Patents by Inventor Andreas Pflug

Andreas Pflug has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210164092
    Abstract: The invention relates to a device and a method for producing layers with very good uniformity in coating systems with horizontally rotating substrate guiding. Alternatively, certain layer thickness gradients can be set. The particle loading is also significantly reduced. The service life is much higher compared to other methods. Parasitic coatings are reduced. The coating rate is also increased.
    Type: Application
    Filed: August 9, 2019
    Publication date: June 3, 2021
    Applicant: FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E. V.
    Inventors: Michael VERGÖHL, Andreas PFLUG, Stefan BRUNS, Tobias ZICKENROTT
  • Publication number: 20120097529
    Abstract: The invention relates to a new basic technology for magnetron sputtering of ceramic layers, in particular for optical applications. The new concept enables the construction of magnetron sputtering sources which, in comparison with the known methods, such as reactive DC-, MF- or RF magnetron sputtering or the magnetron sputtering of ceramic targets, enables significantly improved precision in the deposition of ceramic layers at an exactly defined rate and homogeneity and also with very good reproducibility.
    Type: Application
    Filed: March 25, 2010
    Publication date: April 26, 2012
    Applicant: Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.
    Inventors: Andreas Pflug, Michael Siemers, Volker Sittinger, Bernd Szyszka, Stephan Ulrich
  • Publication number: 20120097641
    Abstract: Method and device for the plasma treatment of a substrate in a plasma device, wherein—the substrate (110) is arranged between an electrode (112) and a counter-electrode (108) having a distance d between a surface area of the substrate to be treated and the electrode, —a capacitively coupled plasma discharge is excited, forming a DC self-bias between the electrode (112) and the counter-electrode (108), —in an area of the plasma discharge between the surface area to be treated and the electrode having a quasineutral plasma bulk (114), a quantity of at least one activatable gas species, to which a surface area of the substrate to be treated is subjected, is present —it is provided that a plasma discharge is excited, —wherein the distance d has a value comparable to s=se+sg, where se denotes a thickness of a plasma boundary layer (119) in front of the electrode, and sg denotes a thickness of a plasma boundary layer (118) in front of the substrate surface to be treated or —wherein the quasineutral plasma bulk (114
    Type: Application
    Filed: November 4, 2009
    Publication date: April 26, 2012
    Applicants: FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGWANDTEN FORSCHUNG E.V., RUHR-UNIVERSITAT BOCHUM, LEYBOLD OPTICS GMBH
    Inventors: Rudolf Beckmann, Michael Geisler, Arndt Zeuner, Marks Fiedler, Gunter Grabosch, Andreas Pflug, Uwe Czarnetzki, Ralf-Peter Brinkmann, Michael Siemers
  • Patent number: 7763150
    Abstract: A method and device for magnetron sputtering are provided. A magnetron coating system includes a first coating source and an auxiliary substrate arranged between the first coating source and an area into which a substrate to be coated is to be received. The system also includes a magnetron having a cathode composed of the auxiliary substrate. Additionally, the system includes a device structured and arranged to determine an area density of the auxiliary substrate.
    Type: Grant
    Filed: November 29, 2004
    Date of Patent: July 27, 2010
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Bernd Szyszka, Andreas Pflug
  • Publication number: 20070158177
    Abstract: The invention relates to a magnetron coating system, comprising a first coating source, an auxiliary substrate, a magnetron and means for determining the area density of the auxiliary substrate. The auxiliary substrate is thereby arranged between the first coating source and the area that is provided to receive the substrate to be coated, and forms a cathode for the magnetron. The invention further relates to a method for depositing thin layers, in which a layer is deposited on an auxiliary substrate by means of a first coating source and this auxiliary substrate is used as a cathode for coating a substrate by means of a magnetron and the area density of the auxiliary substrate is determined.
    Type: Application
    Filed: November 29, 2004
    Publication date: July 12, 2007
    Inventors: Bernd Szyszka, Andreas Pflug
  • Publication number: 20050236276
    Abstract: A method for coating substrates in inline installations, in which a substrate is moved through at least one coating chamber and during this movement is coated. In this method, first, a model of the coating chamber is formed which takes into consideration the changes of the chamber parameters caused by the movement of the substrate through the coating chamber. Subsequently, the particular position of the substrate within the coating chamber is acquired. The chamber parameters are subsequently set based on the position of the substrate according to the model of the coating chambers.
    Type: Application
    Filed: November 24, 2004
    Publication date: October 27, 2005
    Inventors: Albert Kastner, Michael Geisler, Thomas Leipnitz, Jurgen Bruch, Andreas Pflug, Bernd Szyszka
  • Publication number: 20050145487
    Abstract: The invention relates to a coating installation comprising a recipient (1) which is divided into a cathode side (3) and a substrate side (4) by means of a screen (2). The cathode side (3) and the substrate side (4) respectively have a direct extraction outlet (10, 16) and a gas admission (8, 14). The gas admission (8) on the cathode side (3) is connected to a process gas source (9) and the gas admission (14) for the substrate side (4) is connected to a reactive gas source (15).
    Type: Application
    Filed: April 11, 2003
    Publication date: July 7, 2005
    Inventors: Michael Geisler, Albert Kastner, Bernd Szyszka, Andreas Pflug, Niels Malkomes