Patents by Inventor Andreas Plach
Andreas Plach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11935337Abstract: A filter element analysis system for analyzing a filter element within a vehicle, the system including various filter sensors so as to provide information regarding various filter element parameters, a locator which configured provide vehicle position information such that conditions regarding the vehicle environment can be tracked and correlated to the location, as well as a means for transmitting information to a remote server for analysis and tracking of the filter element information with regard to environmental conditions such that a filter element status, remaining filter life, or particle load and replacement timeline can be calculated and updated so as to provide more accurate predictive models of the filter element conditions. As well as provide alerts regarding the need and scheduling of replacement or cleaning of a particular filter element.Type: GrantFiled: June 23, 2022Date of Patent: March 19, 2024Assignee: MANN+HUMMEL GmbHInventors: Brandon Hukill, Jon Nichols, Charles Vaillant, Yew Chong, Arpan Penkar, Matthew Nunn, Andreas Scope, Kevin Babb, Karlheinz Muenkel, Markus Beylich, Nicolas Payen, Stefan Kunze, Uwe Plach, Lars-Thorsten Porschke, Stephan Braun
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Patent number: 11536594Abstract: A sensor component for a transmission of a motor vehicle is provided. The sensor component includes a printed circuit board having a first printed circuit board region and a second printed circuit board region. The first printed circuit board region is delimited from the second printed circuit board region by a milled groove and is angled with respect to the second printed circuit board region along the milled groove. A sensor, such as a magnetoresistive sensor or a Hall sensor, is arranged in or on the first printed circuit board region. A pre-assembly arrangement and a method for producing such a sensor component are also provided.Type: GrantFiled: February 21, 2020Date of Patent: December 27, 2022Assignee: Vitesco Technologies Germany GmbHInventors: Jürgen Rietsch, Andreas Plach, Stephan Bandermann, Thomas Schmidt, Andreas Albert, Klaus Scharrer, Bernd Seitz, Jens mEnke
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Patent number: 11092514Abstract: A sensor dome arrangement has a sensor dome and a housing wall, which is particularly a transmission wall. The sensor dome includes a sensor, dome contacts which are electrically connected to the sensor, and a dome housing. The dome housing has a first dome housing section in which the sensor is arranged, and a second dome housing section on or in which the dome contacts are arranged. A through-opening is made in the housing wall, and the sensor dome is attached to the housing wall such that at least one outer surface of the first dome housing section faces a first chamber which is adjacent to the sensor dome and an inner side of the housing wall, and such that the dome contacts face a second chamber which is adjacent to the sensor dome and an outer side of the housing wall.Type: GrantFiled: September 9, 2016Date of Patent: August 17, 2021Assignee: Conti Temic microelectronic GmbHInventors: Andreas Albert, Joachim Buhl, Turhan Bueyuekbas, Andreas Plach, Matthias Wieczorek
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Patent number: 10893615Abstract: A printed circuit board composite and a method for producing same. In the method for producing the printed circuit board composite, a first printed circuit board, in particular a sensor carrier printed circuit board, is connected in a form-fitting manner to a second printed circuit board, in particular a supporting printed circuit board. There is also described a printed circuit board composite.Type: GrantFiled: December 8, 2017Date of Patent: January 12, 2021Assignee: CPT Zwei GmbHInventors: Juergen Rietsch, Andreas Plach, Andreas Albert, Mathias Strecker, Hassene Bel Haj Said, Johannes Bock, Thengis Greifenstein
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Patent number: 10785883Abstract: An electronic configuration, which is preferably a gearbox control device, has a control circuit and a sensor dome. The sensor dome has a sensor and dome contacts electrically connected to the sensor. The control circuit has circuit contacts for contacting the dome contacts. The dome contacts and the circuit contacts are configured to achieve a respective plug connection between a respective dome contact and a respective circuit contact.Type: GrantFiled: September 9, 2016Date of Patent: September 22, 2020Assignee: Conti Temic microelectronic GmbHInventors: Andreas Albert, Joachim Buhl, Turhan Bueyuekbas, Andreas Plach, Matthias Wieczorek
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Publication number: 20200191619Abstract: A sensor component for a transmission of a motor vehicle is provided. The sensor component includes a printed circuit board having a first printed circuit board region and a second printed circuit board region. The first printed circuit board region is delimited from the second printed circuit board region by a milled groove and is angled with respect to the second printed circuit board region along the milled groove. A sensor, such as a magnetoresistive sensor or a Hall sensor, is arranged in or on the first printed circuit board region. A pre-assembly arrangement and a method for producing such a sensor component are also provided.Type: ApplicationFiled: February 21, 2020Publication date: June 18, 2020Applicant: Vitesco Technologies Germany GMBHInventors: Jürgen Rietsch, Andreas Plach, Stephan Bandermann, Thomas Schmidt, Andreas Albert, Klaus Scharrer, Bernd Seitz, Jens mENKE
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Publication number: 20200077525Abstract: A printed circuit board composite and a method for producing same. In the method for producing the printed circuit board composite, a first printed circuit board, in particular a sensor carrier printed circuit board, is connected in a form-fitting manner to a second printed circuit board, in particular a supporting printed circuit board. There is also described a printed circuit board composite.Type: ApplicationFiled: December 8, 2017Publication date: March 5, 2020Inventors: JUERGEN RIETSCH, ANDREAS PLACH, ANDREAS ALBERT, MATHIAS STRECKER, HASSENE BEL HAJ SAID, JOHANNES BOCK, THENGIS GREIFENSTEIN
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Patent number: 10349540Abstract: The disclosure relates to a mechatronic assembly. The assembly includes a supporting circuit board with at least one populated flat side. A multiplicity of electronic components are arranged on the at least one populated flat side. In addition, at least one mechanical insert part for the mechanical fixing of at least one electronic component is also arranged on the at least one populated flat side. An encapsulation of one-piece design is provided which, in form-fitting and cohesive fashion, surrounds all of the components arranged on the at least one populated flat side of the supporting circuit board. The disclosure also relates to a method for producing the mechatronic assembly.Type: GrantFiled: August 10, 2017Date of Patent: July 9, 2019Assignee: CPT Zwei GmbHInventors: Andreas Albert, Andreas Plach, Thomas Schmidt, Bernhard Schuch, Martin Steinau, Matthias Wieczorek, Mathias Strecker
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Publication number: 20180299348Abstract: A sensor dome arrangement has a sensor dome and a housing wall, which is particularly a transmission wall. The sensor dome includes a sensor, dome contacts which are electrically connected to the sensor, and a dome housing. The dome housing has a first dome housing section in which the sensor is arranged, and a second dome housing section on or in which the dome contacts are arranged. A through-opening is made in the housing wall, and the sensor dome is attached to the housing wall such that at least one outer surface of the first dome housing section faces a first chamber which is adjacent to the sensor dome and an inner side of the housing wall, and such that the dome contacts face a second chamber which is adjacent to the sensor dome and an outer side of the housing wall.Type: ApplicationFiled: September 9, 2016Publication date: October 18, 2018Inventors: ANDREAS ALBERT, JOACHIM BUHL, TURHAN BUEYUEKBAS, ANDREAS PLACH, MATTHIAS WIECZOREK
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Publication number: 20180302998Abstract: An electronic configuration, which is preferably a gearbox control device, has a control circuit and a sensor dome. The sensor dome has a sensor and dome contacts electrically connected to the sensor. The control circuit has circuit contacts for contacting the dome contacts. The dome contacts and the circuit contacts are configured to achieve a respective plug connection between a respective dome contact and a respective circuit contact.Type: ApplicationFiled: September 9, 2016Publication date: October 18, 2018Inventors: ANDREAS ALBERT, JOACHIM BUHL, TURHAN BUEYUEKBAS, ANDREAS PLACH, MATTHIAS WIECZOREK
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Publication number: 20170367200Abstract: The disclosure relates to a mechatronic assembly. The assembly includes a supporting circuit board with at least one populated flat side . A multiplicity of electronic components are arranged on the at least one populated flat side. In addition, at least one mechanical insert part for the mechanical fixing of at least one electronic component is also arranged on the at least one populated flat side. An encapsulation of one-piece design is provided which, in form-fitting and cohesive fashion, surrounds all of the components arranged on the at least one populated flat side of the supporting circuit board. The disclosure also relates to a method for producing the mechatronic assembly.Type: ApplicationFiled: August 10, 2017Publication date: December 21, 2017Applicant: Conti Temic microelectronic GmbHInventors: Andreas Albert, Andreas Plach, Thomas Schmidt, Bernhard Schuch, Martin Steinau, Matthias Wieczorek, Mathias Strecker
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Publication number: 20170354036Abstract: The disclosure provides an electronic assembly that includes: a carrier element, a circuit carrier having a number of electronic components, a circuit board, which is electrically conductively connected to the circuit carrier, and a covering element for covering the circuit carrier. The covering element is arranged on one flat side of the circuit board and the carrier element is arranged on an opposite flat side of the circuit board. The circuit board is welded respectively to the carrier element and to the covering element. The disclosure further relates to a method for producing such an electronic assembly.Type: ApplicationFiled: August 10, 2017Publication date: December 7, 2017Applicant: Conti Temic microelectronic GmbHInventors: Andreas Albert, Mathias Strecker, Andreas Plach, Matthias Wieczorek