monomers selected from lactams, ?-amino carboxylic acids and/or equimolar combinations of diamine and dicarboxylic acid, wherein the parts by weight of a) and b) sum to 100. The presence of the graft copolymer effectuates improved adherence between the component pieces.

Abstract: A process for producing hydrolysis-resistant mouldings with geometries having large dimensions by cumulative condensation of a polyamide moulding composition, is provided. The process includes mixing a polyamide moulding composition of a polyamide having at least 50% of amino end groups with 0.1 to 5% by weight, based on the polyamide moulding composition, of an oligo- or polycarbodiimide. The mixture is subsequently processed to give the moulding, wherein cumulative condensation is obtained during the processing of the moulding.

Abstract: A multilayer film suitable as a backing for a photovoltaic module is provided. The film comprises, in the order listed: a) a layer of a moulding composition which comprises at least 35% by weight, based on the overall layer moulding composition, of polyamide; b) a layer of a moulding composition which comprises at least 50% by weight, based on the overall layer moulding composition, of a polymer fraction consisting of: I) 30 to 95 parts by weight of polyamide and II) 5 to 70 parts by weight of polyolefin, where a sum of I) and II) in parts by weight is 100; and c) a layer of a moulding composition which comprises at least 35% by weight, based on the overall moulding composition, of polyamide; wherein at least one of layers a), b) and c) further comprises a polyamide elastomer which is a polyetheresteramide, a polyetheramide or a combination thereof.

Abstract: A multilayer film containing layers of polyamide and polyester, suitable as a back cover for a photovoltaic module is provided. The film comprises, in the order listed: a) a layer which comprises at least 35% by weight of polyamide; c) a layer which comprises at least 35% by weight, of a thermoplastic polyester; and e) a layer which comprises at least 35% by weightof polyamide; wherein the layers a) and e) further comprise 0.1 to 60% by weight, of a polyamine-polyamide graft copolymer, or the layer c) further comprises 0.1 to 30% by weight of polyamine-polyamide graft copolymer. The polyamine-polyamide graft copolymer comprises as copolymerized monomers: a polyamine having at least 4 nitrogen atoms and at least one polyamide-forming unit selected from the group consisting of a lactam, an ?-aminocarboxylic acid and an equimolar combinations of a diamine and a dicarboxylic acid. In another embodiment, adhesion promoting layers are placed between the layers.

Abstract: A multilayered film and a photovoltaic module where the oxidation-sensitive solar cell is protected against ingress of oxygen provided. The solar cell is protected by the multilayer film as a back cover. The multilayer film comprises the following layers in direct succession: a solar cell-facing layer of a moulding composition comprising at least 70% by weight of EVOH, an adhesion promoter layer, a middle layer of a thermoplastic moulding composition, an optional adhesion promoter layer, and an outer layer comprising at least 35% by weight of polyamide.