Abstract: An apparatus is provided to cool high-performance instruments within a semiconductor test head using direct facility water. The direct facility water cooling apparatus consists of an air chamber, a first base to receive and removably mount the instrument within the air chamber, a test head inlet in fluid communication with the first base and a facility water supply, a test head discharge in fluid communication with the first base and a facility drain, and a fan in fluid communication with the air chamber inlet to induce the flow of air from the air chamber inlet to the air chamber outlet.

Abstract: An electronic system is disclosed that uses air for cooling first and second orthogonally oriented arrays of parallel circuit boards. Air is drawn into the front of the system, passes alongside the circuit boards in the first array, takes a 90-degree turn, continues over the circuit boards in the second array, and takes another 90-degree turn to exhaust through the rear of the system. The circuit boards in the first array are cooled through a separate airflow path, which preferably also runs front-to-rear.

Abstract: An electronic assembly for housing circuit cards of different types, which communicate with one another at high speed. Circuit cards of a first type plug into a backplane side-by-side. Circuit cards of a second type are arranged perpendicularly to the circuit cards of the first type. The arrangement allows cards of the first type to communicate with cards of the second type over short distances, thus improving system throughput. It also allows cards of different types to be cooled differently, thus promoting efficient cooling.

Abstract: An electronic system includes an array of electronic assemblies at a first location within a system. An array of liquid cooling assemblies is placed at a second location within the system. Hoses or other liquid transport pathways connect the cooling assemblies to the electronic assemblies, for cooling the electronic assemblies. As more electronic assemblies are added to the system, additional cooling assemblies may be provided to manage the increased thermal demands.

Abstract: A two-phase cooling system operated at atmospheric pressure. A reservoir containing cooling fluid has a stack that is vented to the atmosphere. The stack is shaped to allow condensation of substantially all of the cooling fluid in vapor form entering the stack. Condensation may be enhanced by cooling the stack, such as with flowing air along the outer walls of the stack or placing a thermoelectric device in contact with the stack. The system provides high thermal capacity but is easy to use and service.

Abstract: A chiller assembly shaped for use in a standard electronics rack. The chiller has a low profile, and is capable of being made to occupy less than 5 rack units. The chiller is modular, with subassemblies positioned to allow easy removal for maintenance. The fan and power supply are made as replaceable subassemblies that can be inserted or removed from the front of the unit without any special tools. The pump is made with a magnetically coupled motor, allowing the motor to be easily removed for service or replacement. The motor is also accessible from the front panel of the assembly.

Abstract: A two-phase cooling apparatus for cooling an electronic assembly is disclosed. The apparatus comprises an evaporator having a single-phase inlet for receiving a single-phase liquid coolant and a two-phase outlet for discharging a two-phase coolant. A local condenser is disposed proximate the evaporator and has a two-phase inlet coupled to the evaporator outlet. The local condenser includes a single-phase liquid coolant outlet. The apparatus further includes a pump having an output coupled to the evaporator inlet, and an input coupled to the local condenser outlet.