Abstract: Method of producing electrical units consisting of chips with contact elements, wherein the contact elements are suited for the direct connection with contact terminals of external electric components in an electrically conductive manner, wherein the connection of the contact elements with the chips is effected before the individual chips are removed from the grouping predefined by the wafer and consisting of rows and columns, and the contact elements are made of a metallized plastic foil or metallic foil to be applied onto the chips.

Abstract: System for the vehicle-assisted storing and removal of goods in a warehouse with automatic position determination of at least the stored goods, comprising a plurality of transponder devices that are placed in the floor of the warehouse in a distributed manner. Each transponder device stores information that represents, at least indirectly, the position of the corresponding transponder devices inside the warehouse. The inventive system also comprises a vehicle for transporting goods to be stored and removed, a reading device, which is mounted on the vehicle while automatically reading out information from transponders driven over by the vehicle, and a computer device, which receives the information read out from the transponders by the reading device, and which from this information, determines and stores at least the position at which the goods are stored inside the warehouse.

Abstract: A unit for shielding a transponder includes at least a chip and an antenna structure with application-specific spatial dimensions and which is secured to an electrically conductive surface. The unit includes a film having formed thereon or therein a highly permeable material at least in an area having the spatial dimensions of the antenna structure of the transponder. The highly permeable material is subdivided into elongate shielding elements and free spaces arranged between the respective shielding elements such that when the substrate has been attached to the transponder, the shielding elements will be oriented parallel to a magnetic field induced in the antenna structure of the transponder, so as to suppress eddy currents which are generated by the electrically conductive surface in the antenna structure, when the transponder is being introduced in a magnetic field of a respective reading device.

Abstract: A transponder comprising a chip having contact pads and at least two coupling elements, which are conductively connected with the contact pads, wherein the coupling elements are touch-free relative to each other and formed in a self-supported as well as free-standing way and are essentially extended parallel to the chip plane, the total mounting height of the transponder corresponds essentially to the mounting height of the chip, and the coupling elements are in geometry and size adapted for acting as a dipole antenna or in conjunction with an evaluation unit as a plate capacitor.

Abstract: A unit for shielding a transponder includes at least a chip and an antenna structure with application-specific spatial dimensions and which is secured to an electrically conductive surface. The unit includes a film having formed thereon or therein a highly permeable material at least in an area having the spatial dimensions of the antenna structure of the transponder. The highly permeable material is subdivided into elongate shielding elements and free spaces arranged between the respective shielding elements such that when the substrate has been attached to the transponder, the shielding elements will be oriented parallel to a magnetic field induced in the antenna structure of the transponder, so as to suppress eddy currents which are generated by the electrically conductive surface in the antenna structure, when the transponder is being introduced in a magnetic field of a respective reading device.

Abstract: Method for manufacturing a carrier tape with a plurality of electrical units, whereby the carrier tape is intended for the manufacture of transponders and the method comprises the following steps: provision of a plurality of prefabricated chips with at least one connection surface; provision of a carrier tape for accommodating the chips; feeding of the carrier tape to a chip placement device, placing of at least one chip on the carrier tape, provision of a metallized plastic foil or metallic foil for forming at least one contact element; feeding of the metallized plastic foil or metallic foil to the carrier tape, joining of the metallized plastic foil or metallic foil to at least one connection surface of at least one chip for producing an electrical unit from the chip and contact element.

Abstract: In a method for handling in parallel a plurality of circuit chips, which are arranged in a first arrangement, which corresponds to their arrangement in the original wafer, on the surface of an auxiliary carrier, the plurality of circuit chips is picked up by a plurality of pick up devices. The plurality of pick up devices with the picked up circuit chips is moved simultaneously to one or several carriers, in such a way that, simultaneously with the motion, the first arrangement of the circuit chips is changed into a second arrangement, which is different from the first arrangement. Then the circuit chips are simultaneously placed in the second arrangement on the one or several carriers.

Abstract: The present invention relates to a method of producing very thin substrate layers, particularly thin semiconductor areas, which may comprise integrated circuits. In the method two substrates (1, 2) are bonded by their faces via one or several intermediate connecting layers (3, 4). At least one of the bonding layers or the face of one of the substrates is structured before in such a way that channel-shaped recesses (5) are formed which permit a lateral penetration of an etching agent. The resulting wafer stack is thinned from one side down to the desired thickness of the layer. Finally, this thin layer is detached from the remaining substrate by introduction of the etching agent into the channel-shaped recesses. This detaching process is a low-price wet chemical process that does not expose the chip and the added value integrated thereon to any risk.

Abstract: A transponder comprising a chip having contact pads and at least two coupling elements, which are conductively connected with the contact pads, wherein the coupling elements are touch-free relative to each other and formed in a self-supported as well as free-standing way and are essentially extended parallel to the chip plane, the total mounting height of the transponder corresponds essentially to the mounting height of the chip, and the coupling elements are in geometry and size adapted for acting as a dipole antenna or in conjunction with an evaluation unit as a plate capacitor.

Abstract: A data recorder has at least one sensor unit to compile at least one measurement value to be recorded during a monitoring interval, a control unit to control the compiling and recording of measurement data, a clock unit to provide a reference time on the basis of which the actual measurement times can be defined, a memory unit to store the measurement values compiled and the corresponding reference time provided for each measurement value, a battery unit for power supply, a fixation unit to fix the data recorder to an item to be monitored, and an interruption unit which interrupts the recording and/or compiling of measurement data upon any manipulation of the fixation unit.

Abstract: A process is disclosed for producing a semiconductor structure with a highly conductive buried layer with the following steps: an insulating layer is applied to a first surface of a first semiconductor substrate, an insulating layer is applied on a surface of a layer of highly conductive material which is physically separate from the first semiconductor substrate and then the insulation layers are bonded together.